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    • 45. 发明申请
    • Reaction detecting device
    • 反应检测装置
    • US20070031290A1
    • 2007-02-08
    • US11497324
    • 2006-08-02
    • Yuichi TamaokiTadahisa SagaTakashi AraiYasuhiro Kikuchi
    • Yuichi TamaokiTadahisa SagaTakashi AraiYasuhiro Kikuchi
    • G01N21/00
    • G01N21/6452G01N21/0332
    • An object is to provide a reaction detecting device in which a height dimension of the device itself can be set to be small to realize space saving, unevenness of measurement sensitivity for each reaction container is minimized, and high-sensitivity and high-precision reaction detecting is possible, the device includes: a reflective plate disposed above a temperature controllable reaction block disposed in a reaction chamber constituted in a main body to reflect light; and a light source lamp and a camera arranged in the main body, the light from the light source lamp is reflected by the reflective plate to enter each reaction container from above, and light such as fluorescence directed upwards from a reaction specimen is reflected by the reflective plate to enter the camera.
    • 本发明的目的是提供一种反应检测装置,其中可以将装置本身的高度尺寸设置得较小以实现节省空间,使每个反应容器的测量灵敏度的不均匀性最小化,并且具有高灵敏度和高精度的反应检测 该装置包括:设置在构成在主体中的反应室内的温度可控反应块上方以反射光的反射板; 以及设置在主体中的光源灯和照相机,来自光源灯的光被反射板反射,从上方进入各反应容器,从反应样本向上的荧光等被反射 反光板进入相机。
    • 50. 发明授权
    • Semiconductor wafer polishing apparatus
    • 半导体晶片抛光装置
    • US6074287A
    • 2000-06-13
    • US834665
    • 1997-04-11
    • Akira MiyajiTakashi AraiTakeshi Yagi
    • Akira MiyajiTakashi AraiTakeshi Yagi
    • B24B37/20B24B49/12B24D7/12B24B7/22
    • B24B37/205B24B49/12
    • Polishing laps and apparatus incorporating such polishing laps for polishing workpieces such as semiconductor wafers are disclosed. The polishing laps are made from a cured mixture of an epoxy resin and a filler material, and preferably have at least a portion that is transparent to light. The polishing lap is preferably mounted on rigid polishing wheel or the like with or without an intervening layer such as an elastic layer. Polishing apparatus incorporating the polishing lap preferably include a light source for directing a beam of light toward the transparent portion of the polishing lap to enable the light beam to reflect from the working surface of the workpiece as the workpiece is being polished by the polishing lap. The apparatus also preferably includes a light detector for detecting light reflected from the surface of the workpiece. Such light can provide information, as on the status of the working surface as polishing progresses and can provide an indication of when polishing has reached a desired end point.
    • 公开了用于抛光工件如半导体晶片的抛光圈和装有这种抛光圈的装置。 抛光圈由环氧树脂和填充材料的固化混合物制成,并且优选具有至少一部分对光透明的部分。 抛光搭扣优选安装在具有或不具有中间层(例如弹性层)的刚性抛光轮等上。 结合了抛光搭扣的抛光装置优选地包括一个光源,用于将光束引导到抛光搭盘的透明部分,以使得当工件被抛光圈抛光时,光束能够从工件的工作表面反射。 该装置还优选地包括用于检测从工件的表面反射的光的光检测器。 这样的光可以提供关于作为抛光进行的工作表面的状态的信息,并且可以提供何时抛光已经达到期望的终点。