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    • 44. 发明授权
    • Adaptive antenna
    • 自适应天线
    • US6061553A
    • 2000-05-09
    • US2394
    • 1998-01-02
    • Hidehiro MatsuokaHiroki ShokiAkihiro TsujimuraYasushi Murakami
    • Hidehiro MatsuokaHiroki ShokiAkihiro TsujimuraYasushi Murakami
    • H01Q3/26H04B1/06
    • H01Q3/2652H01Q3/2605H01Q3/2611
    • An adaptive antenna is disclosed, that comprises a plurality of antenna elements 1.sub.1, 1.sub.2, . . . , and 1.sub.N with different directivity, delay profile measuring units 2.sub.1, 2.sub.2, . . . , and 2.sub.N for estimating states of received signals of the antenna elements for each of delay times that have been designated, antenna selecting units 3.sub.1, 3.sub.2, . . . , and 3.sub.L for selecting a part of the antenna elements for each of the delay times corresponding to the estimated result, adaptive signal processing portions 4.sub.1, 4.sub.2, . . . , and 4.sub.L for determining the received signals of the part of the antenna elements that have been selected and multiplying the received signals to which relevant weights have been determined for each of the delay time and summing the weighted signals, delaying circuits 5.sub.2 and 5.sub.3 for compensating the time lag, or delay of each of the received signals for each of the delay times, and a combining unit 6 for combining the weighted signals that have been compensated for the delay times.
    • 公开了一种自适应天线,其包括多个天线元件11,12。 。 。 ,和1N具有不同的方向性,延迟分布测量单元21,22。 。 。 以及2N,用于估计每个被指定的延迟时间的天线元件的接收信号的状态,天线选择单元31,32。 。 。 以及3L,用于对应于估计结果的每个延迟时间选择天线元件的一部分,自适应信号处理部分41,42,...。 。 。 和4L,用于确定已经选择的天线元件的部分的接收信号,并且对已经为每个延迟时间确定了相关权重的接收信号并对加权信号求和,对延迟电路52和53进行补偿 每个延迟时间的每个接收信号的时间延迟或延迟,以及用于组合已经被补偿了延迟时间的加权信号的组合单元6。
    • 47. 发明授权
    • Radio device
    • 无线电设备
    • US09184492B2
    • 2015-11-10
    • US13178967
    • 2011-07-08
    • Yukako TsutsumiHiroki ShokiShuichi Obayashi
    • Yukako TsutsumiHiroki ShokiShuichi Obayashi
    • H01Q1/38H01Q1/22H01Q23/00
    • H01Q1/2283H01L2223/6677H01L2224/16225H01L2224/32225H01L2224/73204H01Q23/00H01L2924/00H01L2924/00012
    • According to one embodiment, a radio device includes: a mounting board having a conductive plane; a semiconductor package mounted on the mounting board and having a interposer having a conductive plane, a semiconductor chip mounted on one surface of the interposer, and an antenna having a conductive element formed on the one surface and connected to the semiconductor chip; and a plurality of connection portions connecting the mounting board and the interposer. A first electrical length of the first connection portion which is nearest the conductive element among the plurality of connection portions or a second electrical length of the first connection portion including a conductive plane of the mounting board or interposer connected to the first connection portion is less than ½ wavelength of the operating frequency of the antenna.
    • 根据一个实施例,无线电设备包括:具有导电平面的安装板; 半导体封装,其安装在所述安装板上并具有具有导电平面的插入件,安装在所述插入件的一个表面上的半导体芯片,以及形成在所述一个表面上并连接到所述半导体芯片的导电元件的天线; 以及连接安装板和插入件的多个连接部。 第一连接部分的第一连接部分在多个连接部分中最靠近导电元件的第一电长度或包括连接到第一连接部分的安装板或插入件的导电平面的第一连接部分的第二电气长度小于 天线工作频率的1/2波长。
    • 49. 发明申请
    • RADIO DEVICE
    • 无线电设备
    • US20120075147A1
    • 2012-03-29
    • US13178967
    • 2011-07-08
    • Yukako TsutsumiHiroki ShokiShuichi Obayashi
    • Yukako TsutsumiHiroki ShokiShuichi Obayashi
    • H01Q1/24
    • H01Q1/2283H01L2223/6677H01L2224/16225H01L2224/32225H01L2224/73204H01Q23/00H01L2924/00H01L2924/00012
    • According to one embodiment, a radio device includes: a mounting board having a conductive plane; a semiconductor package mounted on the mounting board and having a interposer having a conductive plane, a semiconductor chip mounted on one surface of the interposer, and an antenna having a conductive element formed on the one surface and connected to the semiconductor chip; and a plurality of connection portions connecting the mounting board and the interposer. A first electrical length of the first connection portion which is nearest the conductive element among the plurality of connection portions or a second electrical length of the first connection portion including a conductive plane of the mounting board or interposer connected to the first connection portion is less than ½ wavelength of the operating frequency of the antenna.
    • 根据一个实施例,无线电设备包括:具有导电平面的安装板; 半导体封装,其安装在所述安装板上并具有具有导电平面的插入件,安装在所述插入件的一个表面上的半导体芯片,以及形成在所述一个表面上并连接到所述半导体芯片的导电元件的天线; 以及连接安装板和插入件的多个连接部。 第一连接部分的第一连接部分在多个连接部分中最靠近导电元件的第一电长度或包括连接到第一连接部分的安装板或插入件的导电平面的第一连接部分的第二电气长度小于 天线工作频率的1/2波长。