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    • 44. 发明授权
    • Electromagnetic interference (EMI) collar and method for use with a pluggable optical transceiver module
    • 电磁干扰(EMI)领和与可插拔光收发模块一起使用的方法
    • US07597590B2
    • 2009-10-06
    • US12205328
    • 2008-09-05
    • Laurence R. McColloch
    • Laurence R. McColloch
    • H01R13/648
    • G02B6/4292G02B6/4201G02B6/4246G02B6/4261G02B6/4277H01R13/6582H05K9/0018H05K9/0058Y10T29/49204Y10T29/49218
    • An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar will not be damaged when the transceiver module housing is inserted into a cage. Ensuring that the collar will not be damaged during insertion ensures that electrically conductive contact points on the collar will not be eliminated by insertion of the housing into a cage. In addition, dimples, or indentations, formed on the spring fingers of the EMI collar result in additional electrically conductive contact points on the fingers that result in a reduction in the size of the maximum EMI aperture dimension of the collar. Reducing the maximum EMI aperture dimension of the collar greatly improves the ability of the collar to attenuate EMI signals, even EMI signals having high frequencies.
    • 提供了一个EMI套环,其配置成围绕可插拔光收发器模块的壳体固定。 EMI套环的结构和套环附接到收发器模块的壳体的方法确保了当收发器模块壳体插入笼中时,套环不会被损坏。 确保在插入过程中不会损坏套环,从而通过将外壳插入保持架中不会消除套环上的导电接触点。 此外,形成在EMI环圈的弹簧指上的凹坑或凹痕导致手指上的额外的导电接触点,导致轴环的最大EMI孔径尺寸的减小。 降低轴环的最大EMI孔径大大提高了套环衰减EMI信号的能力,甚至具有高频率的EMI信号。
    • 45. 发明申请
    • MODIFIED TRANSISTOR OUTLINE (TO)-CAN ASSEMBLY FOR USE IN OPTICAL COMMUNICATIONS AND A METHOD
    • 修改后的晶体管外形(TO) - 组件用于光通信和方法
    • US20150192747A1
    • 2015-07-09
    • US14666427
    • 2015-03-24
    • Laurence R. McColloch
    • Laurence R. McColloch
    • G02B6/42
    • G02B6/4263G02B6/4214G02B6/4246G02B6/4295G02B6/4296
    • A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.
    • 提供了一种改进的TO-can组件,其相对于已知的TO-can组件具有比空间约束更大的通用性,并且适用于比已知的TO-can组件更广泛的应用范围。 改进的TO-can组件具有已被修改为通过其侧面而不是通过其端部接收光纤的插座。 在TO-can组件内,光路被折叠以便耦合TOSA或ROSA的光电子部件与光纤端部之间的光。 这些特征的组合提供了具有紧凑轮廓的改进的TO-can组件,使得其相对于空间约束更为通用,因此适用于更广泛的应用。
    • 46. 发明授权
    • Thermally compensated parallel optical communication module
    • 热补偿并联光通信模块
    • US08840323B2
    • 2014-09-23
    • US13594957
    • 2012-08-27
    • Laurence R. McColloch
    • Laurence R. McColloch
    • G02B6/36
    • G02B6/4214G02B6/4206G02B6/4246G02B6/425G02B6/4267
    • In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements.
    • 在并行光通信模块中,相对于固定装置固定的光电器件阵列和光学装置的光学元件阵列,其也相对于安装座固定,不会因为热膨胀的热膨胀而相对移动 安装和光学设备。 安装和光学装置可以由具有相似的热膨胀系数的材料制成。 随着安装座中的热膨胀导致光电器件移动,光学器件中类似的热膨胀使得光学元件移动到相似的程度。 光电器件和光学元件的这种共同运动相似的程度促进了光电子元件与对应的光学元件之间的光学对准的持续维护。