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41. 发明申请

US20070274048A1 CLIP AND HEAT DISSIPATION ASSEMBLY USING THE SAME 失效
标题翻译：夹具和散热组件使用相同
公开(公告)号：US20070274048A1
公开(公告)日：2007-11-29
申请号：US11309621
申请日：2006-09-01
申请人： Wan-Lin Xia , Tao Li , Wei-Qiang Tian
发明人： Wan-Lin Xia , Tao Li , Wei-Qiang Tian
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44017 , H01L2924/00
摘要： A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.
摘要翻译：散热组件包括安装座，散热器和用于将散热器紧固在安装座中的夹子。安装座限定开口并设置有第一和第二突起。散热器容纳在安装座的开口中。夹子包括用于按压散热器的细长的按压构件和连接到按压构件的一端并连接到安装座的第一突起的夹紧腿。限定凹口的操作构件可枢转地附接到按压构件的另一端并且可相对于按压构件旋转，并且安装座的第二突出部滑动在操作构件的凹口中，使得夹子在一个释放状态和锁定状态。

42. 发明授权

US07292447B2 Back plate assembly for a board 失效
标题翻译：板的背板组件
公开(公告)号：US07292447B2
公开(公告)日：2007-11-06
申请号：US11308411
申请日：2006-03-22
申请人： Wan-Lin Xia , Tao Li , Jun Long
发明人： Wan-Lin Xia , Tao Li , Jun Long
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H05K1/0271 , Y10T24/42 , H01L2924/00
摘要： A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.
摘要翻译：用于板（200）的后板组件（100）包括邻接板的一侧的后板（110）和多个柱（120）。每个柱包括形成在其上的至少一个闩锁部分（1206）。在闩锁部分通过背板和板之后，闩锁部分被板和背板中的一个阻挡，以将背板固定到板上。螺丝（330）用于延伸穿过散热器（300）以与柱螺纹接合，从而将散热器安装到板上。因此，散热器可以与安装在电路板上的电子部件（210）紧密接触。

43. 发明授权

US07277288B2 Heat sink assembly with retention module and clip 失效
标题翻译：带保温模块和夹子的散热器组件
公开(公告)号：US07277288B2
公开(公告)日：2007-10-02
申请号：US10629232
申请日：2003-07-28
申请人： Hsieh Kun Lee , WanLin Xia , Gen-Cai Wang , Tao Li
发明人： Hsieh Kun Lee , WanLin Xia , Gen-Cai Wang , Tao Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board (10) has an electronic package (100) mounted thereon. The retention module (20) is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module (20) defines an opening (26) therein for surrounding the electronic package (100). Four positioning holes (28) are defined in four corners of the retention module (20). In assembly of the heat sink assembly, the pins (30) are interferentially positioned in the positioning holes (28) of the retention module (20). Portions of the pins (30) extending out beyond the retention module (20) are welded to the printed circuit board (10). The clip (50) cooperates with the retention module (20) to press the heat sink (40) against the electronic package (100).
摘要翻译：本发明的散热器组件包括印刷电路板（10），保持模块（20），四个销（30），散热器（40）和夹子（50）。印刷电路板（10）具有安装在其上的电子封装（100）。保持模块（20）整体形成，大致矩形，并具有对称构型。保持模块（20）在其中限定一个用于包围电子封装（100）的开口（26）。四个定位孔（28）被限定在保持模块（20）的四个角部。在散热器组件的组装中，销（30）沿周向定位在保持模块（20）的定位孔（28）中。延伸超过保持模块（20）的销（30）的部分焊接到印刷电路板（10）。夹子（50）与保持模块（20）配合以将散热器（40）压靠在电子封装（100）上。

44. 发明申请

US20070145993A1 CHIP BURNING SYSTEM 失效
标题翻译：芯片燃烧系统
公开(公告)号：US20070145993A1
公开(公告)日：2007-06-28
申请号：US11308951
申请日：2006-05-29
申请人： Tao Li , Su-Shun Zhang
发明人： Tao Li , Su-Shun Zhang
IPC分类号： G01R31/28 , G11C7/00
CPC分类号： G11C29/56 , G01R31/2863 , G11C2029/5602
摘要： A chip burning system includes a burning device (10) with a plurality of burning files stored therein, a transforming circuit (30) for connecting to chips via serial interfaces, a control unit (20) interconnecting the burning device and the transforming circuit via parallel interfaces, and two chips (40,50) for burning. The transforming circuit includes a parallel-to-serial conversion module (301). The control unit includes a terminal (28) configured to output a chip choosing signal to the transforming circuit for choosing one chip from the two chips. The burning device transmits a parallel type burning file to the transforming circuit via the control unit. The transforming circuit transforms the burning file into serial type with the parallel-to-serial conversion module, and the transformed burning file is burned into the chosen chip.
摘要翻译：芯片燃烧系统包括：燃烧装置（10），其中存储有多个燃烧文件;变换电路（30），用于经由串行接口连接到芯片;控制单元（20），其通过并行连接所述燃烧装置和所述变换电路接口和两个烧焦芯片（40,50）。变换电路包括并行到串行转换模块（301）。控制单元包括：端子（28），被配置为向变换电路输出芯片选择信号，用于从两个芯片中选择一个芯片。燃烧装置通过控制单元将并行型燃烧文件传送到变换电路。转换电路使用并行到串行转换模块将刻录文件转换为串行类型，并将转换后的刻录文件刻录到所选芯片中。

45. 发明申请

US20070060588A1 Fused bicycloheterocycle substituted quinuclidine derivatives 审中-公开
标题翻译：稠合双环杂环取代的奎宁环衍生物
公开(公告)号：US20070060588A1
公开(公告)日：2007-03-15
申请号：US11450800
申请日：2006-06-09
申请人： Jianguo Ji , Tao Li , Kathleen Mortell , Michael Schrimpf , Diana Nersesian , Liping Pan , William Bunnelle
发明人： Jianguo Ji , Tao Li , Kathleen Mortell , Michael Schrimpf , Diana Nersesian , Liping Pan , William Bunnelle
IPC分类号： A61K31/506 , A61K31/501 , A61K31/4745 , C07D453/02 , C07D471/02
CPC分类号： C07D453/02
摘要： Compounds of formula (I) wherein n is 0, 1, or 2; A is N or N+—O−; X is O, S, —NH—, and —N-alkyl-; Ar1 is a 6-membered aromatic ring; and Ar2 is a fused bicycloheterocycle. The compounds are useful in treating conditions or disorders prevented by or ameliorated by α7 nAChR ligands. Also disclosed are pharmaceutical compositions having compounds of formula (I) and methods for using such compounds and compositions.
摘要翻译：其中n为0,1或2的式（I）化合物; A是N或N + O - - O - X是O，S，-NH-和-N-烷基 - ; Ar 1是6元芳环; 并且Ar 2是稠合的双环杂环。该化合物可用于治疗由α7nAChR配体预防或改善的病症或病症。还公开了具有式（I）化合物的药物组合物和使用这些化合物和组合物的方法。

46. 发明申请

US20070051498A1 HEAT DISSIPATION DEVICE WITH A HEAT PIPE 审中-公开
标题翻译：带散热管的散热装置
公开(公告)号：US20070051498A1
公开(公告)日：2007-03-08
申请号：US11308392
申请日：2006-03-21
申请人： Wan-Lin Xia , Tao Li , Jun Long , Yong Zhong
发明人： Wan-Lin Xia , Tao Li , Jun Long , Yong Zhong
IPC分类号： F28F27/02
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/12 , F28F1/22 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a seat and a base having a first face and a second face opposite to the first face and thermally contacting the seat. A plurality of fins extends from the first face of the base. Two heat pipes are thermally arranged on the second face of the base. Each of the two heat pipes is bent and has a section sandwiched between the base and the seat, and another section thereof stretching along the base from said section to a portion of the base in no attachment with the seat.
摘要翻译：一种散热装置，包括一个座和一个具有与第一面相对的第一面和第二面的底座，并且与基座热接触。多个翼片从基座的第一面延伸。两个热管被热布置在基座的第二面上。两个热管中的每一个被弯曲并且具有夹在基座和座之间的部分，而另一部分沿基座从所述部分延伸到基座的一部分，而不与座接合。

47. 发明申请

US20070035926A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20070035926A1
公开(公告)日：2007-02-15
申请号：US11306499
申请日：2005-12-30
申请人： Wan-Lin Xia , Tao Li , Min-Qi Xiao
发明人： Wan-Lin Xia , Tao Li , Min-Qi Xiao
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.
摘要翻译：散热器组件包括散热器（10），安装在散热器上的风扇罩（20）和由风扇盖承载的风扇（30）。散热器包括基部（12）和从基部延伸的多个间隔开的散热翅片（140）。隔开的散热翅片限定了延伸穿过散热片的前端和后端的多个通道（16）。在散热器的前端和风扇盖之间形成空腔（40）。散热器的前端配置有弧形前边缘或倾斜的前边缘。

48. 发明授权

US07174955B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07174955B2
公开(公告)日：2007-02-13
申请号：US11018070
申请日：2004-12-20
申请人： Yong Zhong , Wan-Lin Xia , Tao Li
发明人： Yong Zhong , Wan-Lin Xia , Tao Li
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in an opposite direction to the elongated flange with the elongated flange located therebetween. The elongated flange (14) defines two holes (142) at respective opposite sides thereof and each shortened flange (16) provides an engaging piece (164) in alignment with one hole of the elongated flange. The engaging pieces of one fin engage in corresponding holes of an adjacent fin to thereby combine the fins together.
摘要翻译：散热片（10）包括彼此连接的多个翅片（12）。在一个实施例中，每个翅片包括具有细长凸缘（14）的主体（13）和从其两个相对侧中的每一个延伸的两个缩短的凸缘（16）。缩短的凸缘从主体向与细长凸缘相反的方向延伸，并且细长凸缘位于它们之间。细长法兰（14）在其各自的相对侧限定两个孔（142），并且每个缩短的凸缘（16）提供与细长法兰的一个孔对准的接合件（164）。一个翅片的接合片接合相邻翅片的相应的孔，从而将翅片组合在一起。

49. 发明授权

US07163049B2 Cooling fin assembly 失效
标题翻译：散热片组件
公开(公告)号：US07163049B2
公开(公告)日：2007-01-16
申请号：US11018290
申请日：2004-12-20
申请人： Yong Zhong , Wan-Lin Xia , Tao Li
发明人： Yong Zhong , Wan-Lin Xia , Tao Li
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members includes a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.
摘要翻译：冷却翅片组件（10）包括连接在一起的多个冷却翅片（10a）。每个冷却翅片包括分别在其四个角处形成四个接合构件（14a）的主体（11a）。每个接合构件包括具有限定在其中的细长孔（16a）的辊片（15A）和具有从其延伸的接合件（18a）的连接件（17a）。在冷却翅片的组装中，每个冷却翅片的接合件与相邻冷却翅片的辊片的相应的孔接合，从而将冷却翅片彼此紧固并连接。

50. 发明申请

US20060262504A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060262504A1
公开(公告)日：2006-11-23
申请号：US11135569
申请日：2005-05-23
申请人： Wan-Lin Xia , Bo-Yong Yang , Tao Li
发明人： Wan-Lin Xia , Bo-Yong Yang , Tao Li
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the base. The condensing section of the heat pipe departs from the base. The fins are stacked on the heat pipe and the reinforcing member. Therefore, the heat dissipation device has steady configuration and low cost.
摘要翻译：散热装置包括基座，至少一个具有蒸发部分和冷凝部分的热管，至少一个不相变的加强件，以及多个翅片。热管的蒸发部分接触基部。热管的冷凝部分离开基座。翅片堆叠在热管和加强构件上。因此，散热装置结构稳定，成本低。

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