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    • 41. 发明授权
    • Single poly UV-erasable programmable read only memory
    • 单个聚UV可擦除可编程只读存储器
    • US06882574B2
    • 2005-04-19
    • US10605235
    • 2003-09-17
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • G11C16/04
    • G11C16/0408G11C16/0433G11C2216/10G11C2216/18H01L27/11521H01L27/11558
    • An erasable programmable read only memory includes two serially connected P-type metal-oxide semiconductor (MOS) transistors, wherein a first P-type MOS transistor acts as select transistor, a gate of the first P-type MOS transistor is coupled to select gate voltage, a first node of the first P-type MOS transistor connected to source line voltage, a second node of the first P-type MOS transistor connected to a first node of a second P-type MOS transistor, wherein a second node of the second P-type MOS transistor is connected to bit line voltage, wherein a gate of the second P-type MOS transistor serves as a floating gate, wherein the erasable programmable read only memory does not need to bias a certain voltage on a control gate for programming and thereby injecting hot carriers onto the floating gate, and wherein the erasable programmable read only memory is capped by dielectric materials which are transparent to ultraviolet (UV) light.
    • 可擦除可编程只读存储器包括两个串联的P型金属氧化物半导体(MOS)晶体管,其中第一P型MOS晶体管用作选择晶体管,第一P型MOS晶体管的栅极耦合到选择栅极 电压,连接到源极线电压的第一P型MOS晶体管的第一节点,与第二P型MOS晶体管的第一节点连接的第一P型MOS晶体管的第二节点,其中, 第二P型MOS晶体管连接到位线电压,其中第二P型MOS晶体管的栅极用作浮置栅极,其中可擦除可编程只读存储器不需要在控制栅极上偏置一定电压, 编程,从而将热载体注入到浮动栅极上,并且其中可擦除可编程只读存储器被对紫外线(UV)光透明的电介质材料封盖。
    • 44. 发明授权
    • Nonvolatile semiconductor memory capable of random programming
    • 非易失性半导体存储器,能够进行随机编程
    • US06504763B1
    • 2003-01-07
    • US09683845
    • 2002-02-21
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • G11C1604
    • H01L27/11521G11C16/0483G11C16/12H01L27/115H01L27/11524
    • A nonvolatile semiconductor memory capable of random programming has a semiconductor substrate of a first conductivity type having a memory region, a deep ion well of a second conductivity type located in the semiconductor substrate within the memory region, a shallow ion well of the first conductivity type isolated by an STI layer within the deep ion well, at least one NAND cell block located on the semiconductor substrate within the shallow ion well, and a bit line located over the semiconductor substrate used to provide a first predetermined voltage for the shallow ion well during a data program mode via a conductive plug which electrically connects to the bit line and extends downward to the shallow ion well. Consequently, during a programming operation, only a selected word line is required to have an appropriate voltage applied to it. Thus, the power needed is reduced and access time is shortened.
    • 能够进行随机编程的非易失性半导体存储器具有具有存储区域的第一导电类型的半导体衬底,位于存储区域内的半导体衬底中的第二导电类型的深离子阱,第一导电类型的浅离子阱 通过深离子阱内的STI层隔离,位于浅离子阱内的半导体衬底上的至少一个NAND单元块,以及位于半导体衬底上方的位线,用于为浅离子阱提供第一预定电压 通过电连接到位线并向下延伸到浅离子阱的导电插头的数据程序模式。 因此,在编程操作期间,仅需要选择的字线来施加适当的电压。 因此,所需的功率减少,并且访问时间缩短。
    • 45. 发明授权
    • Method for operating a nonvolatile memory having embedded word lines
    • 用于操作具有嵌入字线的非易失性存储器的方法
    • US06490196B1
    • 2002-12-03
    • US10064047
    • 2002-06-04
    • Ching-Hsiang HsuKung-Hong LeeChing-Sung Yang
    • Ching-Hsiang HsuKung-Hong LeeChing-Sung Yang
    • G11C1604
    • H01L29/42336G11C8/14G11C11/5671G11C16/0475G11C16/08H01L27/115H01L29/7883
    • A flash memory cell with an embedded gate structure capable of storing two bits of information and the operation of such a flash memory cell are provided. A first ion-doped region, serving as a source terminal, is formed in a semiconductor substrate. An embedded gate structure and a second ion-doped region are alternately arranged on the first ion-doped region. The embedded gate structure is surrounded by the first oxide layer, the trapping layer, and the second oxide layer. An insulating layer is formed on the embedded gate structure. A diffusion drain is positioned atop the second ion-doped region and a conductive layer connects with the diffusion drains. The embedded gate structure is isolated from the diffusion drain with the insulating layer. Furthermore, the reading, programming, and erasing operation of the memory cell with two bits of information are provided.
    • 提供具有能够存储两位信息的嵌入式门结构和这种闪存单元的操作的闪存单元。 作为源极端子的第一离子掺杂区域形成在半导体衬底中。 嵌入栅极结构和第二离子掺杂区域交替地布置在第一离子掺杂区域上。 嵌入式栅极结构被第一氧化物层,俘获层和第二氧化物层包围。 在嵌入式栅极结构上形成绝缘层。 扩散漏极位于第二离子掺杂区域顶部,导电层与扩散漏极连接。 嵌入式栅极结构与绝缘层与扩散漏极隔离。 此外,提供了具有两位信息的存储单元的读取,编程和擦除操作。
    • 47. 发明申请
    • NON-VOLATILE MEMORY
    • 非易失性存储器
    • US20090134452A1
    • 2009-05-28
    • US12341984
    • 2008-12-22
    • Ching-Sung YangWei-Zhe Wong
    • Ching-Sung YangWei-Zhe Wong
    • H01L29/792
    • H01L29/7887G11C16/0458G11C16/0475H01L27/115H01L27/11568H01L29/7923
    • A non-volatile memory includes a substrate, a memory unit array, (N+1) bit lines, M word lines, M first control gate lines, and M second control gate lines. The memory unit array includes N memory unit columns, and each memory unit column includes M memory units. The (N+1) bit lines are disposed on the substrate and arranged in parallel in the column direction, and the (N+1) bit lines are corresponding to the N memory unit columns. The M word lines are disposed on the substrate and arranged in parallel in the row direction. The M first control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the first memory cell in the same row. The M second control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the second memory cell in the same row.
    • 非易失性存储器包括衬底,存储器单元阵列,(N + 1)位线,M字线,M个第一控制栅极线和M个第二控制栅极线。 存储单元阵列包括N个存储单元列,每个存储单元列包括M个存储单元。 (N + 1)位线设置在基板上,并且在列方向上并列布置,并且(N + 1)位线对应于N个存储单元列。 M字线设置在基板上并且在行方向上平行布置。 M个第一控制栅极线在行方向上平行布置在基板上,并且分别连接到同一行中的第一存储单元。 M个第二控制栅极线在行方向上平行布置在基板上,并分别连接到同一行中的第二存储单元。
    • 48. 发明授权
    • Method of fabricating flash memory cell
    • 制造闪存单元的方法
    • US07491607B2
    • 2009-02-17
    • US11750320
    • 2007-05-17
    • Wei-Zhe WongChing-Sung Yang
    • Wei-Zhe WongChing-Sung Yang
    • H01L21/336
    • H01L27/115G11C16/0433G11C16/3468H01L21/28273H01L27/11521H01L27/11526H01L27/11529H01L29/42328H01L29/66825H01L29/7881
    • A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.
    • 提供闪存单元。 将深井设置在基板中,并将井设置在深井内。 层叠栅极结构设置在基板上。 源极区域和漏极区域设置在堆叠栅极结构的每一侧上的衬底中。 选择栅极设置在堆叠的栅极结构和源极区域之间。 第一栅极介电层设置在选择栅极和堆叠栅极结构之间。 第二栅极电介质层设置在选择栅极和衬底之间。 在堆叠栅极结构和选择栅极之下的衬底中设置浅掺杂区域。 在堆叠栅极结构的一侧上的衬底中设置深掺杂区域。 衬底上的导电插塞延伸穿过漏区和深掺杂区。
    • 50. 发明授权
    • Method of operating flash memory cell
    • 操作闪存单元的方法
    • US07336539B2
    • 2008-02-26
    • US11750323
    • 2007-05-17
    • Wei-Zhe WongChing-Sung Yang
    • Wei-Zhe WongChing-Sung Yang
    • G11C16/02G11C16/12G11C16/14G11C16/26
    • H01L27/115G11C16/0433G11C16/3468H01L21/28273H01L27/11521H01L27/11526H01L27/11529H01L29/42328H01L29/66825H01L29/7881
    • A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.
    • 提供闪存单元。 将深井设置在基板中,并将井设置在深井内。 层叠栅极结构设置在基板上。 源极区域和漏极区域设置在堆叠栅极结构的每一侧上的衬底中。 选择栅极设置在堆叠的栅极结构和源极区域之间。 第一栅极介电层设置在选择栅极和堆叠栅极结构之间。 第二栅极电介质层设置在选择栅极和衬底之间。 在堆叠栅极结构和选择栅极之下的衬底中设置浅掺杂区域。 在堆叠栅极结构的一侧上的衬底中设置深掺杂区域。 衬底上的导电插塞延伸穿过漏区和深掺杂区。