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41. 发明申请

US20070128538A1 METHOD OF DEPOSITING AN AMORPHOUS CARBON LAYER 有权
标题翻译：沉积非晶碳层的方法
公开(公告)号：US20070128538A1
公开(公告)日：2007-06-07
申请号：US11673177
申请日：2007-02-09
申请人： KEVIN FAIRBAIRN , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
发明人： KEVIN FAIRBAIRN , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
IPC分类号： G03C8/00
CPC分类号： H01L21/76829 , C23C16/26 , H01L21/0276 , H01L21/28035 , H01L21/3081 , H01L21/3088 , H01L21/31138 , H01L21/31144 , H01L21/3146 , H01L21/31612 , H01L21/32137 , H01L21/76802 , H01L21/76807
摘要： A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
摘要翻译：一种使用无定形碳膜形成集成电路的方法。无定形碳膜通过热分解包含烃化合物和惰性气体的气体混合物而形成。无定形碳膜与集成电路制造工艺兼容。在一个集成电路制造工艺中，非晶碳膜用作硬掩模。在另一个集成电路制造工艺中，无定形碳膜是用于深紫外（DUV）光刻的抗反射涂层（ARC）。在又一集成电路制造工艺中，多层无定形碳抗反射涂层用于DUV光刻。

42. 发明申请

US20060215570A1 Method of achieving the network link status penetrate 有权
标题翻译：实现网络链路状态渗透的方法
公开(公告)号：US20060215570A1
公开(公告)日：2006-09-28
申请号：US10535858
申请日：2003-08-13
申请人： Hongxing Zhang , Yuxiang Wang , Jianfei He , Zuoxiao Ma , Bo Liang
发明人： Hongxing Zhang , Yuxiang Wang , Jianfei He , Zuoxiao Ma , Bo Liang
IPC分类号： H04J3/14 , H04J1/16
CPC分类号： H04L45/00 , H04L12/5692 , H04L41/0663 , H04L45/28 , H04L69/40
摘要： The present invention discloses a method for implementing link state passing-through in network, for informing the peer of link fault, said method comprising the following steps: the service device detecting whether there is a link fault in the network; in case of link fault, the service device transferring link fault information to peer service device with a control frame; in response to said control frame containing link fault information, the peer service device disconnecting the user's link and performing corresponding processes; the user at the faulty peer communicating with peer user through the spare network; when said link recovers to normal, the service device at the recovery peer sending a control frame containing link fault recovery information to peer service device to reestablish communication between said users on said link. The present invention is capable of informing the peer of link fault and reducing extra overhead under normal network conditions as much as possible.
摘要翻译：本发明公开了一种在网络中实现链路状态通过的方法，用于向对等体通告链路故障，所述方法包括以下步骤：服务设备检测网络中是否存在链路故障; 在链路故障的情况下，服务设备通过控制帧将链路故障信息传送到对等业务设备; 响应于包含链路故障信息的所述控制帧，对等服务设备断开用户的链路并执行相应的过程; 故障对等体的用户通过备用网络与对等体用户通信; 当所述链路恢复正常时，恢复对等体的服务设备向对等服务设备发送包含链路故障恢复信息的控制帧，以重新建立所述链路上所述用户之间的通信。本发明能够在正常网络条件下尽可能地通知对等体的链路故障并减少额外的开销。

43. 发明申请

US20060123132A1 System and method for accessing and transmitting different data frames in a digital transmission network 有权
公开(公告)号：US20060123132A1
公开(公告)日：2006-06-08
申请号：US11334477
申请日：2006-01-19
申请人： Zhiqun He , Yuxiang Wang
发明人： Zhiqun He , Yuxiang Wang
IPC分类号： G06F15/173
CPC分类号： H04L12/4641 , H04Q11/0478
摘要： A system for accessing and transmitting data frames of different types in a digital transmission network, including: at least one user-network interface; at least one network-network interface; at least one mapping/demapping device; a virtual interface device coupled with the at least one user-network interface and with the at least one network-network interface via the at least one mapping/demapping device; and a control device coupled with the virtual interface device; the control device including: a data processing and dispatching device including: at least one inter-device interface; a data processing and dispatching unit coupled with the inter-device interface; a processing flow database, storing a plurality of processing flows, coupled with the data processing and dispatching unit; and a control interface unit coupled with the processing flow database and the data processing and dispatching unit so as to control a virtual private processing unit and a rule database to process the data frames.

44. 发明授权

US07016979B2 System and method of accessing and transmitting different data frames in a digital transmission network 有权
标题翻译：在数字传输网络中访问和传输不同数据帧的系统和方法
公开(公告)号：US07016979B2
公开(公告)日：2006-03-21
申请号：US10765153
申请日：2004-01-28
申请人： Zhiqun He , Yuxiang Wang
发明人： Zhiqun He , Yuxiang Wang
IPC分类号： G06F17/00
CPC分类号： H04L12/4641 , H04Q11/0478
摘要： A method and system for accessing and transmitting different types data frames in a digital transmission network, wherein the system includes a data processing and dispatching device having at least an inter-device interface, a processing flow database, and a control interface unit, and wherein the method includes the steps of extracting type number information from data frames, searching for rules in the processing flow database corresponding to the extracted type number, determining the retrieved result and discard the data frames if the retrieval result is blank, otherwise extracting an inter-device interface number and outputting the data frames via the inter-device interface with the extracted inter-device interface number.
摘要翻译：一种用于在数字传输网络中访问和发送不同类型的数据帧的方法和系统，其中所述系统包括具有至少一个设备间接口，处理流数据库和控制接口单元的数据处理和调度设备，并且其中该方法包括以下步骤：从数据帧中提取类型号信息，搜索与所提取的类型号对应的处理流数据库中的规则，确定检索结果，如果检索结果为空，则丢弃数据帧，设备接口号，并通过设备间接口提取设备间接口号输出数据帧。

45. 发明申请

US20050233257A1 Photolithography scheme using a silicon containing resist 有权
公开(公告)号：US20050233257A1
公开(公告)日：2005-10-20
申请号：US11154741
申请日：2005-06-16
申请人： Ian Latchford , Christopher Bencher , Yuxiang Wang , Mario Silvetti
发明人： Ian Latchford , Christopher Bencher , Yuxiang Wang , Mario Silvetti
IPC分类号： B01J19/08 , C23C16/26 , C23C16/46 , G03C5/00 , G03F7/075 , G03F7/09 , H01L21/027 , H01L21/283 , H01L21/311 , H01L21/312 , H01L21/314 , H01L21/316 , H01L21/3205 , H01L21/768
CPC分类号： H01L21/31144 , G03F7/0757 , G03F7/091 , H01L21/0276 , H01L21/76802 , H01L21/76825 , H01L21/76832
摘要： A method for forming a patterned amorphous carbon layer in a semiconductor stack, including forming an amorphous carbon layer on a substrate and forming a silicon containing photoresist layer on top of the amorphous carbon layer. Thereafter, the method includes developing a pattern transferred into the resist layer with a photolithographic process and etching through the amorphous carbon layer in at least one region defined by the pattern in the resist layer, wherein a resist layer hard mask is formed in an outer portion of the photoresist layer during etching.

46. 发明申请

US20050112509A1 Method of depositing an amrphous carbon layer 有权
标题翻译：淀积碳膜的方法
公开(公告)号：US20050112509A1
公开(公告)日：2005-05-26
申请号：US11019860
申请日：2004-12-21
申请人： Kevin Fairbairn , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
发明人： Kevin Fairbairn , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
IPC分类号： H01L21/20 , H01L21/027 , H01L21/28 , H01L21/308 , H01L21/311 , H01L21/314 , H01L21/316 , H01L21/3213 , H01L21/768 , G03F7/16
CPC分类号： H01L21/76829 , C23C16/26 , H01L21/0276 , H01L21/28035 , H01L21/3081 , H01L21/3088 , H01L21/31138 , H01L21/31144 , H01L21/3146 , H01L21/31612 , H01L21/32137 , H01L21/76802 , H01L21/76807
摘要： A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
摘要翻译：一种使用无定形碳膜形成集成电路的方法。无定形碳膜通过热分解包含烃化合物和惰性气体的气体混合物而形成。无定形碳膜与集成电路制造工艺兼容。在一个集成电路制造工艺中，非晶碳膜用作硬掩模。在另一个集成电路制造工艺中，无定形碳膜是用于深紫外（DUV）光刻的抗反射涂层（ARC）。在又一集成电路制造工艺中，多层无定形碳抗反射涂层用于DUV光刻。

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