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41. 发明授权

US6166430A Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device 有权
标题翻译：引线框架，框架制造方法，树脂模制半导体器件及其制造方法
公开(公告)号：US6166430A
公开(公告)日：2000-12-26
申请号：US244073
申请日：1999-02-04
申请人： Yukio Yamaguchi
发明人： Yukio Yamaguchi
IPC分类号： H01L23/50 , H01L23/31 , H01L23/495
CPC分类号： H01L24/06 , H01L23/3121 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/49171 , H01L2224/85001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00012
摘要： The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip is mounted; a die pad disposed inside the opening; and a plastic film adhered to respective lower surfaces of the die pad, the outer frame and the signal-connecting leads. This lead frame is not provided with support leads and the die pad is indirectly supported by the outer frame with the plastic film. Since no support leads are provided, the size of an installable semiconductor chip can be enlarged and the overall size of a semiconductor device can be reduced.
摘要翻译：本发明的引线框架包括：具有开口的外框架; 由外部和信号连接引线组成的多个引线，并且在开口内从外部框架延伸到安装半导体芯片的区域; 设置在所述开口内的管芯焊盘; 以及粘合到芯片焊盘，外框架和信号连接引线的相应下表面的塑料膜。该引线框架不设置有支撑引线，并且芯片垫由塑料膜由外框架间接支撑。由于没有提供支撑引线，所以可以扩大可安装的半导体芯片的尺寸，并且可以减小半导体器件的整体尺寸。

42. 发明授权

US6081029A Resin encapsulated semiconductor device having a reduced thickness and improved reliability 有权
标题翻译：树脂封装的半导体器件具有减小的厚度并提高可靠性
公开(公告)号：US6081029A
公开(公告)日：2000-06-27
申请号：US244074
申请日：1999-02-04
申请人： Yukio Yamaguchi
发明人： Yukio Yamaguchi
IPC分类号： H01L23/50 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/36
CPC分类号： H01L23/49544 , H01L21/561 , H01L23/3121 , H01L23/49548 , H01L23/49551 , H01L2224/32014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01028 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/1305 , H01L2924/181 , H01L2924/18301
摘要： A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to each other with metal fine wires. And these members are encapsulated in a resin encapsulant. The back surface of the die pad is subjected to half etching or the like to form a convex portion and a flange portion surrounding the convex portion. Since a thin layer of the resin encapsulant exists under the flange portion, the resin encapsulant can hold the die pad more strongly and the moisture resistance of the device can be improved with the lower surface of the die pad protruding from the resin encapsulant. As a result, the characteristics of a resin-molded semiconductor device having a die pad exposed on the back surface of a resin encapsulant can be improved.
摘要翻译：提供了包括信号连接引线，管芯焊盘和支撑引线的引线框架。半导体芯片用粘合剂结合到芯片焊盘。半导体芯片，电极焊盘和信号连接引线通过金属细线彼此电连接。并且这些构件被包封在树脂密封剂中。对芯片焊盘的背面进行半蚀刻等，以形成凸部和围绕凸部的凸缘部。由于树脂密封剂薄层存在于凸缘部分下方，所以树脂密封剂可以更牢固地保持模具垫，并且可以通过模头垫的下表面从树脂密封剂突出来改善装置的耐湿性。结果，可以提高在树脂密封剂的背面露出裸片的树脂模制半导体器件的特性。

43. 发明授权

US5642970A Method of producing a curved groove in a workpiece 失效
标题翻译：在工件中产生弯曲槽的方法
公开(公告)号：US5642970A
公开(公告)日：1997-07-01
申请号：US638483
申请日：1996-04-26
申请人： Yukio Yamaguchi , Masaaki Enya , Takahiro Yamazaki , Tatsuo Miura
发明人： Yukio Yamaguchi , Masaaki Enya , Takahiro Yamazaki , Tatsuo Miura
IPC分类号： B23C3/32 , B23C3/34 , F04C18/02 , B23C3/00 , B23P15/00
CPC分类号： B23C3/34 , F04C18/0284 , F04C2230/10 , Y10T29/4924 , Y10T409/303808
摘要： A method of producing, in a workpiece such as a spiral member of a scroll element, a curved groove for receiving a mechanical seal by using a milling cutter, especially, an end mill. A relative feed in a given direction "A" is provided between the milling cutter and the work, and the milling cutter rotating in a predetermined direction "B" about an axis of rotation thereof is set so that the milling cutter provides an inner side wall of the curved groove with respect to a center of curvature of the curved groove with an up milling in which the direction "B" is directed against the direction "A", and that the milling cutter provides an outer side wall of the curved groove confronting the inner side wall with a down milling in which the direction "B" is directed toward the direction "A", in order to suppress formation of coarse and rough surface on both the inner and outer side wall of the curved groove. Thus, the width of the curved groove can be constantly accurate over an entire length of the groove.
摘要翻译：在诸如涡旋元件的螺旋构件的工件中，通过使用铣刀特别是立铣刀来产生用于接收机械密封的弯曲槽的方法。在铣刀和工件之间提供给定方向“A”的相对进给，并且围绕其旋转轴线沿预定方向“B”旋转的铣刀被设定为使得铣刀提供内侧壁相对于弯曲凹槽的曲率中心的曲线槽的上铣削，其中方向“B”指向方向“A”，并且铣刀提供面对的弯曲凹槽的外侧壁为了抑制在曲线槽的内侧壁和外侧壁上形成粗糙粗糙的表面，具有向下铣削的内侧壁，其中方向“B”朝向方向“A”。因此，弯曲槽的宽度可以在凹槽的整个长度上恒定地精确。

44. 发明授权

US5630684A Method for machining a scroll member 失效
标题翻译：滚动件加工方法
公开(公告)号：US5630684A
公开(公告)日：1997-05-20
申请号：US428295
申请日：1995-04-25
申请人： Yukio Yamaguchi , Junichi Iio , Norio Suzuki , Kouji Mikami , Masaaki Enya , Yukihisa Tsuchimoto , Yasuhiro Miura , Tomomi Ohno
发明人： Yukio Yamaguchi , Junichi Iio , Norio Suzuki , Kouji Mikami , Masaaki Enya , Yukihisa Tsuchimoto , Yasuhiro Miura , Tomomi Ohno
IPC分类号： B23C3/12 , B23C3/32 , B23C3/34 , B23C5/02 , F04C18/02 , B23C1/00
CPC分类号： B23C3/34 , F04C18/0284 , F04C2230/10 , Y10T29/4924 , Y10T409/303808
摘要： A method for machining a groove in a sealing member and the edges of the groove. A tool 24 is formed with a top portion 24 having cutter sections 23A, each defining a cutting edge 23 for machining a groove in a scroll wall of a scroll member, and a tapered part 25 having cutter sections 26A, each defining a cutting edge 26 for bevelling the edges of the groove and the edges of the scroll wall. The groove 9 and edges 11 are simultaneously machined.
摘要翻译：一种用于加工密封件中的槽和槽的边缘的方法。工具24形成有具有切割器部分23A的顶部24，每个切割器部分23A限定用于在涡旋件的涡旋壁中加工凹槽的切割边缘23和具有切割器部分26A的锥形部分25，每个切割器部分限定切割边缘26 用于斜切槽的边缘和涡旋壁的边缘。槽9和边缘11同时加工。

45. 发明授权

US5264726A Chip-carrier 失效
标题翻译：芯片载体
公开(公告)号：US5264726A
公开(公告)日：1993-11-23
申请号：US962074
申请日：1992-10-16
申请人： Yukio Yamaguchi , Mutsuo Tsuji
发明人： Yukio Yamaguchi , Mutsuo Tsuji
IPC分类号： H01L23/053 , H01L23/16 , H01L23/556 , H01L23/02 , H01L23/12
CPC分类号： H01L23/053 , H01L23/16 , H01L23/556 , H01L24/01 , H01L2224/73253 , H01L2924/01014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152
摘要： In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC chip being directed toward the chip-carrier substrate, an .alpha.-ray shielding film made of film material containing few radioactive elements, and adhered to a surface of the chip-carrier substrate facing the IC chip or to the circuit surface of the IC chip is provided for protecting the IC chip from the IC chip.
摘要翻译：在设置有芯片载体基板，芯片载体盖和IC芯片的芯片载体中，所述IC芯片布置在与IC芯片的朝向芯片载体基板的电路表面一定距离处，包含少量放射性元素的薄膜材料制成的并且贴在面向IC芯片的芯片载体衬底或IC芯片的电路表面的表面屏蔽膜用于保护IC芯片免受IC芯片的影响。

46. 发明授权

US5177711A Object detecting switch device 失效
标题翻译：物体检测开关装置
公开(公告)号：US5177711A
公开(公告)日：1993-01-05
申请号：US685801
申请日：1991-04-16
申请人： Yukio Yamaguchi , Atsushi Kawano , Hideyuki Suzaki , Hiroshi Shimamoto
发明人： Yukio Yamaguchi , Atsushi Kawano , Hideyuki Suzaki , Hiroshi Shimamoto
IPC分类号： G01S15/04 , G01S15/18
CPC分类号： G01S15/18 , G01S15/04 , Y10S367/901 , Y10S367/903
摘要： This switch device for detecting an object comprises a transducer for emitting and receiving ultrasonic signals to and from an object, a transmitter for driving the transducer, a receiver for receiving a signal from the transducer, a gate for detecting a short-distant object, a gate for detecting a long-distant object, and a circuit for setting the timings of the gates in accordance with the detecting ranges of the object.Another switch device is disclosed for detecting an object which comprises a transducer for emitting and receiving ultrasonic signals to and from an object, a transmitter for driving the transducer, a receiver for receiving a signal from the transducer, a suppression gate for preventing detection of a reflected ultrasonic pulse during the transducer residual vibration period, a detectable distance gate for determining the range of detectable distances, an amplitude comparator for preventing detection of reflected ultrasonic pulses having an amplitude below a threshold value, and a plurality of window pulses for enabling detection of a reflected ultrasonic pulses at various distances.
摘要翻译：用于检测物体的开关装置包括用于向物体发射和接收超声波信号的换能器，用于驱动换能器的发射器，用于从换能器接收信号的接收器，用于检测短距离物体的门，用于检测远距离物体的门，以及用于根据物体的检测范围来设定门的定时的电路。公开了用于检测物体的另一开关装置，其包括用于向物体发射和接收超声波信号的换能器，用于驱动换能器的发射器，用于接收来自换能器的信号的接收器，用于防止检测到在换能器残余振动周期期间反射的超声波脉冲，用于确定可检测距离的范围的可检测距离门，用于防止检测具有低于阈值的振幅的反射超声波脉冲的振幅比较器，以及多个窗口脉冲，在不同距离的反射超声波脉冲。

47. 发明授权

US4267853A Self-closing gas pipes and pipe joints 失效
标题翻译：自闭式气管和管接头
公开(公告)号：US4267853A
公开(公告)日：1981-05-19
申请号：US877566
申请日：1978-02-13
申请人： Yukio Yamaguchi , Kenji Ishihara , Kikuo Yonekura
发明人： Yukio Yamaguchi , Kenji Ishihara , Kikuo Yonekura
IPC分类号： F16K17/38 , C01B31/04
CPC分类号： F16K17/383 , Y10T137/1624 , Y10T137/1963
摘要： A gas pipe including a tube of expansible material defining a passage for gas and capable of expansion, when heated, to close the passage upon carbonization. The tube is surrounded by a cylindrical noninflammable member.A joint for connecting gas pipes which includes a tube of expansible material contained in a metallic tubular member and defining a passage for gas. The tube is capable of expansion, when heated, to close the passage upon carbonization.A method of manufacturing thermally expansible rubber tube for the gas pipe and the gas pipe joint. About 2 to 30 parts by weight of oxidized, thermally expansible graphite powder is mixed with 100 parts by weight of raw rubber, and a predetermined quantity of a curing agent and a cure accelerator are added to the rubber and graphite mixture, followed by its formation into a tubular shape.
摘要翻译：一种气体管道，其包括可膨胀材料管，其限定用于气体的通道，并且当被加热时能够膨胀以在碳化时闭合通道。该管被一个圆柱形的不可燃物体包围。用于连接气体管道的接头，其包括容纳在金属管状构件中并限定气体通道的可膨胀材料管。当加热时，管能够膨胀，以在碳化时封闭通道。一种制造用于气体管道和气体管接头的热膨胀性橡胶管的方法。将约2〜30重量份氧化的，可膨胀石墨粉末与100重量份生橡胶混合，并将预定量的固化剂和固化促进剂加入到橡胶和石墨混合物中，随后形成成为管状。

48. 发明授权

US4134530A Method for construction of water intake portion of hydraulic machine 失效
标题翻译：液压机进水部分施工方法
公开(公告)号：US4134530A
公开(公告)日：1979-01-16
申请号：US657272
申请日：1976-02-11
申请人： Kagehiko Yamamoto , Hideo Ito , Mizuho Tanaka , Shoji Sato , Hidetoshi Togashi , Isao Yanagida , Yukio Yamaguchi , Mutsuo Suzuki , Tadakazu Oguri , Hisanao Kita , Junzo Komatsu
发明人： Kagehiko Yamamoto , Hideo Ito , Mizuho Tanaka , Shoji Sato , Hidetoshi Togashi , Isao Yanagida , Yukio Yamaguchi , Mutsuo Suzuki , Tadakazu Oguri , Hisanao Kita , Junzo Komatsu
IPC分类号： F03B3/16 , F03B11/02 , B23K31/02
CPC分类号： F03B11/02 , Y02E10/223 , Y02E10/226 , Y10T29/49245
摘要： A water intake portion of a hydraulic machine consists of a casing and a speed ring positioned between the casing and guide vanes for guiding water from the casing to the guide vanes. The speed ring consists of a pair of upper and lower flat members of a ring form, a plurality of stay vanes positioned between the aforesaid pair of members for interconnecting same rigidly, and a reinforcing member of a cylindrical form, which is welded to the top surface of the upper flat member between the inner and outer circumferential edges of the upper flat member. Edges defining therebetween an opening of this casing are welded to the top surface of the upper flat member of a ring form, of the speed ring in the position between the aforesaid reinforcing member and the outer circumferential edge of the upper flat member, as well as to the undersurface of the lower flat member of a ring form, respectively. In this respect, the welding of the reinforcing member of a cylindrical form to the top surface of the upper flat member of a ring form is followed by the welding of the edges of the opening of the casing to the upper and lower flat members of a ring form.
摘要翻译：液压机的进水部分由壳体和位于壳体和导向叶片之间的速度环组成，用于将水从壳体引导到导向叶片。速度环包括一对环形的上下平坦部件，位于上述一对部件之间的多个保持叶片，用于将其刚性地相互连接，以及一个圆柱形的加强件，其被焊接到顶部上平板部件的内周面和外周缘之间的表面。在其间限定该壳体的开口的边缘被焊接到环形的上部平坦构件的上表面，速度环的上表面位于上述加强构件和上部平坦构件的外周边缘之间的位置，以及分别到环形的下平坦构件的下表面。在这方面，将圆柱形加强构件焊接到环形上部平坦构件的顶表面之后，将壳体的开口的边缘焊接到上部和下部平坦构件戒指形式。

49. 发明申请

US20130111945A1 Heat Exchanger and Heat Pump Using Same 有权
标题翻译：换热器和热泵使用相同
公开(公告)号：US20130111945A1
公开(公告)日：2013-05-09
申请号：US13701295
申请日：2011-05-30
申请人： Naotaka Iwasawa , Yukio Yamaguchi , Hirotaka Kado
发明人： Naotaka Iwasawa , Yukio Yamaguchi , Hirotaka Kado
IPC分类号： F25B39/02 , F28D1/053
CPC分类号： F25B39/02 , F28D1/053 , F28F1/32
摘要： A heat exchanger having a plurality of heat-transfer tubes arrayed at intervals in vertical and anteroposterior directions and arranged so that an equilateral triangle is formed by lines connecting the centers of heat-transfer tubes located vertically and anteroposteriorly adjacent to each other; and a plurality of heat-transfer corrugated fins arranged at intervals in an axial direction of the heat-transfer tubes, characterized in that when an external diameter of each of the heat-transfer tubes is V1; a vertical pitch of the heat-transfer tubes is V2, a fin pitch of the heat-transfer corrugated fins is V3, a fin plate thickness of each of the heat-transfer corrugated fins is V4, and a corrugate height of the heat-transfer corrugated fins is V5, any one of V2, V3 and V5 is set within a given range.
摘要翻译：一种热交换器，具有多个沿垂直和前后方向间隔排列的传热管，并且布置成通过连接垂直和前后相邻的传热管的中心的线形成等边三角形; 以及沿传热管的轴向间隔设置的多个传热波纹状散热片，其特征在于，每个所述传热管的外径为V1; 传热管的垂直间距为V2，传热波纹状散热片的翅片间距为V3，各传热波纹状散热片的散热片厚度为V4，传热波纹高度为波纹状散热片为V5，V2，V3，V5中的任意一个设定在规定范围内。

50. 发明授权

US08425279B2 Apparatus for manufacturing seeds for polycrystalline silicon manufacture 有权
标题翻译：用于制造多晶硅制造种子的装置
公开(公告)号：US08425279B2
公开(公告)日：2013-04-23
申请号：US12241393
申请日：2008-09-30
申请人： Larry Gurley , Ken Rowell , Satoshi Imamura , Yukio Yamaguchi
发明人： Larry Gurley , Ken Rowell , Satoshi Imamura , Yukio Yamaguchi
IPC分类号： B24B7/00
CPC分类号： B28D5/029 , B28D5/024 , C01B33/035 , Y10T83/748 , Y10T83/7507 , Y10T83/7573 , Y10T83/7688
摘要： An apparatus for manufacturing seeds for polycrystalline silicon manufacture by cutting a silicon rod in an axial direction into at least one plate-like member, and cutting at least one of the silicon plate-like member lengthwise into seeds that are square in cross section, that includes a table which mounts the silicon rod or at least one of the plate-like member, a pair of end-face supporting members which support the silicon rod or at least one of the plate-like member by pressing both end faces thereof in the axial direction, and a cutting blade which cuts the silicon rod or at least one of the plate-like member in the axial direction, in addition the end-face supporting members includes comb-like grooves that allow the cutting blade to pass through.
摘要翻译：一种用于通过将硅棒沿轴向切割成至少一个板状构件来制造用于多晶硅制造种子的装置，并且将所述硅板状构件中的至少一个纵向切割成横截面为正方形的种子，包括安装硅棒或板状构件中的至少一个的工作台，一对端面支撑构件，其通过将其两个端面压在其中来支撑硅棒或至少一个板状构件以及沿轴向切割硅棒或板状构件中的至少一个的切割刀片，此外，端面支撑构件包括允许切割刀片通过的梳状槽。

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