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41. 发明申请

WO2009051317A1 MEMS MICROPHONE PACKAGE 审中-公开
标题翻译： MEMS麦克风包装
公开(公告)号：WO2009051317A1
公开(公告)日：2009-04-23
申请号：PCT/KR2008/001862
申请日：2008-04-03
申请人： BSE CO., LTD. , SONG, Chung-Dam
发明人： SONG, Chung-Dam
IPC分类号： H04R1/04
CPC分类号： H04R19/005 , H04R1/02
摘要： Provided is a micro electro mechanical system (MEMS) microphone package. In the MEMS microphone package, a PCB on which a MEMS microphone chip is mounted is inserted into a metal case. The metal case is directly attached to a main board using an assembling process in which an end portion of the metal case is bent and clamped to shield the MEMS microphone chip from a nose, thereby significantly improving an acoustic quality and reducing manufacturing costs. The end portion of the metal case having a square shape is chamfered such that a curling process is performed in the microphone having a square shape. A support member is disposed to provide a space between the PCB on which the MEMS microphone chip is mounted and the metal case. Such a MEMS microphone package includes: a metal case in which edges of an opened end portion are chamfered to easily perform a curling process in a square box shape in which one surface is opened to insert components through the opened surface; a PCB on which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB being inserted into the metal case; and a support member supporting the PCB to provide a space between the metal case and the PCB.
摘要翻译：提供了一种微机电系统（MEMS）麦克风封装。在MEMS麦克风封装中，安装有MEMS麦克风芯片的PCB被插入到金属外壳中。金属外壳使用组装工艺直接附接到主板，其中金属外壳的端部弯曲和夹紧以将MEMS麦克风芯片从鼻子上屏蔽，从而显着提高声学质量并降低制造成本。具有正方形形状的金属壳体的端部被倒角，使得在具有正方形形状的麦克风中进行卷边处理。设置支撑构件以在其上安装MEMS麦克风芯片的PCB与金属外壳之间提供空间。这样的MEMS麦克风封装包括：金属外壳，其中开口端部的边缘被倒角以容易地进行方形盒形状的卷曲处理，其中一个表面被打开以通过开口表面插入部件; 其上安装有MEMS麦克风芯片和专用集成电路（ASIC）芯片的PCB，PCB插入到金属外壳中; 以及支撑所述PCB以在所述金属外壳和所述PCB之间提供空间的支撑构件。

42. 发明申请

WO2007136163A1 MOUNTING METHOD AND HOLDER FOR SMD MICROPHONE 审中-公开
标题翻译：贴片麦克风的安装方法和保持器
公开(公告)号：WO2007136163A1
公开(公告)日：2007-11-29
申请号：PCT/KR2006/005866
申请日：2006-12-29
申请人： BSE CO., LTD , KIM, Chang-Won , LEE, Sang-Ho
发明人： KIM, Chang-Won , LEE, Sang-Ho
IPC分类号： H04R1/02
CPC分类号： H04R19/016 , H04R31/00 , Y10T29/4913
摘要： Provided are a method of mounting an SMD (surface mounted device) condenser microphone using an SMD method on a mainboard of an electronic device, and a suitable SMD microphone holder for the SMD condenser microphone. The SMD microphone holder is capable of having an SMD microphone mounted within, and includes a cap body and a cylindrical portion. The cap body is formed of a high heat resistant material capable of withstanding a reflow temperature, and defines a cavity for mounting the SMD microphone therein. The cylindrical portion is annula r and integrally formed with the cap body, and formed of a high heat resistant material capable of withstanding a reflow temperature. The cap body includes a center hole a tool contacting surface, and a shock absorbing protrusion. The center hole, through which sound from an outside enters, is formed in a center of an upper surface of the cap body. The tool contacting surface is formed around the center hole, to facilitate use of a vacuum tool during a mounting of the SMD microphone. The shock absorbing protrusion is formed on an upper, inner perimeter surface of the cap body in a radial direction about the center hole, to avert direct surface friction between the cap body and a sound hole of the SMD microphone when the vacuum tool is used. Because a mobile phone manufacturer does not have to assemble the SMD condenser microphone with the microphone holder, the assembly process is shortened, as are manufacturing time and cost.
摘要翻译：提供了一种在电子设备的主板上安装使用SMD方法的SMD（表面安装器件）电容式麦克风的方法，以及用于SMD电容式麦克风的合适的SMD麦克风支架。 SMD麦克风支架能够安装SMD麦克风，并包括盖体和圆柱形部分。盖体由能够承受回流温度的高耐热材料形成，并且在其中限定用于安装SMD麦克风的空腔。圆柱形部分是环形的并且与帽体整体形成，并且由能够承受回流温度的高耐热材料形成。盖体包括工具接触表面的中心孔和减震突起。从外部进入的声音的中心孔形成在帽体的上表面的中心。工具接触表面围绕中心孔形成，以便于在安装SMD麦克风期间使用真空工具。冲击吸收突起形成在帽体的上部内周表面上，围绕中心孔沿半径方向，以在使用真空工具时避免帽体与SMD麦克风的声孔之间的直接表面摩擦。由于手机制造商不必将SMD电容麦克风与麦克风支架组装在一起，装配过程也缩短了，制造时间和成本也随之缩短。

43. 发明申请

WO2007029907A1 A CONDENSER MICROPHONE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：冷凝器麦克风及其制造方法
公开(公告)号：WO2007029907A1
公开(公告)日：2007-03-15
申请号：PCT/KR2006/000390
申请日：2006-02-03
申请人： BSE CO., LTD , PARK, Sung-ho
发明人： PARK, Sung-ho , ROH, Kwan-wook
IPC分类号： H04R19/04
CPC分类号： H04R31/006 , H04R19/04
摘要： Disclosed are a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone. The manufacturing method comprises the steps of inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened, aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack- welding, and curing the adhesive. The metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case.
摘要翻译：公开了一种电容麦克风，其具有用于执行壳体和PCB的定位焊接，然后用粘合剂粘合的结构，以及用于电容式麦克风的制造方法。该制造方法包括以下步骤：将具有绝缘性的隔膜，隔板，背板，具有导电性的绝缘基底和具有导电性的导电基底插入到具有打开的一侧的中空型壳体中，使壳体的端部对齐 PCB的连接图案和焊接它们; 在粘合后用粘合剂将外壳和PCB之间的连接部分粘合，并固化粘合剂。安装有电容麦克风部件的金属外壳直接粘接在PCB上，然后外壳和PCB通过粘合剂粘合而不用卷边工艺将PCB插入金属外壳中，然后将外壳的一端弯曲。

44. 发明申请

WO2007024047A1 ELECTRET CONDENSER MICROPHONE 审中-公开
标题翻译：电话冷凝器麦克风
公开(公告)号：WO2007024047A1
公开(公告)日：2007-03-01
申请号：PCT/KR2006/000387
申请日：2006-02-03
申请人： BSE CO., LTD , SONG, Chung-Dam
发明人： SONG, Chung-Dam
IPC分类号： H04R19/04
CPC分类号： H04R19/016
摘要： Disclosed is an electret condenser microphone comprising: a case which is formed with a sound hole on a bottom surface thereof; an insulating base which is mounted in the case to contact the bottom surface of the case; a vibration plate which is electrically connected with the bottom surface of the case and is vibrated according to a sound pressure inputted through the sound hole; a spacer to form a gap; a back plate which faces the vibration plate with the spacer interposed therebetween, the back plate having an electret which is formed by adhering a high molecular film to an external side of a metal plate; a conductive base conducting the back plate and allowing the supporting part to support a PCB in a curling process; and the PCB whereby the conductive base supports the PCB when curling an opened end of the case after inserting the parts into the case.
摘要翻译：公开了一种驻极体电容麦克风，包括：在其底面上形成有声孔的壳体; 绝缘基座，其安装在壳体中以接触壳体的底表面; 振动板，其与壳体的底面电连接，并且根据通过声孔输入的声压而振动; 间隔物形成间隙; 所述背板与所述隔板相对的所述振动板，所述背板具有驻极体，所述驻极体通过将高分子膜粘附到金属板的外侧而形成; 导电底座，其导引背板并允许支撑部件在卷曲过程中支撑PCB; 和PCB，由此当将部件插入壳体之后，当卷曲外壳的开口端时，导电基座支撑PCB。

45. 发明申请

WO2007015593A1 SILICON BASED CONDENSER MICROPHONE AND PACKAGING METHOD FOR THE SAME 审中-公开
标题翻译：基于硅的冷凝器麦克风及其包装方法
公开(公告)号：WO2007015593A1
公开(公告)日：2007-02-08
申请号：PCT/KR2006/000384
申请日：2006-02-03
申请人： BSE CO., LTD , SONG, Chung-Dam
发明人： SONG, Chung-Dam
IPC分类号： H04R19/04
CPC分类号： H04R19/04
摘要： Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric pressure pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone comprises the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.
摘要翻译：公开了一种基于硅的电容式麦克风和用于硅基电容麦克风的封装方法。基于硅的电容麦克风包括金属外壳和安装有MEMS麦克风芯片的板和具有电压泵和缓冲IC的ASIC芯片，并且形成有用于与金属外壳接合的连接图案，其中连接图案焊接到金属外壳。用于封装硅基电容式麦克风的方法包括以下步骤：输入安装有MEMS芯片和ASIC芯片并且具有连接图案的板; 输入金属外壳，将金属外壳对准板的连接图案，并将金属外壳的开口端焊接到电路板的连接图案上。因此，金属壳体通过激光焊接到板上。

46. 发明申请

WO2007007929A1 PACKAGING STRUCTURE OF SILICON CONDENSER MICROPHONE AND METHOD FOR PRODUCING THEREOF 审中-公开
标题翻译：硅冷凝器麦克风的包装结构及其生产方法
公开(公告)号：WO2007007929A1
公开(公告)日：2007-01-18
申请号：PCT/KR2005/002626
申请日：2005-08-11
申请人： BSE CO., LTD. , PARK, Sung Ho , LIM, Jun
发明人： PARK, Sung Ho , LIM, Jun
IPC分类号： H04R19/04
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a packaging of a silicon condenser microphone and method for manufacturing the same. The packaging structure of a silicon condenser microphone of the present invention comprises a substrate having an upper surface for disposing the silicon condenser microphone and a circuit unit thereon, the substrate having a back chamber therein, the substrate including an air hole for an air to pass through between the upper surface for disposing the silicon condenser microphone and the back chamber; and a casing covering the silicon condenser microphone and the circuit unit disposed on the upper surface of the substrate for protection thereof. The method for manufacturing a packaging structure of a silicon condenser microphone of the present invention comprises steps of: (a) forming a substrate having a back chamber therein, wherein the substrate includes an air hole for an air to pass through between an upper surface of the substrate, the air hole disposed at a portion of the upper surface where the silicon condenser microphone and a circuit unit is to be disposed; (b) bonding the silicon condenser microphone and the circuit unit to the upper surface of the substrate; and (c) covering the silicon condenser microphone and the circuit unit with a casing to protect the silicon condenser microphone and the circuit unit.
摘要翻译：本发明涉及硅电容麦克风的封装及其制造方法。本发明的硅电容麦克风的封装结构包括具有用于设置硅电容麦克风的上表面的基板和其上的电路单元，该基板在其中具有后室，该基板包括用于空气通过的空气孔通过用于布置硅电容麦克风的上表面和后室; 以及覆盖硅电容麦克风的外壳和设置在基板的上表面上的电路单元，用于保护其。本发明的硅电容麦克风的封装结构的制造方法包括以下步骤：（a）在其中形成具有后室的基板，其中所述基板包括用于空气通过的空气孔，所述空气孔在所述基板，设置在所述硅电容麦克风和电路单元的上表面的一部分的空气孔; （b）将硅电容麦克风和电路单元接合到基板的上表面; 和（c）用壳体覆盖硅电容麦克风和电路单元，以保护硅电容麦克风和电路单元。

47. 发明申请

WO2006098537A1 CURLING METHOD FOR CONDENSER MICROPHONE 审中-公开
标题翻译：冷凝器麦克风的凝固方法
公开(公告)号：WO2006098537A1
公开(公告)日：2006-09-21
申请号：PCT/KR2005/002622
申请日：2005-08-11
申请人： BSE CO., LTD. , SONG, Chung Dam
发明人： SONG, Chung Dam
IPC分类号： H04R19/04
CPC分类号： H04R31/006 , H04R1/06 , H04R19/016 , H04R2499/11
摘要： The present invention relates to a method for manufacturing a condenser microphone, and in particular, to a curling method of a condenser microphone wherein a connection performance between a curled surface of a casing and a PCB is improved to enhance a sound quality. The method of the present invention comprises steps of (a) sequentially stacking predetermined components in a casing and then stacking a PCB; (b) curling an end portion of the casing inward toward the PCB; and (c) bonding a curled surface of the casing formed in the step (b) to the PCB by welding or soldering at least one contacting portions of the curled surface and the PCB. The curling method of the condenser microphone in accordance with the present invention provides an effect wherein a curled surface of a casing and a PCB surface are welded or soldered together during a curling process to improve an electrical contact characteristic and a sound quality.
摘要翻译：本发明涉及一种用于制造电容麦克风的方法，特别涉及一种电容麦克风的卷曲方法，其中壳体的卷曲表面和PCB之间的连接性能得到改善以提高声音质量。本发明的方法包括以下步骤：（a）顺序地将外壳中的预定部件堆叠，然后堆叠PCB; （b）将壳体的端部向内卷曲到PCB; 和（c）通过焊接或焊接卷曲表面和PCB的至少一个接触部分将步骤（b）中形成的壳体的卷曲表面结合到PCB。根据本发明的电容麦克风的卷曲方法提供了一种效果，其中在卷曲过程中将壳体和PCB表面的卷曲表面焊接或焊接在一起以改善电接触特性和声音质量。

48. 发明申请

WO2006088277A1 ELECTRET CONDENSER MICROPHONE ASSEMBLY FOR SMD 审中-公开
标题翻译：电子冷凝器麦克风组件用于SMD
公开(公告)号：WO2006088277A1
公开(公告)日：2006-08-24
申请号：PCT/KR2005/002616
申请日：2005-08-11
申请人： BSE Co., Ltd. , SONG, Chung Dam , CHUNG, Eek Joo , PARK, Sung Ho , LIM, Jun
发明人： SONG, Chung Dam , CHUNG, Eek Joo , PARK, Sung Ho , LIM, Jun
IPC分类号： H04R19/04
CPC分类号： H04R19/016 , H05K1/181
摘要： The present invention relates to anelectret condenser microphone assembly for SMD which may be easily mounted on and unmounted from a main PCB. An electret condenser microphone assembly for SMD in accordance with the present invention comprises a microphone capsule for SMD, at least one positive extension terminal for connecting a positive connection terminal of the microphone capsule for SMD to a positive connection pattern of the main PCB, the positive extension terminal extruding above the microphone capsule for SMD, and at least one negative extension terminal for connecting a negative connection terminal of the microphone capsule for SMD to a negative connection pattern of the main PCB, the negative extension terminal extruding above the microphone capsule for SMD. Therefore, since the electret condenser microphone assembly for SMD in accordance with the present invention may adaptively correspond to a connection pattern of the main PCB having the microphone mounted thereon, the assembly may be mounted on various applied products, and may easily be replaced by heating the extruding portion with a solder without heating the microphone capsule.
摘要翻译：本发明涉及一种用于SMD的聚光式电容麦克风组件，其可以容易地安装在主PCB上并从主PCB上卸下。根据本发明的用于SMD的驻极体电容传声器组件包括用于SMD的麦克风胶囊，至少一个正延伸端子，用于将用于SMD的麦克风胶囊的正极连接端子连接到主PCB的正极连接图案，正极延伸端子挤压在用于SMD的麦克风胶囊上方，以及至少一个负极延长端子，用于将用于SMD的麦克风胶囊的负极连接端子连接到主PCB的负连接图案，负极延伸端子挤出用于SMD的麦克风胶囊。因此，由于根据本发明的用于SMD的驻极体电容传声器组件可以适应性地对应于安装有麦克风的主PCB的连接图案，所以该组件可以安装在各种应用的产品上，并且可以容易地被加热该挤压部分具有焊料，而不加热麦克风胶囊。

49. 发明申请

WO2005069681A1 A CONDENSER MICROPHONE MOUNTABLE ON MAIN PCB 审中-公开
标题翻译：可在主PCB上安装的冷凝器麦克风
公开(公告)号：WO2005069681A1
公开(公告)日：2005-07-28
申请号：PCT/KR2004/002526
申请日：2004-10-01
申请人： BSE CO., LTD , SONG, Cheong-Dam
发明人： SONG, Cheong-Dam
IPC分类号： H04R19/04
CPC分类号： H04R1/06 , H04R19/04 , H05K1/181 , H05K2201/09072 , H05K2201/10083 , Y02P70/611
摘要： A condenser microphone mountable on a main PCB is disclosed. The condenser microphone of the present invention comprises a cylinder-shaped case having one side which is opened and the other side which is closed; a first metal ring inserted into the case for an electrical connection; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a ring-shaped spacer; a cylinder-shaped insulating ring having an open top part and an open bottom part to provide an electrical insulation and a mechanical support; a diaphragm inserted into the insulating ring and facing to the back plate while interposing the spacer between the diaphragm and the back plate; a second metal ring for being connected electrically to the diaphragm and supporting mechanically the diaphragm; and a PCB that is mounted with electronic components and is formed with a sound hole, the PCB being connected to the back plate through the second metal ring and the case, the PCB including connection terminals connected to the outside. Accordingly, the condenser microphone maintains the sound quality in a good state since the sound wave transfer path is short even if the component mount region of the main PCB on which the condenser microphone is mounted is directed toward an inner side of the electronic product at need.
摘要翻译：公开了可安装在主PCB上的电容式麦克风。本发明的电容麦克风包括：一个开口的一侧的圆筒形壳体，另一侧是封闭的; 插入壳体中用于电连接的第一金属环; 具有通过第一金属环与壳体电连接的声孔的盘形背板; 环形间隔物; 具有开口顶部和开口底部的圆柱形绝缘环，以提供电绝缘和机械支撑; 隔膜插入绝缘环并面向后板，同时将间隔件插入隔膜和背板之间; 第二金属环，用于与隔膜电连接并机械地支撑隔膜; 和安装有电子部件并形成有声孔的PCB，PCB通过第二金属环和壳体连接到背板，PCB包括连接到外部的连接端子。因此，电容麦克风保持声音质量良好的状态，因为即使安装了电容式麦克风的主PCB的部件安装区域朝向需要的电子产品的内侧，声波传输路径短。

50. 发明申请

WO2005013641A1 SURFACE MOUNTABLE ELECTRET CONDENSER MICROPHONE 审中-公开
标题翻译：表面安装电话冷凝器麦克风
公开(公告)号：WO2005013641A1
公开(公告)日：2005-02-10
申请号：PCT/KR2003/001758
申请日：2003-08-29
申请人： BSE CO., LTD. , SONG, Chung-Dam , CHUNG, Eek-Joo , KIM, Hyun-Ho , PARK, Sung-Ho
发明人： SONG, Chung-Dam , CHUNG, Eek-Joo , KIM, Hyun-Ho , PARK, Sung-Ho
IPC分类号： H04R1/04
CPC分类号： H04R19/016 , H04R1/06
摘要： Disclosed is an electret condenser microphone capable of surface mounting which has a structure highly resistant to high temperature. The electret condenser microphone comprises a case, a polar ring, a diaphragm, a spacer, a back-plate, a first base, a second base and a printed circuit board (PCB), wherein the first base surrounds the diaphragm, the spacer and the back-plate, so that the first base prevents characteristics of an electret formed on any one of the diaphragm and the back-plate from being deteriorated in a reflow process for surface mounting. Further, in order to prevent sensitivity of the electret condenser microphone from being lowered due to decrease of an electrical potential value of the electret in the reflow process. High gain IC devices are used. The electret condenser microphone capable of surface mounting can be obtained by, first, using main components made from a high-temperature resistant insulating material, for example, a polymer-, a plastic- or a fluoro resin-based material, second, constructing the fist base to surround acoustic based components, third, using a cream solder for high temperature to bond components to the PCB, fourth, using the high gain IC devices, fifth, providing the connecting terminal with gas discharge grooves and protruding the connecting terminal to be higher than a curled surface of the electret condenser microphone.
摘要翻译：公开了一种能够表面安装的驻极体电容麦克风，其具有高度耐高温的结构。驻极体电容麦克风包括壳体，极环，隔膜，间隔件，背板，第一基座，第二基座和印刷电路板（PCB），其中第一基座围绕隔膜，间隔件和背板，使得第一基座防止形成在隔膜和背板中的任何一个上的驻极体的特性在用于表面安装的回流工艺中劣化。此外，为了防止驻极体电容麦克风的灵敏度由于回流工艺中驻极体的电位值的降低而降低。使用高增益IC器件。能够通过以下方式获得能够进行表面安装的驻极体电容麦克风：首先，使用由耐高温绝缘材料制成的主要组分，例如聚合物，基于塑料或氟树脂的材料，第二，构建围绕声学元件的第一基地，第三，使用高温焊膏将部件粘合到PCB上;第四，使用高增益IC器件;第五，为连接端子提供气体放电槽，并将连接端子突出为高于驻极体电容麦克风的卷曲表面。

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