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    • 41. 发明授权
    • Method of fabricating a field emission device
    • 制造场致发射器件的方法
    • US5675210A
    • 1997-10-07
    • US509461
    • 1995-07-31
    • Jong-min Kim
    • Jong-min Kim
    • H01J9/02H01J1/30H01J1/304
    • H01J1/3042
    • A method of fabricating a field emission device which can facilitate the formation of a micro-tip for emitting electrons by a field effect. The micro-tip is fabricated such that the etching rate differences among the tungsten cathode, the lower titanium adhesive layer and the upper aluminum mask, and the internal stress differences are made to be very large, and thus, tungsten micro-tip is protruded by the internal stress when the adhesive layer and the mask are instantaneously etched. Since the micro-tip size is easily adjusted, and the internal stress of tungsten and characteristics of BOE method are utilized throughout the fabricating process, the reproducibility is ensured.
    • 一种制造场致发射器件的方法,该场致发射器件可以促进形成用于通过场效应发射电子的微尖端。 微尖端被制造成使得钨阴极,下钛粘合剂层和上铝掩模之间的蚀刻速率差和内部应力差非常大,因此钨微尖端突出 当粘合剂层和掩模被瞬时蚀刻时的内部应力。 由于微尖尺寸容易调整,并且在整个制造过程中利用了钨的内部应力和BOE方法的特性,因此确保了再现性。