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41. 发明授权

US07176570B2 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment 有权
标题翻译：用于形成凸块的方法，具有凸块的半导体元件及其制造方法，半导体器件及其制造方法，电路板和电子设备
公开(公告)号：US07176570B2
公开(公告)日：2007-02-13
申请号：US11191976
申请日：2005-07-29
申请人： Takuya Takahashi
发明人： Takuya Takahashi
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/49575 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05552 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/14 , H01L2224/16245 , H01L2224/32145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48647 , H01L2224/4911 , H01L2224/49171 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.
摘要翻译：通过使用工具将形成为球形的线的末端接合到电极。线的一部分从结合到电极的尖端拉出。通过使用该工具使电极的与尖端连续的部分的电极变形，从而在电极上形成凸块。在电极上留下凸块的同时切割电线。

42. 发明授权

US07167730B2 Communication terminal apparatus and method of controlling the same, server apparatus and method of controlling the same, and storage media 有权
标题翻译：通信终端装置及其控制方法，服务器装置及其控制方法以及存储介质
公开(公告)号：US07167730B2
公开(公告)日：2007-01-23
申请号：US10043846
申请日：2002-01-11
申请人： Takaaki Shibata , Hiroaki Takahashi , Takuya Takahashi , Atsushi Yamaura
发明人： Takaaki Shibata , Hiroaki Takahashi , Takuya Takahashi , Atsushi Yamaura
IPC分类号： H04M1/00
CPC分类号： H04M1/72522 , H04M1/72525 , H04M1/72547 , H04M1/72561
摘要： There is provided a communication terminal apparatus that enables quick response in screen display and quick retrieval of desired melodies in a musical tone data distributing service and reduces a communication fee. A java incoming call melody program including core display data is received from a server apparatus through the Internet and is stored in a RAM. When the stored program is executed, a display screen is formed based on the core display data according to the program and is displayed on a display. A cellular phone receives the distributing service by receiving desired musical tone data from the server apparatus via the Internet using the display screen.
摘要翻译：提供了一种通信终端装置，其能够在屏幕显示中进行快速响应并且快速检索音调数据分发服务中期望的旋律并且降低通信费用。通过因特网从服务器装置接收到包含核心显示数据的java来电旋律程序，并存储在RAM中。当存储的程序被执行时，根据程序根据核心显示数据形成显示画面，并显示在显示器上。蜂窝电话通过使用显示屏通过因特网从服务器装置接收所需的乐音数据来接收分发服务。

43. 发明申请

US20060272484A1 Content distributing server, content distributing method, and content distributing program 失效
标题翻译：内容分发服务器，内容分发方式和内容分发程序
公开(公告)号：US20060272484A1
公开(公告)日：2006-12-07
申请号：US11433899
申请日：2006-05-12
申请人： Toshiaki Kaburagi , Takuya Takahashi
发明人： Toshiaki Kaburagi , Takuya Takahashi
IPC分类号： G10H7/00 , A63H5/00 , G04B13/00
CPC分类号： G10H1/0058 , G10H2210/151 , G10H2230/021 , G10H2240/125
摘要： A content distributing server capable of reproducing desired display contents in conformity with reproduction of a desired musical composition. In response to a request from a terminal device, one of musical composition contents stored in a musical composition database is identified, and one of template contents stored in a template database is identified. A reproduction time length of the identified template content is adjusted according to a reproduction time length of the identified musical composition content. The adjusted template content is added to the musical composition content to generate a synthesized content, which is distributed to the terminal device.
摘要翻译：一种内容分发服务器，其能够根据期望的音乐作品的再现再现期望的显示内容。响应于来自终端设备的请求，识别存储在音乐作品数据库中的乐曲内容之一，并且识别存储在模板数据库中的模板内容之一。所识别的模板内容的再现时间长度根据所识别的音乐作品内容的再现时间长度被调整。调整的模板内容被添加到音乐作品内容以生成分发给终端装置的合成内容。

44. 发明授权

US07064425B2 Semiconductor device circuit board, and electronic equipment 失效
标题翻译：半导体器件电路板和电子设备
公开(公告)号：US07064425B2
公开(公告)日：2006-06-20
申请号：US10347299
申请日：2003-01-21
申请人： Takuya Takahashi , Hiroyuki Tomimatsu
发明人： Takuya Takahashi , Hiroyuki Tomimatsu
IPC分类号： H01L23/02
CPC分类号： H01L24/85 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0657 , H01L2224/0401 , H01L2224/05552 , H01L2224/05624 , H01L2224/05647 , H01L2224/1134 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48647 , H01L2224/4911 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/13 , H01L2224/4554 , H01L2924/013
摘要： A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.
摘要翻译：第一线的末端被接合到第一电极。第一线从第一电极拉到第二电极上的凸块。第一线的一部分变形并结合到凸起。通过使刀具的至少一部分叠置在第一丝线上的状态，将形成为球状的第二丝线的前端接合到凸块。通过接合不会变形的第一线的一部分被第二线和工具的尖端防止变形。

45. 发明授权

US06946380B2 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment 有权
标题翻译：用于形成凸块的方法，具有凸块的半导体元件及其制造方法，半导体器件及其制造方法，电路板和电子设备
公开(公告)号：US06946380B2
公开(公告)日：2005-09-20
申请号：US10347474
申请日：2003-01-21
申请人： Takuya Takahashi
发明人： Takuya Takahashi
IPC分类号： H01L21/60 , H01L21/607 , H01L23/485 , H01L23/495 , H01L21/44
CPC分类号： H01L24/85 , H01L23/49575 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05552 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/14 , H01L2224/16245 , H01L2224/32145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48647 , H01L2224/4911 , H01L2224/49171 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.
摘要翻译：通过使用工具将形成为球形的线的末端接合到电极。线的一部分从结合到电极的尖端拉出。通过使用该工具使电极的与尖端连续的部分的电极变形，从而在电极上形成凸块。在电极上留下凸块的同时切割电线。

46. 发明授权

US06153448A Semiconductor device manufacturing method 有权
标题翻译：半导体器件制造方法
公开(公告)号：US06153448A
公开(公告)日：2000-11-28
申请号：US377864
申请日：1999-08-20
申请人： Takuya Takahashi , Akio Katsumata
发明人： Takuya Takahashi , Akio Katsumata
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/485 , H01L29/06 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/13 , H01L23/3114 , H01L24/11 , H01L24/48 , H01L24/73 , H01L2224/0231 , H01L2224/0401 , H01L2224/05548 , H01L2224/05599 , H01L2224/11334 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/48091 , H01L2224/4824 , H01L2224/484 , H01L2224/94 , H01L29/0657 , H01L2924/0001 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157
摘要： There is provided a semiconductor device having a chip-size package structure comprising a semiconductor pellet including semiconductor elements, wires, a plurality of electrode pads, and final protection film, an insulation layer serving also as a sealing layer formed to cover the entire surface of the semiconductor pellet having a via hole portion above each of the electrode pads in association therewith, a plurality of wiring patterns formed with a via hole wiring portion electrically connected to the electrode pad at the bottom of each of the via hole portions of the insulation layer and formed with a land portion connected thereto and located in a position offset from the via hole portion, and an external electrode in the form of a ball provided on the land portion of each of the wiring patterns. This makes it possible to provide a semiconductor device in a chip-size package structure in which the length of wires led out from electrode pads is shortened as much as possible to lead out wires from electrode pads near the center of the pellet easily and to allow a pellet having an increased number of external electrodes to be accommodated.
摘要翻译：提供了具有芯片尺寸封装结构的半导体器件，其包括半导体芯片，半导体芯片包括半导体元件，导线，多个电极焊盘和最终保护膜，还用作密封层的绝缘层，覆盖整个表面的所述半导体芯片具有与每个电极焊盘相关联的通孔部分，多个布线图案形成有通孔布线部分，其电连接到绝缘层的每个通孔部分的底部处的电极焊盘并且形成有连接到其上并位于偏离通孔部分的位置的平台部分，以及设置在每个布线图案的台面部分上的以球形形式的外部电极。这使得可以提供一种芯片尺寸封装结构中的半导体器件，其中从电极焊盘引出的导线的长度尽可能地缩短以便容易地从芯片的中心附近的电极焊盘引出线，并允许具有增加数量的待容纳的外部电极的颗粒。

47. 发明授权

US5977641A Semiconductor device and method for manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5977641A
公开(公告)日：1999-11-02
申请号：US76725
申请日：1998-05-13
申请人： Takuya Takahashi , Akio Katsumata
发明人： Takuya Takahashi , Akio Katsumata
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/485 , H01L29/06 , H01L21/66 , H01L24/78
CPC分类号： H01L24/13 , H01L23/3114 , H01L24/11 , H01L24/48 , H01L24/73 , H01L2224/0231 , H01L2224/0401 , H01L2224/05548 , H01L2224/05599 , H01L2224/11334 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/48091 , H01L2224/4824 , H01L2224/484 , H01L2224/94 , H01L29/0657 , H01L2924/0001 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157
摘要： There is provided a semiconductor device having a chip-size package structure comprising a semiconductor pellet including semiconductor elements, wires, a plurality of electrode pads, and final protection film, an insulation layer serving also as a sealing layer formed to cover the entire surface of the semiconductor pellet having a via hole portion above each of the electrode pads in association therewith, a plurality of wiring patterns formed with a via hole wiring portion electrically connected to the electrode pad at the bottom of each of the via hole portions of the insulation layer and formed with a land portion connected thereto and located in a position offset from the via hole portion, and an external electrode in the form of a ball provided on the land portion of each of the wiring patterns. This makes it possible to provide a semiconductor device in a chip-size package structure in which the length of wires led out from electrode pads is shortened as much as possible to lead out wires from electrode pads near the center of the pellet easily and to allow a pellet having an increased number of external electrodes to be accommodated.
摘要翻译：提供了具有芯片尺寸封装结构的半导体器件，其包括半导体芯片，半导体芯片包括半导体元件，导线，多个电极焊盘和最终保护膜，还用作密封层的绝缘层，覆盖整个表面的所述半导体芯片具有与每个电极焊盘相关联的通孔部分，多个布线图案形成有通孔布线部分，其电连接到绝缘层的每个通孔部分的底部处的电极焊盘并且形成有连接到其上并位于偏离通孔部分的位置的平台部分，以及设置在每个布线图案的台面部分上的以球形形式的外部电极。这使得可以提供一种芯片尺寸封装结构中的半导体器件，其中从电极焊盘引出的导线的长度尽可能地缩短以便容易地从芯片的中心附近的电极焊盘引出线，并允许具有增加数量的待容纳的外部电极的颗粒。

48. 发明授权

US5901071A Method of evaluating corrosion resistance of metal material, method of designing alloy of high corrosion resistance, method of diagnosing corroded state of metal material, and method of operating plant 失效
标题翻译：金属材料耐腐蚀性评价方法，耐腐蚀性合金的设计方法，金属材料腐蚀状态的诊断方法及操作方法
公开(公告)号：US5901071A
公开(公告)日：1999-05-04
申请号：US496586
申请日：1995-06-28
申请人： Masanori Sakai , Noriyuki Ohnaka , Yuichi Ishikawa , Haruo Fujimori , Yusuke Isobe , Takuya Takahashi
发明人： Masanori Sakai , Noriyuki Ohnaka , Yuichi Ishikawa , Haruo Fujimori , Yusuke Isobe , Takuya Takahashi
IPC分类号： C23F11/18 , C23F15/00 , G01N17/00 , G01N27/26 , G01N27/416 , G01N33/20 , G21D1/00 , G06F17/00
CPC分类号： G01N1/04 , G01N17/00
摘要： The composition of an alloy is inhomogeneous, so that the Fermi level of electrons in the surface of the alloy differs depending upon positions. It is accordingly considered that a part susceptible to corrosion and a part less susceptible thereto will coexist in the alloy. The corrosion rate of the alloy is indicated as the exponential function of a potential difference (.DELTA..PHI..sub.H) within an electric double layer. The potential difference remains unchanged as long as the Fermi level lies within the forbidden band of the electrons. However, in a range in which the Fermi level falls within the valence band of the electrons, the lowering thereof leads to the increase of the potential difference. Accordingly, a corrosion-resisting alloy is designed in accordance with the following guidelines: a) The electron energy level (Ev) of the valence band is low, b) an oxide film to be formed on the alloy is an n-type semiconductor, c) a band gap (Ec-Ev) is wide where Ec denotes the conduction band of the electrons, and d) a flatband potential (E.sub.f1) is low. Further, the operation of a plant and the evaluation of a corrosional damage can be based on such a theory.
摘要翻译：合金的组成是不均匀的，使得合金表面中的费米子电子水平根据位置而不同。因此，考虑到易于腐蚀的部分和对其不太敏感的部分将在合金中共存。合金的腐蚀速率表示为电双层内的电位差（DELTA PHI H）的指数函数。只要费米能级位于电子的禁带内，电位差就保持不变。然而，在费米能级落在电子的价带内的范围内，其降低导致电位差的增加。因此，根据以下准则设计耐腐蚀合金：a）价带的电子能级（Ev）低，b）在合金上形成的氧化膜是n型半导体， c）带隙（Ec-Ev）宽，其中Ec表示电子的导带，d）扁平带电位（Ef1）低。此外，植物的操作和腐蚀性损害的评估可以基于这样的理论。

49. 发明授权

US5609492A Electrical connector having linkage connecting cap with connector housing 失效
标题翻译：电连接器具有连接帽和连接器外壳
公开(公告)号：US5609492A
公开(公告)日：1997-03-11
申请号：US547149
申请日：1995-10-24
申请人： Kazuomi Sato , Toshihiro Kume , Yoshiaki Ichimura , Takuya Takahashi
发明人： Kazuomi Sato , Toshihiro Kume , Yoshiaki Ichimura , Takuya Takahashi
IPC分类号： H01R13/52 , H01R13/44
CPC分类号： H01R13/5213
摘要： An electrical connector having a cap rotatable by a link mechanism, there are a connector housing, a first link having a symmetrical structure of both sides of the connector housing and pivoted at the connector housing, a second link having a symmetrical structure of both sides of the connector housing and pivoted at the first link, a cap pivoted at the second link, a sealing member installed at circumference of the cap or a connector on the connector housing, and wherein at least one of the first link and the second link is made of a one piece member. The cap is fitted to a top of the connector housing, and covers the connector to lead into a waterproof state. When an operator pushes up a handle of the second link by his finger, the first link and the second link rotate. Then the cap takes off from the top of the connector housing, and so the connector is ready for electrical connection. Further, when the operator pushes down the handle of the second link by his finger, the first link and the second link rotate more. The cap fits to a bottom of the connector housing finally.
摘要翻译：一种具有可由连杆机构旋转的盖的电连接器，具有连接器壳体，具有连接器壳体的两侧的对称结构并在连接器壳体枢转的第一连杆，具有对称结构的第二连杆，所述连接器壳体在所述第一连杆处枢转，在所述第二连杆处枢转的盖，安装在所述盖的圆周处的密封构件或所述连接器壳体上的连接器，并且其中所述第一连杆和所述第二连杆中的至少一个被制成的一个成员。盖子安装在连接器外壳的顶部，并覆盖连接器以导致防水状态。当操作者用手指推动第二连杆的手柄时，第一连杆和第二连杆旋转。然后盖子从连接器外壳的顶部脱离，因此连接器已准备好进行电气连接。此外，当操作者用手指向下按压第二连杆的手柄时，第一连杆和第二连杆旋转更多。帽最后适合连接器外壳的底部。

50. 发明授权

US5186798A Solution quantitative analysis apparatus, quantitative analysis methods, and nuclear reactor water quality control system 失效
标题翻译：解决方案定量分析仪器，定量分析方法和核反应堆水质控制系统
公开(公告)号：US5186798A
公开(公告)日：1993-02-16
申请号：US514970
申请日：1990-04-26
申请人： Masanori Sakai , Katsumi Ohsumi , Noriyuki Ohnaka , Eiji Kikuchi , Katsumi Mabuchi , Takuya Takahashi
发明人： Masanori Sakai , Katsumi Ohsumi , Noriyuki Ohnaka , Eiji Kikuchi , Katsumi Mabuchi , Takuya Takahashi
IPC分类号： G01N27/42
CPC分类号： G01N27/42
摘要： This invention comprises electrochemical analytical devices capable of performing electrolysis in multiple pulse modes. It relates to a method of quantitative analysis and equipment for performing quantitative analysis which uses a combination of these pulse modes to realize the measurement of concentrations of multiple substances to be measured, occurring in the test solution to be measured and also a nuclear reactor water quality control system employing such a quantitative analysis method.
摘要翻译：本发明包括能够以多种脉冲模式进行电解的电化学分析装置。它涉及一种定量分析方法和进行定量分析的设备，该方法采用这些脉冲模式的组合来实现要测量的测试溶液中发生的待测量的多种物质的浓度以及核反应堆的水质采用这种定量分析方法的控制系统。

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