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41. 发明授权

US08322898B2 Bulb-shaped lamp and lighting device 有权
标题翻译：灯泡灯和照明装置
公开(公告)号：US08322898B2
公开(公告)日：2012-12-04
申请号：US13222373
申请日：2011-08-31
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V15/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译：一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。照明电路经由基座部件接收电力。照明电路设置在电路保持器内。在电路架与壳体和安装构件之间存在空气空间。照明电路由电路座与空气空间隔离。满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积模块。

42. 发明申请

US20120320601A1 MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF, LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE 有权
标题翻译：安装基板及其制造方法，发光模块和照明装置
公开(公告)号：US20120320601A1
公开(公告)日：2012-12-20
申请号：US13582330
申请日：2011-04-27
申请人： Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
发明人： Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
IPC分类号： H01L33/60 , B05D5/12 , B32B17/06 , B32B9/04 , B32B18/00 , B32B17/10
CPC分类号： H01L25/0753 , F21K9/23 , F21V3/00 , F21V7/22 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/09701 , H01L2924/3025 , H05K1/0306 , H05K3/284 , H05K2201/017 , H05K2201/09154 , H05K2201/10106 , H05K2201/2054 , Y10T428/263 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass fit, and reflects light from the LED chips.
摘要翻译：本发明的目的是提供一种可以充分提高LED灯的发光效率的安装基板，制造方法，发光模块和照明装置。根据本发明的安装基板包括基板和反射膜，所述基板和反射膜形成在基板的前表面上并且具有要安装LED芯片的正面，反射膜由金属氧化物微粒制成，玻璃配合，并反射来自LED芯片的光。

43. 发明授权

US08541805B2 Mounting substrate and manufacturing method thereof, light-emitting module and illumination device 有权
标题翻译：安装基板及其制造方法，发光模块和照明装置
公开(公告)号：US08541805B2
公开(公告)日：2013-09-24
申请号：US13582330
申请日：2011-04-27
申请人： Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
发明人： Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/23 , F21V3/00 , F21V7/22 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/09701 , H01L2924/3025 , H05K1/0306 , H05K3/284 , H05K2201/017 , H05K2201/09154 , H05K2201/10106 , H05K2201/2054 , Y10T428/263 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.
摘要翻译：本发明的目的是提供一种可以充分提高LED灯的发光效率的安装基板，制造方法，发光模块和照明装置。根据本发明的安装基板包括基板和反射膜，所述基板和反射膜形成在基板的前表面上并且具有要安装LED芯片的正面，反射膜由金属氧化物微粒制成，玻璃料，并且反射来自LED芯片的光。

44. 发明申请

US20120113638A1 LED LAMP AND LIGHTING DEVICE 有权
标题翻译： LED灯和照明装置
公开(公告)号：US20120113638A1
公开(公告)日：2012-05-10
申请号：US13380474
申请日：2011-03-18
申请人： Takaari Uemoto , Masahiro Miki , Yasuyuki Ueda
发明人： Takaari Uemoto , Masahiro Miki , Yasuyuki Ueda
IPC分类号： F21V11/00
CPC分类号： F21V3/00 , F21K9/232 , F21K9/60 , F21V3/061 , F21V3/062 , F21V7/0008 , F21Y2115/10
摘要： Provided is a bulb-type LED lamp 10 configured to diffuse light outward through a globe. The bulb-type LED lamp 10 includes LED modules 22, 24, 28, 30, each having a mounting substrate and LEDs mounted on the mounting substrate, and a base 14 through which power is supplied to the LEDs for light emission. The LED lamp 10 also includes a light diffusing member 58. Among the LED modules 22, 24, 28, 30, the LED module 22 is positioned on an imaginary extension of a central axis X of the base 14, and the light diffusing member 58 is positioned inside the globe 16 to receive light emitted from the LED module 22. The other LED modules 22, 28, 30 are positioned in a vicinity of the LED module 22, tilted to face the light diffusing member 58.
摘要翻译：提供了一种灯泡型LED灯10，其构造成通过球体向外扩散光。灯泡型LED灯10包括LED模块22,24,28,30，每个LED模块22,24,28,30各自具有安装基板和安装在安装基板上的LED，以及基座14，通过该底座14向LED提供电力用于发光。 LED灯10还包括光漫射构件58.在LED模块22,24,28,30中，LED模块22位于基座14的中心轴线X的假想延伸部上，并且光漫射构件58 位于球体16内部以接收从LED模块22发射的光。另外的LED模块22,28,30位于LED模块22附近，倾斜以面向光漫射构件58。

45. 发明授权

US08439527B2 Bulb-type lamp and lighting device 失效
标题翻译：灯泡型灯具及照明装置
公开(公告)号：US08439527B2
公开(公告)日：2013-05-14
申请号：US13243517
申请日：2011-09-23
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Satoshi Shida , Tatsumi Setomoto , Akira Taniuchi , Takaari Uemoto , Hideo Nagai
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Satoshi Shida , Tatsumi Setomoto , Akira Taniuchi , Takaari Uemoto , Hideo Nagai
IPC分类号： F21V7/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/232 , F21K9/238 , F21S8/026 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/507 , F21V29/70 , F21Y2115/10
摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.
摘要翻译：提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 LED灯泡包括：安装有LED的LED模块; 在两端具有开口的圆筒状壳体，其为第一端和第二端; 安装构件，其表面上安装有LED模块，所述安装构件通过与所述壳体的第一端的内周面接触而封闭所述壳体的相应一个开口; 附接到所述壳体的第二端的基部构件; 以及设置在壳体内的照明电路。壳体的壁厚在200μm〜500μm的范围内，壳体的至少一部分的壁厚从壳体的第一端朝向第二端部减小。

46. 发明申请

US20120002421A1 BULB-SHAPED LAMP AND LIGHTING DEVICE 有权
标题翻译： BULB型灯和照明设备
公开(公告)号：US20120002421A1
公开(公告)日：2012-01-05
申请号：US13222373
申请日：2011-08-31
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V21/00 , F21V29/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译：一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。照明电路经由基座部件接收电力。照明电路设置在电路保持器内。在电路架与壳体和安装构件之间存在空气空间。照明电路由电路座与空气空间隔离。满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积模块。

47. 发明授权

US08038329B2 Bulb-shaped lamp and lighting device 有权
标题翻译：灯泡灯和照明装置
公开(公告)号：US08038329B2
公开(公告)日：2011-10-18
申请号：US12994741
申请日：2010-02-03
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V29/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译：一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。照明电路经由基座部件接收电力。照明电路设置在电路保持器内。在电路架与壳体和安装构件之间存在空气空间。照明电路由电路座与空气空间隔离。在S1表示与壳体接触的安装构件的一部分的面积，S2表示与LED模块的基板接触的安装构件的部分的面积的情况下，满足关系0.5＆nlE; S1 / S2。

48. 发明授权

US09080757B2 Bulb-shaped lamp and lighting device 有权
标题翻译：灯泡灯和照明装置
公开(公告)号：US09080757B2
公开(公告)日：2015-07-14
申请号：US13565652
申请日：2012-08-02
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V29/00 , F21V23/00 , F21K99/00 , F21V3/00 , F21V29/15 , F21V29/83 , F21V29/89 , F21S8/02 , F21Y101/02
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译：一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡型灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。照明电路经由基座部件接收电力。照明电路设置在电路保持器内。在电路架与壳体和安装构件之间存在空气空间。照明电路由电路座与空气空间隔离。满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积模块。

49. 发明申请

US20120300448A1 BULB-SHAPED LAMP AND LIGHTING DEVICE 审中-公开
公开(公告)号：US20120300448A1
公开(公告)日：2012-11-29
申请号：US13565652
申请日：2012-08-02
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V9/00 , F21V29/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.

50. 发明申请

US20120044684A1 BULB-TYPE LAMP AND LIGHTING DEVICE 失效
标题翻译： BULB型灯和照明装置
公开(公告)号：US20120044684A1
公开(公告)日：2012-02-23
申请号：US13243517
申请日：2011-09-23
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Satoshi Shida , Tatsumi Setomoto , Akira Taniuchi , Takaari Uemoto , Hideo Nagai
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Satoshi Shida , Tatsumi Setomoto , Akira Taniuchi , Takaari Uemoto , Hideo Nagai
IPC分类号： F21V21/00 , F21V29/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/232 , F21K9/238 , F21S8/026 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/507 , F21V29/70 , F21Y2115/10
摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.
摘要翻译：提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 LED灯泡包括：安装有LED的LED模块; 在两端具有开口的圆筒状壳体，其为第一端和第二端; 安装构件，其表面上安装有LED模块，所述安装构件通过与所述壳体的第一端的内周面接触而封闭所述壳体的相应一个开口; 附接到所述壳体的第二端的基部构件; 以及设置在壳体内的照明电路。壳体的壁厚在200μm〜500μm的范围内，壳体的至少一部分的壁厚从壳体的第一端朝向第二端部减小。

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