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41. 发明申请

US20070048172A1 Technique for increasing the compliance of tin-indium solders 有权
标题翻译：提高锡铟焊料顺应性的技术
公开(公告)号：US20070048172A1
公开(公告)日：2007-03-01
申请号：US11360812
申请日：2006-02-24
申请人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
发明人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： C22C13/00
CPC分类号： C22C11/06 , B23K35/262 , C22C13/00
摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
摘要翻译：公开了一种提高锡铟焊料顺从性的技术。在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％重量％至少一种稀土元素。

42. 发明申请

US20020063147A1 Anti-tombstoning solder alloys for surface mount applications 有权
标题翻译：用于表面贴装应用的反墓碑焊料合金
公开(公告)号：US20020063147A1
公开(公告)日：2002-05-30
申请号：US09957196
申请日：2001-09-20
申请人： INDIUM CORPORATION OF AMERICA
发明人： Benlih Huang , Ning C. Lee
IPC分类号： B23K031/00
CPC分类号： B23K35/262 , H05K3/3442 , H05K3/3463
摘要： The object of this invention is to employ a solder alloy comprising tin/lead/silver in order to provide a wider solidification range and achieve balance between the surface tensions of both side of a small leadless component. The expanded solidification range slows the melting and wetting time so as to balance the surface tension of the molten solder, and in turn reduces the tombstoning frequency. The preferred Ag concentration is 0.2-0.5% in weight, the more preferred Ag concentration is 0.3-0.4% in weight. For reflow soldering of small leadless components, the pastes made with the alloy compositions of Sn62.6Pb37Ag0.4 and Sn63Pb36.6Ag0.4 results in improvements in tombstoning.
摘要翻译：本发明的目的是使用包含锡/铅/银的焊料合金，以提供更宽的凝固范围，并实现小型无引线部件的两侧的表面张力之间的平衡。膨胀的固化范围减缓熔融和润湿时间，以平衡熔融焊料的表面张力，进而降低墓碑频率。优选的Ag浓度为0.2-0.5重量％，更优选的Ag浓度为0.3-0.4重量％。对于小型无铅组件的回流焊接，用Sn62.6Pb37Ag0.4和Sn63Pb36.6Ag0.4的合金组成制成的糊料导致了墓碑的改进。

43. 发明授权

US4620661A Corrosion resistant lid for semiconductor package 失效
标题翻译：半导体封装防腐盖
公开(公告)号：US4620661A
公开(公告)日：1986-11-04
申请号：US725673
申请日：1985-04-22
申请人： James A. Slatterly
发明人： James A. Slatterly
IPC分类号： H01L21/48 , H01L21/50 , H01L23/06
CPC分类号： H01L21/50 , H01L21/4817 , H01L2224/48247 , H01L2224/49171 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/16195 , H01L2924/3025
摘要： A lid for closing an electronic package that exhibits high resistance to corrosion. The lid includes a metal substrate and a multi-layered protective coating which has low porosity when compared to a single layer coating of the same thickness yet has good soldering properties that enables the lid to be hermetically sealed to the package container. The multi-layer coating includes an initial electroplated layer of nickel followed by a thin interlayer of a noble metal and a second layer of nickel electroplated over noble metal. A top layer of gold is then electroplated over the nickel-noble metal-nickel sandwich to complete the lid structure.
摘要翻译：用于封闭具有高耐腐蚀性的电子封装的盖子。盖子包括金属基底和多层保护涂层，与相同厚度的单层涂层相比，孔隙率低，但具有良好的焊接性能，使盖子能够与包装容器密封。多层涂层包括镍的初始电镀层，随后是贵金属的薄中间层和在贵金属上电镀的第二层镍。然后将顶层金层电镀在镍 - 贵金属 - 镍三明治上，以完成盖结构。

44. 发明公开

US20240342802A1 BUILD PLATE WITH INTERCHANGEABLE INSERT TO REDUCE LIFT-UP DURING METAL 3D PRINTING 审中-公开
公开(公告)号：US20240342802A1
公开(公告)日：2024-10-17
申请号：US18633203
申请日：2024-04-11
申请人： THE INDIUM CORPORATION OF AMERICA
发明人： David P. Socha , Brent Muncy
IPC分类号： B22F12/30 , B33Y30/00
CPC分类号： B22F12/30 , B33Y30/00
摘要： Some implementations of the disclosure are directed to a build plate assembly including a body dimensioned for use in a 3D printing device, and a solid insert of a metal or metal alloy. The body includes an interior cavity formed through a top of the body, and extending to an opening at a first side of the body. The solid insert includes a top surface for forming a 3D printed metal object in the 3D printing device. The solid insert is configured to slidably couple, through the opening at the first side of the body, into the interior cavity of the body.

45. 发明公开

US20240058861A1 MICRO-CAPSULES HAVING AN AMORPHOUS SOLID CORE 审中-公开
公开(公告)号：US20240058861A1
公开(公告)日：2024-02-22
申请号：US18452441
申请日：2023-08-18
申请人： The Indium Corporation of America
发明人： Martin Thuo , Ian Tevis
IPC分类号： B22F1/16 , B22F1/08 , B22F1/17 , B22F1/102 , B23K35/02
CPC分类号： B22F1/16 , B22F1/08 , B22F1/17 , B22F1/102 , B23K35/025
摘要： A particle comprises an amorphous solid metallic core enclosed within a metal-oxide shell. The amorphous solid metallic core includes one or more metals and is below a glass transition temperature of the one or more metals. The particle further comprises one or more regions having a crystalline or semi-crystalline structure disposed within the amorphous solid metallic core.

46. 发明授权

US07593228B2 Technique for forming a thermally conductive interface with patterned metal foil 有权
标题翻译：用图形金属箔形成导热界面的技术
公开(公告)号：US07593228B2
公开(公告)日：2009-09-22
申请号：US11552908
申请日：2006-10-25
申请人： Robert N. Jarrett , Craig K. Merritt
发明人： Robert N. Jarrett , Craig K. Merritt
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.
摘要翻译：公开了一种用图案化金属箔形成导热界面的技术。在一个特定的示例性实施例中，该技术可以被实现为具有至少一个图案化表面的导热金属箔，用于促进从至少一个集成电路器件到至少一个散热器的散热。金属箔优选具有特征成形性和柔软性，其可以列举铅，铟，锡和其它可锻金属的合金，和/或包含至少一种可延展的金属合金层的复合材料。

47. 发明申请

US20070092396A1 Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver 有权
标题翻译：增加含银无铅焊料的合规性的技术
公开(公告)号：US20070092396A1
公开(公告)日：2007-04-26
申请号：US11550640
申请日：2006-10-18
申请人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
发明人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/3006
摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.
摘要翻译：公开了一种提高含银无铅焊料柔顺性的技术。在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

48. 发明授权

US07017795B2 Solder pastes for providing high elasticity, low rigidity solder joints 有权
标题翻译：焊膏用于提供高弹性，低刚性焊点
公开(公告)号：US07017795B2
公开(公告)日：2006-03-28
申请号：US10954570
申请日：2004-10-01
申请人： Yan Liu , Derrick Herron , Ning-Cheng Lee
发明人： Yan Liu , Derrick Herron , Ning-Cheng Lee
IPC分类号： B23K35/12
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/26 , B23K35/302 , B23K35/3612 , B23K2101/36 , H05K3/3484 , H05K2201/0215
摘要： Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
摘要翻译：公开了用于提供高弹性，低刚性焊点的焊膏。焊膏可以用于其热膨胀系数不匹配的两个部件和/或当两个部件被焊接在一起时机械变形的可能性很高的两个部件之间。在一个具体的示例性实施例中，焊膏可以实现为包含焊料粉末和具有焊剂的高熔点温度颗粒的组合物，其中焊料粉末和高熔点温度颗粒之间的比例可以在2:1和1:10之间。

49. 发明授权

US5957364A Integrated solder preform array having a tin outer coating 失效
标题翻译：具有锡外涂层的集成焊料预制件阵列
公开(公告)号：US5957364A
公开(公告)日：1999-09-28
申请号：US661179
申请日：1996-06-10
申请人： Paul A. Socha
发明人： Paul A. Socha
IPC分类号： B23K35/02 , B23K35/14 , H05K3/34 , B23K35/22
CPC分类号： H05K3/3478 , B23K35/0222 , H05K2201/0305 , H05K2201/10424 , H05K2203/0415 , H05K2203/0435 , H05K3/3447
摘要： An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.
摘要翻译：集成的焊料预制件阵列由适用于焊接或焊接工艺的金属或金属合金构成。预型件包括设置在所需矩阵中的一系列离散焊料岛。每个岛包含用于接收销的孔和用于将每个所述岛连接成矩阵的桥接线。桥接线由与岛状物相同的焊料材料形成，其中焊料预制件在其整个外表面上含有基本上均匀的锡涂层，以改善焊料润湿并因此消除电路和其它电气部件的不需要的短路焊接。

50. 发明授权

US5455004A Lead-free alloy containing tin, zinc, indium and bismuth 失效
标题翻译：含锡，锌，铟和铋的无铅合金
公开(公告)号：US5455004A
公开(公告)日：1995-10-03
申请号：US264186
申请日：1994-06-22
申请人： James A. Slattery , John R. Sovinsky
发明人： James A. Slattery , John R. Sovinsky
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02
CPC分类号： C22C13/00 , B23K35/262
摘要： A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.
摘要翻译：适用于焊接的无铅合金，包括约82％至约90％的锡，约4.5％至约6％的锌，约3.5％至约6％的铟和约1％至约5％的铋。合金的熔融温度优选低于190℃，合金优选具有小于10℃的糊状范围。

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