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41. 外观设计

USD775675S1 Refrigerator 有权
公开(公告)号：USD775675S1
公开(公告)日：2017-01-03
申请号：US29541829
申请日：2015-10-08
申请人： Samsung Electronics Co., Ltd.
设计人： Kisoo Kim , Sanghoon Lee , Yeonjin Jo

42. 外观设计

USD773539S1 Refrigerator 有权
公开(公告)号：USD773539S1
公开(公告)日：2016-12-06
申请号：US29538516
申请日：2015-09-04
申请人： Samsung Electronics Co., Ltd.
设计人： Kisoo Kim , Sanghoon Lee

43. 发明授权

US09231715B2 I/Q mismatch compensation method and apparatus 有权
标题翻译： I / Q失配补偿方法和装置
公开(公告)号：US09231715B2
公开(公告)日：2016-01-05
申请号：US14589584
申请日：2015-01-05
申请人： Samsung Electronics Co., Ltd.
发明人： Donghan Kim , Sungtae Choi , Jaehwa Kim , Yiju Roh , Sanghoon Lee
IPC分类号： H04B1/38 , H04B17/14 , H03D3/00 , H04L27/36 , H04L27/38 , H04B17/21 , H04B17/24 , H04L1/24
CPC分类号： H04B17/14 , H03D3/009 , H04B17/21 , H04B17/24 , H04L1/243 , H04L27/364 , H04L27/3863
摘要： An In-phase/Quadrature phase (I/Q) mismatch compensation method of a transceiver is provided. The method includes establishing a first loopback path between a transmitter and a receiver, transmitting a training sequence from the transmitter to the receiver through the established first loopback path, acquiring, at the receiver, a first correlation result value by correlating the training sequence received through the established first loopback path, establishing a second loopback path between the transmitter and the receiver, transmitting the training sequence from the transmitter to the receiver through the established second loopback path, acquiring, at the receiver, a second correlation result value by correlating the training sequence received through the second loopback path, and estimating I/Q mismatch values of the transmitter and the receiver using the first and second correlation result values.
摘要翻译：提供收发器的同相/正交相位（I / Q）失配补偿方法。该方法包括建立发射机和接收机之间的第一环回路径，通过建立的第一环回路径将训练序列从发射机发射到接收机，在接收机处通过将接收到的训练序列相关联来获取第一相关结果值建立的第一环回路径，在发射机和接收机之间建立第二环回路径，通过所建立的第二环回路径将训练序列从发射机发送到接收机，在接收机处通过将训练相关联来获取第二相关结果值通过第二环回路径接收的序列，以及使用第一和第二相关结果值估计发射机和接收机的I / Q不匹配值。

44. 发明公开

US20240112606A1 IMAGE PROCESSING DEVICE, OPERATING METHOD THEREOF, AND DISPLAY SYSTEM INCLUDING IMAGE PROCESSING DEVICE 审中-公开
公开(公告)号：US20240112606A1
公开(公告)日：2024-04-04
申请号：US18372350
申请日：2023-09-25
申请人： Samsung Electronics Co., Ltd.
发明人： Deoksoo PARK , Seungwan Kim , Yongkwon Cho , Byoungju Song , Sanghoon Lee
IPC分类号： G09G3/00 , G06T5/00 , G06T5/50
CPC分类号： G09G3/03 , G06T5/001 , G06T5/50 , G09G2320/02 , G09G2340/10
摘要： An image processing device is provided. The image processing device includes: an image quality enhancement circuit configured to generate second image data indicating a plurality of pixel values corresponding to a quadrangular shape by performing image quality enhancement processing on first image data; a map decoder configured to read a map, which includes a plurality of pixel adjustment values for adjusting brightness of a first region of the second image data corresponding to a curved edge of a display panel, from a memory and provide alpha values indicated by the map; a processing circuit configured to generate third image data by adjusting the brightness of the first region by applying the alpha values to the second image data; and a transmission circuit configured to output the third image data to a display driving integrated circuit.

45. 发明授权

US11822693B2 Electronic device mounted on vehicle and operating method of the electronic device 有权
公开(公告)号：US11822693B2
公开(公告)日：2023-11-21
申请号：US17236027
申请日：2021-04-21
申请人： Samsung Electronics Co., Ltd.
发明人： Hyunsik Ki , Sangchul Ku , Youngil Kim , Junhong Kim , Sanghoon Lee , Woong Lee , Junhyun Yim
IPC分类号： G06F21/62 , H04W4/48 , G06V20/59
CPC分类号： G06F21/6245 , G06V20/593 , H04W4/48
摘要： An electronic device is disclosed, including a sensor module configured to recognize boarding and alighting of a passenger from the vehicle, a network interface configured to communicate with a mobile device disposed in the vehicle, a memory, storing a program including one or more instructions, and a processor. The processor implements a method, including: detecting alighting of the passenger using the sensor module, or when a mobile device disconnects from the network interface, determining, by the processor, a deletion level for data related to personal information of a passenger, the deletion level based on a use history information of the passenger, including a latest use time and a use frequency, and deleting the data from the memory according to the determined deletion level.

46. 发明授权

US11636861B2 Electronic device and method of operation thereof 有权
公开(公告)号：US11636861B2
公开(公告)日：2023-04-25
申请号：US16476364
申请日：2017-10-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Junhui Kim , Subhojit Chakladar , Tae-Jin Lee , Sanghoon Lee
IPC分类号： G10L17/12 , G06F1/3209 , G06F1/3215
摘要： Various embodiments of the disclosure provide a method and apparatus for processing a voice command in an electronic device. According to various embodiments of the disclosure, the electronic device includes a microphone, a memory, and a processor operatively coupled to the microphone and the memory. The processor may be configured to wake up on the basis of detection of a voice call command, calculate a score related to recognition of the voice call command, share the score with an external device, decide whether to execute a voice command on the basis of the score, and process the voice command on the basis of the decision result. Various embodiments are possible.

47. 发明授权

US11626381B2 Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same 有权
公开(公告)号：US11626381B2
公开(公告)日：2023-04-11
申请号：US16837025
申请日：2020-04-01
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jonggu Lee , Sunghyup Kim , Byungjo Kim , Sanghoon Lee , Sukwon Lee , Sebin Choi
IPC分类号： H01L23/00 , B29C65/30 , B29C65/00
摘要： A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

48. 发明授权

US11551944B2 Apparatus and method of manufacturing solder bump 有权
公开(公告)号：US11551944B2
公开(公告)日：2023-01-10
申请号：US17012624
申请日：2020-09-04
申请人： Samsung Electronics Co., Ltd.
发明人： Sungyong Yun , Sanghoon Lee , Sungil Lee
IPC分类号： H01L21/67 , H01L23/00
摘要： An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.

49. 发明授权

US11460695B2 Display apparatus 有权
公开(公告)号：US11460695B2
公开(公告)日：2022-10-04
申请号：US17091591
申请日：2020-11-06
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Kyehoon Lee , Jigwang Kim , Jiwon Kim , Jaemin Soh , Sanghoon Lee , Daesu Choi
IPC分类号： G02B27/01 , G02F1/1335 , G02F1/017
摘要： A display apparatus includes a light source array in which a plurality of light sources emitting light by a local dimming are arranged, a color conversion layer comprising color conversion particles that convert the emitted light into light of a certain color, and configured to emit white light by using the converted light, a display panel configured to generate an image by using the white light, and a selective transmission member arranged between the light source array and the color conversion layer. The selective transmission member is configured to transmit the light to the color conversion layer, and avoid transmitting the light in the color conversion layer to the light source array.

50. 发明授权

US11444529B2 Electronic apparatus and power supply 有权
公开(公告)号：US11444529B2
公开(公告)日：2022-09-13
申请号：US17126290
申请日：2020-12-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Duhee Jang , Kangmoon Seo , Wonmyung Woo , Sanghoon Lee , Jungho Lee
IPC分类号： H02M1/32 , H02M1/44 , H02M7/217
摘要： A power supply capable of protecting a rectifier circuit using a switching element from an overvoltage or an overcurrent is provided. The power supply includes a power input terminal; an output capacitor; a synchronous rectifier configured to rectify an AC voltage input through the power input terminal; a converter configured to convert the rectified AC voltage into a DC voltage following a preset voltage and supply the DC voltage to the output capacitor; and a protection circuit provided between the power input terminal and the output capacitor, and configured to supply an AC voltage higher than the voltage charged in the output capacitor to the output capacitor by bypassing the synchronous rectifier.

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