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41. 发明申请

US20070152827A1 Limiter for controlling overvoltage and RFID tag having the same 有权
标题翻译：用于控制过电压的限制器和具有相同功能的RFID标签
公开(公告)号：US20070152827A1
公开(公告)日：2007-07-05
申请号：US11486279
申请日：2006-07-14
申请人： Il-jong Song , Young-hoon Min , Chol-su Yoon , Dong-sik Shim
发明人： Il-jong Song , Young-hoon Min , Chol-su Yoon , Dong-sik Shim
IPC分类号： G08B13/14 , H04Q5/22 , G08B23/00
CPC分类号： G06K19/0723
摘要： A limiter for controlling an overvoltage and an RFID tag having the same are provided. The limiter includes a first limiter part and a second limiter part serially connected to the first limiter part. The second limiter part has at least one limit diode whose threshold voltage is lower than that of elements in the first limiter part. Accordingly, if an overvoltage is input, the limiter can maximize the input current drop so that the limiter can maximize the leakage voltage. As a result, the RFID tag can prevent the RFID driving part from being damaged due to the overvoltage. In addition, the RFID tag can normally operate regardless of the intensity of the driving voltage input from the RFID reader, so that the yields of products can improve.
摘要翻译：提供了用于控制过电压的限制器和具有该限制器的RFID标签。限幅器包括与第一限幅器部分串联连接的第一限幅器部分和第二限幅器部分。第二限幅器部分具有至少一个限制二极管，其阈值电压低于第一限幅器部分中的元件的阈值电压。因此，如果输入过电压，则限幅器可以使输入电流下降最大化，使得限幅器可以使漏电压最大化。结果，RFID标签可以防止RFID驱动部件由于过电压而被损坏。此外，RFID标签可以正常工作，而与RFID读取器输入的驱动电压的强度无关，从而可以提高产品的产量。

42. 发明申请

US20070139198A1 RFID tag capable of limiting over-voltage and method for controlling over-voltage thereof 审中-公开
标题翻译：能够限制过电压的RFID标签及其过电压控制方法
公开(公告)号：US20070139198A1
公开(公告)日：2007-06-21
申请号：US11487564
申请日：2006-07-17
申请人： Dong-sik Shim , Ja-nam Ku , Young-hoon Min , Il-jong Song
发明人： Dong-sik Shim , Ja-nam Ku , Young-hoon Min , Il-jong Song
IPC分类号： G08B13/14 , H04Q5/22 , G08B23/00
CPC分类号： G06K19/0723 , G06K19/0701
摘要： Provided are an RFID tag capable of limiting an over-voltage and a method for controlling an over-voltage thereof. The RFID tag includes: an antenna unit receiving external electromagnetic waves to induce an input voltage; a voltage generator rectifying the input voltage to generate a driving voltage; a voltage limiter adaptively turned on and/or off depending on whether the input voltage is high or low to limit an intensity of the input voltage input into the voltage generator; and a logic controller controlling the antenna unit to generate authentication information based on the driving voltage and transmit the authentication information.
摘要翻译：提供能够限制过电压的RFID标签和用于控制其过电压的方法。 RFID标签包括：天线单元，接收外部电磁波以感应输入电压; 整流输入电压的电压发生器产生驱动电压; 电压限制器根据输入电压是高还是低自适应地导通和/或截止以限制输入到电压发生器的输入电压的强度; 以及逻辑控制器，其控制所述天线单元，以基于所述驱动电压生成认证信息，并发送所述认证信息。

43. 发明申请

US20070126800A1 Heater to control bubble and inkjet printhead having the heater 有权
标题翻译：加热器控制具有加热器的气泡和喷墨打印头
公开(公告)号：US20070126800A1
公开(公告)日：2007-06-07
申请号：US11471490
申请日：2006-06-21
申请人： Dong-sik Shim , Hyung Choi , Min-soo Kim
发明人： Dong-sik Shim , Hyung Choi , Min-soo Kim
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1412
摘要： A heater to control an ink bubble, and an inkjet printhead having the heater. The heater has different resistances according to portions thereof.
摘要翻译：用于控制墨水泡的加热器和具有加热器的喷墨打印头。加热器根据其部分具有不同的电阻。

44. 发明授权

US07145332B2 Magnetic field sensing device and method for fabricating thereof 有权
标题翻译：磁场感测装置及其制造方法
公开(公告)号：US07145332B2
公开(公告)日：2006-12-05
申请号：US11433570
申请日：2006-05-15
申请人： Hae-seok Park , Kyung-won Na , Dong-sik Shim , Sang-on Choi
发明人： Hae-seok Park , Kyung-won Na , Dong-sik Shim , Sang-on Choi
IPC分类号： G01R33/03
CPC分类号： G01R33/02
摘要： Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core formed to construct a closed-magnetic circuit on a semiconductor substrate, a magnetic field sensing coil formed by a metal film in a shape that winds the soft magnetic core, and a drive line for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.
摘要翻译：公开了一种高灵敏度的磁场传感器，其节能且可以以非常小的尺寸以低成本制造。磁场传感器包括形成为在半导体衬底上构成封闭磁路的软磁芯，由形成软磁芯的形状的金属膜形成的磁场感测线圈和用于激励软磁芯的驱动线通过直接向其施加电流的磁芯。驱动线形成与磁场感测线圈成矩形的角度，并且在长度方向上与软磁芯的两端连接。

45. 发明申请

US20060115918A1 Method for manufacturing a magnetic field detecting element 审中-公开
标题翻译：磁场检测元件的制造方法
公开(公告)号：US20060115918A1
公开(公告)日：2006-06-01
申请号：US11336881
申请日：2006-01-23
申请人： Dong-sik Shim , Kyung-won Na , Sang-on Choi , Hae-seok Park , Jun-sik Hwang
发明人： Dong-sik Shim , Kyung-won Na , Sang-on Choi , Hae-seok Park , Jun-sik Hwang
IPC分类号： H01L21/00
CPC分类号： G01R33/02 , G01R33/04 , G01R33/05 , H01F17/0006 , H01F41/046
摘要： A method for manufacturing a magnetic field detecting element having a soft magnetic core formed on a substrate, first and second coils, each having coil lines, arranged above and below the core, the method including forming a seed film on the substrate, removing a portion of the seed film using a predetermined pattern so that coil lines constituting the first coil subsequently formed on the seed film are separated, forming a first plating mold having grooves corresponding to the predetermined pattern on an upper portion of the seed film, forming coil lines constituting the first coil by filling the grooves of the first plating mold with metal, forming the soft magnetic core and the second coil on an upper portion of the substrate and on the seed film where the first coil is formed, and cutting off edges of the substrate so that the separated coil lines are insulated.
摘要翻译：一种用于制造具有形成在基板上的软磁芯的磁场检测元件的方法，所述方法包括在所述基板上方和下方形成具有线圈的第一和第二线圈，所述方法包括在所述基板上形成种子膜，的种子薄膜，使得构成在种子薄膜上随后形成的第一线圈的线圈线分离，在种子薄膜的上部形成具有对应于预定图案的槽的第一电镀模，形成线圈线，第一线圈通过用金属填充第一电镀模具的凹槽，在基板的上部和形成第一线圈的种子膜上形成软磁芯和第二线圈，并切断基板的边缘使分离的线圈线绝缘。

46. 发明申请

US20050151269A1 UBM for fine pitch solder balland flip-chip packaging method using the same 有权
标题翻译： UBM用于精细节距焊球和倒装芯片封装方法使用相同
公开(公告)号：US20050151269A1
公开(公告)日：2005-07-14
申请号：US11012294
申请日：2004-12-16
申请人： Hoon Song , Dong-sik Shim
发明人： Hoon Song , Dong-sik Shim
IPC分类号： H01L21/60 , H01L23/13 , H01L23/485 , H01L29/06 , H05K1/11 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/13 , H01L23/13 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05559 , H01L2224/05568 , H01L2224/05571 , H01L2224/05578 , H01L2224/05599 , H01L2224/10145 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16237 , H01L2224/16238 , H01L2224/81365 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/15151 , H01L2924/15787 , H01L2924/381 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09045 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00
摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
摘要翻译：一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。由于UBM形成为压花图案，因此可以实现精细的焊球。此外，可以提高包装的可靠性。

47. 发明申请

US20050077585A1 Magnetic field sensing device and method for fabricating thereof 有权
标题翻译：磁场感测装置及其制造方法
公开(公告)号：US20050077585A1
公开(公告)日：2005-04-14
申请号：US10773456
申请日：2004-02-09
申请人： Hae-seok Park , Kyung-won Na , Dong-sik Shim , Sang-on Choi
发明人： Hae-seok Park , Kyung-won Na , Dong-sik Shim , Sang-on Choi
IPC分类号： H01L43/02 , G01R33/02 , G01R33/04 , H01L43/00 , H01L29/82
CPC分类号： G01R33/02
摘要： Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core formed to construct a closed-magnetic circuit on a semiconductor substrate, a magnetic field sensing coil formed by a metal film in a shape that winds the soft magnetic core, and a drive line for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.
摘要翻译：公开了一种高灵敏度的磁场传感器，其节能且可以以非常小的尺寸以低成本制造。磁场传感器包括形成为在半导体衬底上构成封闭磁路的软磁芯，由形成软磁芯的形状的金属膜形成的磁场感测线圈和用于激励软磁芯的驱动线通过直接向其施加电流的磁芯。驱动线形成与磁场感测线圈成矩形的角度，并且在长度方向上与软磁芯的两端连接。

48. 发明申请

US20080122894A1 HEAD CHIP AND INK CARTRIDGE AND IMAGE FORMING APPARATUS HAVING THE SAME 审中-公开
标题翻译：头盖和墨盒和图像形成装置
公开(公告)号：US20080122894A1
公开(公告)日：2008-05-29
申请号：US11767718
申请日：2007-06-25
申请人： Jin-wook Lee , Dong-sik Shim , Sung-joon Park , Bang-weon Lee , Sang-hyun Kim
发明人： Jin-wook Lee , Dong-sik Shim , Sung-joon Park , Bang-weon Lee , Sang-hyun Kim
IPC分类号： B41J2/145 , B41J2/175
CPC分类号： B41J2/1408 , B41J2/14145 , B41J2/14201
摘要： A head chip usable in an image forming apparatus, the head chip includes a nozzle layer having a nozzle to discharge ink onto a recording medium, a substrate layer having an ink supplying slit provided to be parallel with the nozzle layer to supply the nozzle with the ink, and a reinforcing bridge provided along an extending direction of the ink supplying slit and blocks at least one region of the ink supplying slit.
摘要翻译：一种可用于图像形成装置的头芯片，头芯片包括具有用于将墨水喷射到记录介质上的喷嘴的喷嘴层，具有设置成与喷嘴层平行的供墨狭缝的基底层，以向喷嘴提供油墨和沿着供墨狭缝的延伸方向设置的加强桥，并且阻挡供墨狭缝的至少一个区域。

49. 发明授权

US07309924B2 UBM for fine pitch solder ball and flip-chip packaging method using the same 有权
标题翻译： UBM用于细间距焊球和倒装芯片封装方法使用
公开(公告)号：US07309924B2
公开(公告)日：2007-12-18
申请号：US11012294
申请日：2004-12-16
申请人： Hoon Song , Dong-sik Shim
发明人： Hoon Song , Dong-sik Shim
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L23/13 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05559 , H01L2224/05568 , H01L2224/05571 , H01L2224/05578 , H01L2224/05599 , H01L2224/10145 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16237 , H01L2224/16238 , H01L2224/81365 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/15151 , H01L2924/15787 , H01L2924/381 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09045 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00
摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
摘要翻译：一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。由于UBM形成为压花图案，因此可以实现精细的焊球。此外，可以提高包装的可靠性。

50. 发明申请

US20070131648A1 METHOD OF FABRICATING INKJET PRINTHEAD 有权
标题翻译：制造喷墨打印机的方法
公开(公告)号：US20070131648A1
公开(公告)日：2007-06-14
申请号：US11423982
申请日：2006-06-14
申请人： Dong-sik Shim , Hyung Choi
发明人： Dong-sik Shim , Hyung Choi
IPC分类号： G01D15/00 , G11B5/127
CPC分类号： B41J2/14129 , B41J2/14137 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1639 , B41J2/1643 , Y10T29/49083 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49401
摘要： A method of fabricating an inkjet printhead. The method of fabricating an inkjet printhead includes sequentially forming an insulating layer, a heater, and an electrode on a substrate and forming a passivation layer on the insulating layer to cover the heater and the electrode; forming a trench that exposes the substrate by sequentially etching the passivation layer and the insulating layer; forming a sacrificial layer to form an ink chamber on the passivation layer to fill the trench; forming a seed layer to provide a plating on the sacrificial layer and the passivation layer; forming a nozzle mold on the seed layer positioned over the heater; forming a plating layer on the seed layer to a predetermined thickness; forming an ink feed hole by etching a rear surface of the substrate to expose the sacrificial layer which is filled in the trench; forming a nozzle by sequentially removing the nozzle mold and the seed layer positioned under the nozzle mold; and forming the ink chamber by removing the sacrificial layer which is exposed by the nozzle and the ink feed hole.
摘要翻译：一种制造喷墨打印头的方法。制造喷墨打印头的方法包括在基板上依次形成绝缘层，加热器和电极，并在绝缘层上形成钝化层以覆盖加热器和电极; 形成通过依次蚀刻钝化层和绝缘层而使衬底暴露的沟槽; 形成牺牲层以在所述钝化层上形成墨水腔以填充所述沟槽; 形成种子层以在所述牺牲层和所述钝化层上提供电镀; 在位于加热器上方的种子层上形成喷嘴模具; 在种子层上形成预定厚度的镀层; 通过蚀刻所述衬底的后表面以暴露所述沟槽中填充的所述牺牲层来形成供墨孔; 通过依次去除位于喷嘴模具下方的喷嘴模具和籽晶层形成喷嘴; 以及通过去除由喷嘴和供墨孔暴露的牺牲层来形成墨室。

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