专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

US20060057839A1 Method and apparatus for forming metal film 有权
公开(公告)号：US20060057839A1
公开(公告)日：2006-03-16
申请号：US11219777
申请日：2005-09-07
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
IPC分类号： H01L21/4763 , H01L21/20
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , C23C18/32 , H01L21/76846 , H01L21/76849 , H01L21/76874
摘要： A metal film-forming method of the present invention can form a metal film having different film qualities in the thickness direction, in a continuous manner using a single processing solution. The metal film-forming method including: providing a substrate having embedded interconnects formed in interconnect recesses provided in a surface of the substrate; and forming a metal film, having different film qualities in the thickness direction, on surfaces of the interconnects in a continuous manner by changing the flow state of a processing solution relative to the surface of the substrate while keeping the surface of the substrate in contact with the processing solution.

42. 发明申请

US20050064702A1 Interconnects forming method and interconnects forming apparatus 有权
标题翻译：互连形成方法和互连形成装置
公开(公告)号：US20050064702A1
公开(公告)日：2005-03-24
申请号：US10896014
申请日：2004-07-22
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga
IPC分类号： H01L21/3205 , H01L21/768 , H01L21/4763
CPC分类号： H01L21/76849 , H01L21/76819 , H01L21/7685 , Y10S438/976 , Y10T29/41
摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, light exposure or the like processing for the formation of interconnect recesses in the production of multi-level interconnects, can improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and can enhance the reliabilityof the device. The interconnects-formingmethod, including: providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.
摘要翻译：本发明提供一种互连形成方法和互连形成装置，其可以最小化在制造多层互连中形成互连凹槽的蚀刻，曝光等处理中的处理精度的降低，互连的电迁移电阻，而不损害互连的电性能，并且可以提高器件的可靠性。所述互连形成方法包括：在形成在基板的表面中的绝缘膜中提供互连凹槽; 在互连凹槽中嵌入互连材料，同时在绝缘膜的表面上形成互连材料的金属膜; 除去互连凹部中的金属材料以外的多余的金属材料，使基板表面变平，从而形成互连件; 在互连的暴露表面上选择性地形成导电材料的第一保护膜; 在具有如此形成的第一保护膜的基板的表面上形成第二保护膜; 在具有如此形成的第二保护膜的基板的表面上形成层间绝缘膜; 并平坦化层间绝缘膜的表面。

43. 发明授权

US06354747B1 Optical module 失效
标题翻译：光模块
公开(公告)号：US06354747B1
公开(公告)日：2002-03-12
申请号：US09219901
申请日：1998-12-24
申请人： Takeshi Irie , Kazunori Kurima , Ichiro Tonai , Toshio Mizue , Daisuke Takagi
发明人： Takeshi Irie , Kazunori Kurima , Ichiro Tonai , Toshio Mizue , Daisuke Takagi
IPC分类号： G02B636
CPC分类号： G02B6/4292 , G02B6/4201
摘要： The present invention relates to an optical module or the like having a structure which prevents the efficiency in a sleeve securing operation or optical characteristics from deteriorating and improves adhesion durability. In particular, a resin mold portion including an optical device in the optical module according to the present invention is processed into a shape which can directly irradiate the UV-curable resin introduced between the resin mold portion and the sleeve with ultraviolet rays, and a structure for restricting the flow of the resin changing into a flowing state during the sleeve securing operation or a structure for improving the adhesion durability of the sleeve is provided on at least one of the sleeve side and resin mold portion side.
摘要翻译：本发明涉及具有防止套筒固定操作或光学特性劣化并提高粘合耐久性的结构的光学模块等。特别地，将根据本发明的光学组件中的光学装置的树脂模具部分加工成可以用紫外线直接照射引入到树脂模制部分和套筒之间的UV固化树脂的形状，为了限制在套筒固定操作期间树脂变成流动状态的流动，或者在套筒侧和树脂模制部分侧中的至少一个上提供用于提高套筒的粘合耐久性的结构。

44. 外观设计

USD396210S Optical receiver/transmitter module 失效
公开(公告)号：USD396210S
公开(公告)日：1998-07-21
申请号：US55822
申请日：1996-05-03
申请人： Nobuo Shiga , Takeshi Sekiguchi , Sosaku Sawada , Daisuke Takagi
设计人： Nobuo Shiga , Takeshi Sekiguchi , Sosaku Sawada , Daisuke Takagi

45. 发明授权

US10647111B2 Liquid droplet forming device and liquid droplet forming method 有权
公开(公告)号：US10647111B2
公开(公告)日：2020-05-12
申请号：US16294969
申请日：2019-03-07
申请人： Yuzuru Kuramochi , Daisuke Takagi , Satoshi Okano , Takahiko Matsumoto , Koichi Muramatsu , Satoshi Nakazawa , Ryuya Mashiko
发明人： Yuzuru Kuramochi , Daisuke Takagi , Satoshi Okano , Takahiko Matsumoto , Koichi Muramatsu , Satoshi Nakazawa , Ryuya Mashiko
IPC分类号： B41J2/045 , B41J2/14
摘要： Provided is a liquid droplet forming device including: a liquid container capable of containing a liquid; a membranous member disposed at a bottom of the liquid container and including a discharging hole; a deforming unit capable of deforming the membranous member; and a driving unit configured to drive the deforming unit by outputting a discharging signal for deforming the membranous member to discharge the liquid or a suppressing signal for suppressing residual vibration of the membranous member, wherein the suppressing signal is a signal based on natural vibration period T0 of the membranous member, wherein an amplitude of the suppressing signal is lower than or equal to an amplitude of the discharging signal, and wherein interval time Ti from when outputting of the discharging signal is ended until when outputting of the suppressing signal is started satisfies a formula: Ti=(m−½)×T0, where m represents a positive integer.

46. 发明授权

US09517622B2 Liquid droplet forming apparatus 有权
标题翻译：液滴形成装置
公开(公告)号：US09517622B2
公开(公告)日：2016-12-13
申请号：US14969236
申请日：2015-12-15
申请人： Yuzuru Kuramochi , Yoshio Uchikata , Daisuke Takagi , Manabu Seo
发明人： Yuzuru Kuramochi , Yoshio Uchikata , Daisuke Takagi , Manabu Seo
IPC分类号： B41J2/14
CPC分类号： B41J2/14233 , B41J2/14201 , B41J2202/15
摘要： There is provided a liquid droplet forming apparatus comprising: a liquid holding part configured to hold a liquid including precipitating particles; a film member configured to be vibrated so as to eject the liquid held in the liquid holding unit, wherein a nozzle is formed in the film member and the liquid is ejected as a droplet from the nozzle; a vibrating unit configured to vibrate the film member; and a driving unit configured to selectively apply an ejection waveform and a stirring waveform to the vibrating unit, wherein the film member is vibrated to form the droplet in response to applying the ejection waveform and the film member is vibrated without forming the droplet in response to applying the stirring waveform.
摘要翻译：提供了一种液滴形成装置，包括：液体保持部，被配置为保持包含沉淀颗粒的液体; 被配置为振动以便将保持在所述液体保持单元中的液体喷射的膜构件，其中在所述膜构件中形成喷嘴并且所述液体从所述喷嘴以液滴的形式喷出; 振动单元，其构造成使所述薄膜构件振动; 以及驱动单元，被配置为选择性地向振动单元施加喷射波形和搅拌波形，其中响应于施加喷射波形而使膜构件振动以形成液滴，并且膜构件响应于施加搅拌波形。

47. 发明授权

US09463623B2 Liquid ejection head and image forming apparatus incorporating same 有权
标题翻译：液体喷射头和结合其的图像形成装置
公开(公告)号：US09463623B2
公开(公告)日：2016-10-11
申请号：US14203778
申请日：2014-03-11
申请人： Daisuke Takagi , Hisashi Habashi , Tomoyuki Aratani , Tatsuya Sameshima , Shinichi Kakuda , Keisuke Hayashi , Juichi Furukawa
发明人： Daisuke Takagi , Hisashi Habashi , Tomoyuki Aratani , Tatsuya Sameshima , Shinichi Kakuda , Keisuke Hayashi , Juichi Furukawa
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1642 , B41J2/1646
摘要： A liquid ejection head includes channel forming members and a surface treatment film. The channel forming members are joined to each other via an adhesive agent to form a channel for liquid. The surface treatment film is formed on a surface of at least one of the channel forming members. The surface treatment film is an oxidized film including Si. The oxidized film further includes a transition metal forming a passive film.
摘要翻译：液体喷射头包括通道形成构件和表面处理膜。通道形成构件通过粘合剂彼此连接以形成用于液体的通道。表面处理膜形成在至少一个通道形成构件的表面上。表面处理膜是包含Si的氧化膜。氧化膜还包括形成钝化膜的过渡金属。

48. 发明申请

US20090000549A1 Substrate processing method and apparatus 审中-公开
标题翻译：基板加工方法及装置
公开(公告)号：US20090000549A1
公开(公告)日：2009-01-01
申请号：US12216147
申请日：2008-06-30
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
IPC分类号： B05C11/00
CPC分类号： H01L21/76849 , C23C18/1608 , C23C18/1675 , C23C18/1692 , C23C18/1879 , H01L21/288 , H01L21/76864 , H01L21/76874 , H01L22/12 , H01L22/20 , H01L2223/54466
摘要： There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.
摘要翻译：提供了可以根据需要测量和监测在基板上形成的膜的厚度和/或性能的基板处理方法和装置，并且可以快速地校正工艺条件的偏差，因此可以稳定地提供恒定品质的产品。一种基板处理方法，用于处理具有金属和绝缘材料的基板，所述基板以其金属的暴露表面作为基准面的方式选择性地或优先地改变的金属的膜厚度包括测量处理期间和/或紧随其后的金属的膜厚度和/或膜性质的变化，以及基于该测量结果的监测处理和调整处理条件。

49. 发明授权

US07433777B2 Engine protection system and method for construction machine 有权
标题翻译：发动机保护系统及施工机械方法
公开(公告)号：US07433777B2
公开(公告)日：2008-10-07
申请号：US10590218
申请日：2005-11-07
申请人： Takanobu Ikari , Yoshinori Ohwada , Yoshinori Furuno , Shinji Akino , Daisuke Takagi
发明人： Takanobu Ikari , Yoshinori Ohwada , Yoshinori Furuno , Shinji Akino , Daisuke Takagi
IPC分类号： G06F19/00 , B60Q1/00 , F02D41/14 , G01M15/05
CPC分类号： F02D41/1446 , E02F9/226 , E02F9/24 , E02F9/26 , F02D41/008 , F02D41/221 , Y02T10/40
摘要： An engine protection system for a construction machine can individually diagnose the exhaust temperature specific to each cylinder of an engine corresponding to an engine revolution speed in order to find an abnormal condition of each engine cylinder in advance. A revolution speed sensor 14 detects revolution speed of an engine mounted in the construction machine and, a plurality, e.g., 16, cylinder temperature sensors 20a-20p detect exhaust temperatures of respective cylinders of the engine. A data recording unit 26 and a display controller 24 store the detected engine revolution speed and the detected exhaust temperatures of the respective cylinders. Trend data, which is produced based on the stored data, is sent to an office via a portable terminal and the display controller 24 outputs, a signal for playing back and displaying snapshots based on the stored data to a display unit 23 disposed in the cab 5.
摘要翻译：用于施工机械的发动机保护系统可以单独地诊断与发动机转速相对应的发动机的每个气缸的排气温度，以便事先找到每个发动机气缸的异常状况。转速传感器14检测安装在建筑机械中的发动机的转速，并且多个例如16个气缸温度传感器20a-20p检测发动机的各个气缸的排气温度。数据记录单元26和显示控制器24存储检测到的发动机转速和检测到的气缸的排气温度。基于所存储的数据产生的趋势数据经由便携式终端被发送到办公室，并且显示控制器24根据所存储的数据向设置在驾驶室中的显示单元23输出用于回放和显示快照的信号 5。

50. 发明申请

US20080203420A1 Collective Substrate, Semiconductor Element Mount, Semiconductor Device, Imaging Device, Light Emitting Diode Component and Light Emitting Diode 有权
标题翻译：集成基板，半导体元件安装，半导体器件，成像装置，发光二极管部件和发光二极管
公开(公告)号：US20080203420A1
公开(公告)日：2008-08-28
申请号：US10589747
申请日：2005-07-21
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L33/00 , H01L23/14 , H01L31/0203 , H05K1/09
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).
摘要翻译：通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。通孔（11）各自具有包括锥形表面（11b，11c）的内表面，该锥形表面（11b，11c）从开口尺寸从主表面（21）和外部连接表面（22）逐渐减小到最小大小孔部分（11a）。锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）分别形成钝角θ1，θ2。半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。成像装置（PE2）包括安装在由框架（4）包围的区域中的成像元件（PE 1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL ）。发光二极管部件（LE2）包括安装在绝缘部件（2）的主表面（21）上的发光元件（LE 1），其中填充有通孔的最小尺寸的孔部分（11a）用导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。发光二极管（LE 3）包括安装在封装（7）中的发光二极管部件（LE 2）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式