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41. 外观设计

USD662452S1 Tire for motorcycle 有权
公开(公告)号：USD662452S1
公开(公告)日：2012-06-26
申请号：US29413977
申请日：2012-02-23
申请人： Tomoki Kato
设计人： Tomoki Kato

42. 发明授权

US08044521B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08044521B2
公开(公告)日：2011-10-25
申请号：US12379178
申请日：2009-02-13
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L21/48
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.
摘要翻译：提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。引线框架设置在引线框架的两侧。引线框架的一部分用封装树脂封装起到内引线的作用。封装树脂由基本上不含卤素的树脂组合物组成。此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。

43. 发明申请

US20090152729A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20090152729A1
公开(公告)日：2009-06-18
申请号：US12379178
申请日：2009-02-13
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.
摘要翻译：提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。引线框架设置在引线框架的两侧。引线框架的一部分用封装树脂封装起到内引线的作用。封装树脂由基本上不含卤素的树脂组合物组成。此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。

44. 发明授权

US07397126B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07397126B2
公开(公告)日：2008-07-08
申请号：US11236563
申请日：2005-09-28
申请人： Tomoki Kato
发明人： Tomoki Kato
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/40 , H01L23/49562 , H01L24/37 , H01L24/41 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40245 , H01L2224/4103 , H01L2224/73221 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The present invention provides inhibiting an electrical leakage caused by anion migration. A trenched portion 15 is provided as ion migration-preventing zone between a source electrode 4 and a gate electrode 5. The trenched portion 15 is formed so as to surround a periphery of the source electrode 4.
摘要翻译：本发明抑制由阴离子迁移引起的漏电。在源电极4和栅电极5之间提供作为离子迁移防止区的沟槽部分15。沟槽部分15形成为围绕源电极4的周边。

45. 发明申请

US20070134845A1 Method of forming molded resin semiconductor device 有权
标题翻译：成型树脂半导体器件的形成方法
公开(公告)号：US20070134845A1
公开(公告)日：2007-06-14
申请号：US11702550
申请日：2007-02-06
申请人： Tomoki Kato
发明人： Tomoki Kato
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , H01L23/3107 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip and a wiring strip are placed on a flat side of a base sheet. The semiconductor chip has parallel first and second surfaces. Electrodes are connected to the first surface. The electrodes all terminate in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. The wiring strip has one end portion connected to the second surface of the semiconductor chip and the opposite end portion terminating in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. A mold resin fills gaps between the semiconductor chip, the wiring strip, and the base sheet to lock the semiconductor chip and the wiring strip. The base sheet is removed.
摘要翻译：将半导体芯片和布线条放置在基片的平坦侧上。半导体芯片具有平行的第一和第二表面。电极连接到第一表面。电极全部终止于基片的平坦面的平面中，并且粘合地连接到基片的平坦侧。布线条具有连接到半导体芯片的第二表面的一个端部和终止于基片的平坦侧的平面中的相对端部，并且粘合地连接到基片的平坦侧。模具树脂填充半导体芯片，布线条和基片之间的间隙，以锁定半导体芯片和布线条。去除基片。

46. 发明授权

US07141580B2 Aryl or heteroaryl fused imidazole compounds as anti-inflammatory and analgesic agents 有权
标题翻译：芳基或杂芳基稠合咪唑化合物作为抗炎和止痛剂
公开(公告)号：US07141580B2
公开(公告)日：2006-11-28
申请号：US10771696
申请日：2004-02-04
申请人： Kazunari Nakao , Yoshiyuki Okumura , Miyako Matsumizu , Naomi Ueno , Yoshinobu Hashizume , Tomoki Kato , Akiyoshi Kawai , Yoriko Miyake , Seiji Nukui , Katsuhiro Shinjyo , Kana Taniguchi
发明人： Kazunari Nakao , Yoshiyuki Okumura , Miyako Matsumizu , Naomi Ueno , Yoshinobu Hashizume , Tomoki Kato , Akiyoshi Kawai , Yoriko Miyake , Seiji Nukui , Katsuhiro Shinjyo , Kana Taniguchi
IPC分类号： A61K31/437
CPC分类号： C07D213/75 , A61K31/00 , A61K31/4178 , A61K31/437 , A61K31/64 , C07D231/12 , C07D233/56 , C07D235/06 , C07D235/08 , C07D235/12 , C07D235/14 , C07D235/16 , C07D235/18 , C07D235/30 , C07D249/08 , C07D401/04 , C07D401/06 , C07D401/12 , C07D403/04 , C07D403/06 , C07D403/12 , C07D413/12 , C07D417/04 , C07D417/12 , C07D471/04 , C07D473/00 , C07D491/04 , Y02P20/55
摘要： This invention provides a compound of the formula (I): or the pharmaceutically acceptable salts thereof, wherein Y1, Y2, Y3 and Y4 are independently selected from N, CH, etc.; R1 is H, C1-8 alkyl, etc.; Q1 is a 5–12 membered monocyclic or bicyclic aromatic ring optionally containing up to 4 heteroatoms selected from O, N and S, etc.; A is a 5–6 membered monocyclic aromatic ring optionally containing up to 3 heteroatoms selected from O, N and S, etc.; B is C1-6 alkylene optionally substituted with an oxo group, etc.; W is NH, O, etc.; R2 is H, C1-4 alkyl, etc.; Z is a 5–12 membered monocyclic or bicyclic aromatic ring optionally containing up to 3 heteroatoms selected from O, N and S, etc.; L is halo, C1-4 alkyl, etc.; m is 0, 1 or 2; R3 and R4 are independently selected from H and C1-4 alkyl; R5 is H, C1-4 alkyl, etc.; Q2 is a 5–12 membered monocyclic or bicyclic aromatic ring or tricyclic ring optionally containing up to 3 heteroatoms selected from O, N and S, etc. These compounds are useful for the treatment of medical conditions mediated by prostaglamndin such as pain, fever or inflammation, etc. This invention also provides a pharmaceutical composition comprising the above compound.
摘要翻译：本发明提供式（I）化合物或其药学上可接受的盐，其中Y 1，Y 2，Y 3和 Y 4独立地选自N，CH等; R 1是H，C 1-8烷基等; Q 1是5-12元单环或双环芳族环，任选地含有至多4个选自O，N和S的杂原子等; A是任选含有至多3个选自O，N和S的杂原子的5-6元单环芳环等; B是任选被氧代基取代的C 1-6亚烷基等; W是NH，O等; R 2是H，C 1-4烷基等; Z是任选地含有至多3个选自O，N和S的杂原子的5-12元单环或双环芳环等; L为卤素，C 1-4烷基等; m为0,1或2; R 3和R 4独立地选自H和C 1-4烷基; R 5是H，C 1-4烷基等; Q 2是5-12元单环或双环芳族环或三环，任选地含有至多3个选自O，N和S的杂原子等。这些化合物可用于治疗介导的医学病症通过前列腺素如疼痛，发烧或炎症等。本发明还提供了包含上述化合物的药物组合物。

47. 发明授权

US06949536B2 Sulfonylbenzene compounds as anti-inflammatory/analgesic agents 失效
标题翻译：磺酰苯化合物作为抗炎/止痛剂
公开(公告)号：US06949536B2
公开(公告)日：2005-09-27
申请号：US10771861
申请日：2004-02-03
申请人： Kazuo Ando , Tomoki Kato , Akiyoshi Kawai , Tomomi Nonomura
发明人： Kazuo Ando , Tomoki Kato , Akiyoshi Kawai , Tomomi Nonomura
IPC分类号： A61K31/33 , A61K31/4025 , A61K31/422 , A61K31/425 , A61K31/427 , A61K31/454 , C07D233/00 , C07D277/00 , C07D333/00
CPC分类号： A61K31/422 , A61K31/427 , A61K31/454 , C07C311/39 , C07C317/36 , C07D207/325 , C07D207/333 , C07D401/10 , C07D403/10 , C07D405/10 , C07D409/10 , C07D413/10 , C07D417/10
摘要： This invention provides a compound of the formula: or its pharmaceutically acceptable salt thereof, wherein A is partially unsaturated or unsaturated five membered heterocyclic, or partially unsaturated or unsaturated five membered carbocyclic, wherein the 4-(sulfonyl)phenyl and the 4-substituted phenyl in the formula (I) are attached to ring atoms of Ring A, which are adjacent to each other; R1 is optionally substituted aryl or heteroaryl, with the proviso that when A is pyrazole, R1 is heteroaryl; R2 is C1-4 alkyl; halo-substituted C1-4 alkyl, C1-4 alkylamino, C1-4 dialkylamino or amino; R3, R4 and R5 are independently hydrogen, halo, C1-4 alkyl, halo-substituted C1-4 alkyl or the like; or two of R3, R4 and R5 are taken together with atoms to which they are attached and form a 4-7 membered ring. R6 and R7 are independently hydrogen, halo, C1-4 alkyl, halo-substituted C1-4 alkyl, C1-4 alkoxy, C1-4 alkylthio, C1-4 alkylamino or N,N-di C1-4 alkylamino; and m and n are independently 1, 2, 3 or 4. This invention also provides a pharmaceutical composition useful for the treatment of a medical condition in which prostaglandins are implicated as pathogens.
摘要翻译：本发明提供下式的化合物或其药学上可接受的盐，其中A是部分不饱和或不饱和的五元杂环或部分不饱和或不饱和的五元碳环，其中4-（磺酰基）苯基和4-取代的苯基在式（I）中，与环A相邻的环原子相连; R 1是任选取代的芳基或杂芳基，条件是当A是吡唑时，R 1是杂芳基; R 2是C 1-4烷基; 卤素取代的C 1-4烷基，C 1-4烷基氨基，C 1-4烷基氨基或氨基; R 4，R 4和R 5独立地是氢，卤素，C 1-4烷基，卤代 - 取代的C 1-4烷基等; 或者R 3，R 4和R 5中的两个与它们所连接的原子一起形成4-7元环。 R 6和R 7独立地是氢，卤素，C 1-4烷基，卤素取代的C 1-4烷基， C 1-4烷基，C 1-4烷氧基，C 1-4烷硫基，C 1-4烷基氨基或N，N-二C < 烷基氨基; m和n分别为1,2,3或4.本发明还提供了一种药物组合物，其用于治疗前列腺素涉及病原体的医疗状况。

48. 发明授权

US06710054B2 Aryl or heteroaryl fused imidazole compounds as anti-inflammatory and analgesic agents 有权
标题翻译：芳基或杂芳基稠合咪唑化合物作为抗炎和止痛剂
公开(公告)号：US06710054B2
公开(公告)日：2004-03-23
申请号：US09977621
申请日：2001-10-15
申请人： Kazunari Nakao , Yoshiyuki Okumura , Miyako Matsumizu , Naomi Ueno , Yoshinobu Hashizume , Tomoki Kato , Akiyoshi Kawai , Yoriko Miyake , Seiji Nukui , Katsuhiro Shinjyo , Kana Taniguchi
发明人： Kazunari Nakao , Yoshiyuki Okumura , Miyako Matsumizu , Naomi Ueno , Yoshinobu Hashizume , Tomoki Kato , Akiyoshi Kawai , Yoriko Miyake , Seiji Nukui , Katsuhiro Shinjyo , Kana Taniguchi
IPC分类号： A61K31437
CPC分类号： C07D213/75 , A61K31/00 , A61K31/4178 , A61K31/437 , A61K31/64 , C07D231/12 , C07D233/56 , C07D235/06 , C07D235/08 , C07D235/12 , C07D235/14 , C07D235/16 , C07D235/18 , C07D235/30 , C07D249/08 , C07D401/04 , C07D401/06 , C07D401/12 , C07D403/04 , C07D403/06 , C07D403/12 , C07D413/12 , C07D417/04 , C07D417/12 , C07D471/04 , C07D473/00 , C07D491/04 , Y02P20/55
摘要： This invention provides a compound of the formula (I): or the pharmaceutically acceptable salts thereof, wherein Y1, Y2, Y3 and Y4 are independently selected from N, CH, etc.; R1 is H, C1-8 alkyl, etc.; Q1 is a 5-12 membered monocyclic or bicyclic aromatic ring optionally containing up to 4 heteroatoms selected from O, N, and S, etc.; A is 5-6 membered monocyclic aromatic ring optionally containing up to 3 heteroatoms selected form O, N and S, etc.; B is C1-6 alkylene optionally substituted with an oxo group, etc.; W is NH, O, etc.; R2 is H, C1-4 alkyl, etc.; Z is a 5-12 membered monocyclic or bicyclic aromatic ring optionally containing up to 3 heteroatoms selected form O, N and S, etc.; L is halo, C1-4 alkyl, etc.; m is 0, 1 or 2; R3 and R4 are independently selected from H and C1-4 alkyl; R5 is H, C1-4 alkyl; etc.; Q2 is a 5-12 membered monocyclic or bicyclic aromatic ring or tricyclic ring optionally containing up to 3 heteroatoms selected from O, N and S, etc. These compounds are useful for the treatment of medical conditions mediated by prostaglamndin such as pain, fever or inflammation, etc. This invention also provides a pharmaceutical composition comprising the above compound.
摘要翻译：本发明提供式（I）化合物或其药学上可接受的盐，其中Y 1，Y 2，Y 3和Y 4独立地选自N，CH等; R 1是H，C 1-8烷基等; Q 1是任选地含有至多4个选自O，N和S的杂原子的5-12元单环或双环芳环等; A是任选含有至多3个选自O，N和S的杂原子的5-6元单环芳环等; B是任选被氧代基取代的C 1-6亚烷基等; W是NH，O等; R 2是H，C 1-4烷基等; Z是任选地含有至多3个选自O，N和S等的杂原子的5-12元单环或双环芳环; L是卤素，C 1-4烷基等; m为0,1或2; R 3和R 4独立地选自H和C 1-4烷基; R 5是H，C 1-4烷基; 等等。; Q 2是任选地含有至多3个选自O，N和S的杂原子的5-12元单环或双环芳族环或三环，这些化合物可用于治疗由前列腺素介导的医学病症如疼痛，发热或炎症等。本发明还提供包含上述化合物的药物组合物。

49. 发明授权

US09634255B2 Aromatic amine derivative and organic electroluminescence element using same 有权
公开(公告)号：US09634255B2
公开(公告)日：2017-04-25
申请号：US14345066
申请日：2012-09-11
申请人： Tomoki Kato , Takahiro Fujiyama
发明人： Tomoki Kato , Takahiro Fujiyama
IPC分类号： H01L51/50 , H01L51/00 , C09K11/06 , H05B33/14 , C07D405/14 , C07D403/10 , C07D405/04 , C07D405/10 , C07D409/04 , C07D409/14 , C07D271/107 , C07D209/86 , H01L51/52 , C07D471/14 , C09B57/00
CPC分类号： H01L51/0058 , C07D209/86 , C07D271/107 , C07D403/10 , C07D405/04 , C07D405/10 , C07D405/14 , C07D409/04 , C07D409/14 , C07D471/14 , C09B57/00 , C09B57/008 , C09B57/10 , C09K11/06 , C09K2211/1074 , H01L51/0052 , H01L51/0059 , H01L51/006 , H01L51/0061 , H01L51/0072 , H01L51/0073 , H01L51/0074 , H01L51/0085 , H01L51/5016 , H01L51/5068 , H01L51/52 , H05B33/14
摘要： An aromatic amine derivative represented by formula (1): wherein L1, L2, Ar1, Ar2, R1, R2, a, b, and Q are as defined in the specification. An organic electroluminescence device having at least one organic thin film layer which includes the aromatic amine derivative has high emission efficiency and long lifetime.

50. 发明授权

US09082986B2 Organic electroluminescent element 有权
标题翻译：有机电致发光元件
公开(公告)号：US09082986B2
公开(公告)日：2015-07-14
申请号：US14122131
申请日：2012-05-23
申请人： Tomoki Kato , Nobuhiro Yabunouchi , Takayasu Sado
发明人： Tomoki Kato , Nobuhiro Yabunouchi , Takayasu Sado
IPC分类号： H01L29/08 , H01L35/24 , H01L51/00 , H01L51/50
CPC分类号： H01L51/0056 , H01L51/0072 , H01L51/5012 , H01L51/5016 , H01L51/5056
摘要： An organic electroluminescence device includes a first organic thin-film layer and a second organic thin-film layer between an anode and a cathode opposing the anode in this order from the anode side. The first organic thin-film layer includes a specific aromatic heterocyclic derivative A, and the second organic thin-film layer includes a specific aromatic heterocyclic derivative B. The aromatic heterocyclic derivative A and the aromatic heterocyclic derivative B are different from each other. The organic electroluminescence device is capable of driving at a low voltage and has a long lifetime.
摘要翻译：有机电致发光器件从阳极侧依次包括第一有机薄膜层和与阳极相对的阳极和阴极之间的第二有机薄膜层。第一有机薄膜层包含特定的芳族杂环衍生物A，第二有机薄膜层包含特定的芳族杂环衍生物B.芳族杂环衍生物A和芳族杂环衍生物B彼此不同。有机电致发光器件能够在低电压下驱动并且寿命长。

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