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    • 42. 发明授权
    • Semiconductor memory device having power line arranged in a meshed shape
    • 具有布置成网状的电力线的半导体存储器件
    • US5426615A
    • 1995-06-20
    • US224461
    • 1994-04-07
    • Shigeki TomishimaMikio AsakuraKazutami ArimotoHideto Hidaka
    • Shigeki TomishimaMikio AsakuraKazutami ArimotoHideto Hidaka
    • G11C5/14G11C7/06G11C5/02
    • G11C7/06G11C5/14
    • A semiconductor memory device includes a sense amp band comprising a plurality of sense amplifiers, and a plurality of power supply and ground lines arranged in a meshed shape. Power supply and ground lines include lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to a power supply and ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. Each drive component is provided for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of power supply and ground lines arranged in a meshed shape are contacted at crossings. Therefore, in the semiconductor memory device, no distribution of power supply potential is generated to allow a stable supply of a power supply and ground potential to an arbitrary circuit portion. In addition, since a sense amplifier is connected to proximate power supply and ground lines through a drive component, a reliable and high-speed sensing operation is possible irrespective of a length of a sense amp drive signal line.
    • 半导体存储器件包括包括多个读出放大器的检测放大器带以及以网状形状布置的多个电源和接地线。 电源和接地线包括与感测放大器带平行并接近的线。 感测放大器频带中的每个读出放大器通过驱动部件连接到布置在感测放大器附近并与其平行布置的电源和接地线。 每个驱动部件被提供用于预定数量的读出放大器,并且响应于来自与感测放大器频带平行布置的信号线的读出放大器激活信号而被导通。 布置成网状的多个电源和接地线在交叉点处接触。 因此,在半导体存储装置中,不产生电源电位的分配,能够稳定地供给任意的电路部分的电源和接地电位。 此外,由于读出放大器通过驱动部件连接到邻近的电源和接地线,所以无论感测放大器驱动信号线的长度如何,都可以进行可靠且高速的感测操作。
    • 46. 发明授权
    • Semiconductor memory device for simple cache system
    • 半导体存储器件,用于简单缓存系统
    • US06404691B1
    • 2002-06-11
    • US08472770
    • 1995-06-07
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • G11C700
    • G06F12/0893G11C7/1021
    • A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
    • 一种半导体存储器件包括:DRAM存储单元阵列,包括以多行和多列布置的多个动态型存储单元;以及SRAM存储单元阵列,其包括排列成多行和列的静态型存储单元。 DRAM存储单元阵列被分成多个块,每个块包括多个列。 SRAM存储单元阵列被分成多个块,每个块包括对应于DRAM存储单元阵列中的多个块的多个列。 SRAM存储单元阵列用作高速缓冲存储器。 在缓存命中时,数据被访问到SRAM存储单元阵列。 在缓存未命中时,数据被存取到DRAM存储单元阵列。 在这种情况下,对应于DRAM存储单元阵列中的每个块中的一行的数据被传送到SRAM存储单元阵列中相应块中的一行。