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41. 发明授权

US08906475B2 Cellulose acylate film, retardation film, polarizer and liquid-crystal display device 有权
标题翻译：纤维素酰化膜，延迟膜，偏光片和液晶显示装置
公开(公告)号：US08906475B2
公开(公告)日：2014-12-09
申请号：US13498865
申请日：2010-09-29
申请人： Nobutaka Fukagawa , Masato Nagura , Takayasu Yasuda , Takahiro Ohno , Satoshi Tanaka , Aiko Yamamoto , Aiko Yoshida , Shinya Watanabe
发明人： Nobutaka Fukagawa , Masato Nagura , Takayasu Yasuda , Takahiro Ohno , Satoshi Tanaka , Aiko Yamamoto , Aiko Yoshida , Shinya Watanabe
IPC分类号： C09K19/00 , C08B15/00 , C08L1/10 , B32B27/30 , G02B5/30 , C08J5/18 , B32B27/18 , C08K5/34 , C08L1/14 , B32B23/08 , B32B23/20 , C08L1/12 , B32B27/06 , C08B3/22 , C08K5/151 , C08K5/103
CPC分类号： G02B5/3083 , B32B23/08 , B32B23/20 , B32B27/06 , B32B27/18 , B32B27/30 , C08B3/22 , C08B15/005 , C08J5/18 , C08J2301/10 , C08K5/103 , C08K5/151 , C08K5/34 , C08L1/10 , C08L1/12 , C08L1/14 , Y10T428/10 , Y10T428/1036 , Y10T428/1041 , C08L67/02
摘要： Provide is a cellulose acylate film, of which the environmental humidity-dependent retardation change is small and which, when stuck to a polarizer and used in high-temperature and high-humidity environments, is effective for preventing the polarizing element from being deteriorated. A cellulose acylate film, which contains a hydrogen-bonding compound satisfying the following requirements (A) to (C), and at least one hydrophobizing agent selected from a polyalcohol ester-base hydrophobizing agent, a polycondensate ester-base hydrophobizing agent and a carbohydrate derivative-base hydrophobizing agent: (A) the compound has both a hydrogen-bonding donor part and a hydrogen-bonding acceptor part in one molecule, (B) the value computed by dividing the molecular weight of the compound by the total number of the hydrogen-bonding donor number and the hydrogen-bonding acceptor number in the compound is from 30 to 65, and (C) the total number of the aromatic ring structures in the compound is from 1 to 3.
摘要翻译：提供一种纤维素酰化物膜，其环境湿度依赖性延迟变化小，并且当粘附到偏振器并在高温和高湿度环境中使用时，对防止偏振元件劣化是有效的。含有满足以下要求（A）至（C）的氢键化合物的纤维素酰化物膜和至少一种选自多元醇酯基疏水化剂，缩聚酯酯基疏水化剂和碳水化合物的疏水化剂衍生物基疏水化剂：（A）该化合物在一个分子中具有氢键供体部分和氢键受体部分，（B）将化合物的分子量除以总数化合物中的氢键供体数和氢键受体数为30〜65，（C）化合物中芳环结构的总数为1〜3。

42. 发明授权

US08611775B2 Image forming apparatus comprising a fixing pressure switching unit and medium storing image forming programs therein 有权
标题翻译：图像形成装置包括定影压力切换单元和在其中存储图像形成程序的介质
公开(公告)号：US08611775B2
公开(公告)日：2013-12-17
申请号：US13117714
申请日：2011-05-27
申请人： Hirotaka Udagawa , Shinya Watanabe , Tetsuya Sonoda
发明人： Hirotaka Udagawa , Shinya Watanabe , Tetsuya Sonoda
IPC分类号： G03G15/20 , G03G15/00
CPC分类号： G03G15/2032
摘要： There is provided an image forming apparatus including: a forming unit that forms a toner image according to image information for an image to be formed on a sheet; a fixing unit that fixes the toner image formed on the sheet; a switching unit that switches a fixing pressure of the fixing unit by an operation; a stopping unit that, when the fixing pressure is switched to fix at a second fixing pressure lower than a predefined first fixing pressure, stops conveying a final sheet before the final sheet is fed after being fixed; and an instructing unit that, when the stopping unit stops conveying the final sheet, instructs switching to the first fixing pressure.
摘要翻译：提供了一种图像形成装置，包括：形成单元，其根据要形成在片材上的图像的图像信息形成调色剂图像; 固定单元，其固定形成在所述片材上的调色剂图像; 切换单元，其通过操作切换定影单元的定影压力; 停止单元，当固定压力在低于预定义的第一定影压力的第二定影压力下被切换以固定时，在固定最后的纸张之前停止输送最终的纸张; 以及指令单元，当所述停止单元停止输送最终纸张时，指示切换到所述第一定影压力。

43. 发明申请

US20130243374A1 OPTICAL BRANCHING ELEMENT, OPTICAL WAVEGUIDE DEVICE USING OPTICAL BRANCHING ELEMENT, AND METHOD OF MANUFACTURING OPTICAL BRANCHING ELEMENT, METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE 审中-公开
标题翻译：光学分支单元，使用光学分支单元的光波导装置和制造光学分支单元的方法，制造光波导装置的方法
公开(公告)号：US20130243374A1
公开(公告)日：2013-09-19
申请号：US13988516
申请日：2011-11-30
申请人： Shinya Watanabe
发明人： Shinya Watanabe
IPC分类号： G02B6/28 , G02B6/125
CPC分类号： G02B6/2804 , G02B6/1228 , G02B6/125 , Y10T156/10
摘要： An optical branching element includes: a first waveguide section which has a shape wherein the core width is reduced without variation from a first end section to a second end section; a fourth waveguide section which has a shape wherein the core width is increased without variation from a third end section to a fourth end section respectively connected to the second and a third waveguide sections; and a fifth waveguide section which connects the second end section and the third end section and has a core width of any value from 0.8 μm to 2.7 μm. The relative refractive index of the cores and a clad of the first through fifth waveguide section is at least 1.3% with respect to light in a C band wavelength domain.
摘要翻译：光分路元件包括：第一波导部分，其具有其中芯部宽度减小而不会从第一端部部分变化到第二端部部分的形状; 第四波导部分，其具有其中芯部宽度不增加而不随着分别连接到第二和第三波导部分的第三端部分到第四端部部分的形状; 以及第五波导段，其连接第二端部和第三端部，并且具有从0.8μm到2.7μm的任何值的芯宽度。相对于C波长域中的光，芯的相对折射率和第一至第五波导段的包层至少为1.3％。

44. 发明申请

US20130004123A1 OPTICAL WAVEGUIDE AND AN OPTICAL WAVEGUIDE DEVICE 审中-公开
标题翻译：光波导和光波导装置
公开(公告)号：US20130004123A1
公开(公告)日：2013-01-03
申请号：US13583808
申请日：2011-03-15
申请人： Shinya Watanabe
发明人： Shinya Watanabe
IPC分类号： G02B6/26 , G02B6/10
CPC分类号： G02B6/125 , G02B6/12007
摘要： Optical path length difference should be correctly controlled for a pair of optical waveguides even in the pair of the optical waveguides which include combination of a large number of curved waveguide portions.A pair of optical waveguides include curved sections, wherein the curved section has the shape including arcuate waveguide portions which have the same curvatures, and wherein the optical waveguides have the same number of the arcuate waveguide portions.
摘要翻译：对于一对光波导，即使在包括多个弯曲波导部分的组合的一对光波导中也应正确地控制光路长度差。一对光波导包括弯曲部分，其中弯曲部分具有包括具有相同曲率的弓形波导部分的形状，并且其中光波导具有相同数目的弓形波导部分。

45. 发明申请

US20120077102A1 METHOD OF SHUTTING DOWN FUEL CELL SYSTEM 有权
标题翻译：切断燃料电池系统的方法
公开(公告)号：US20120077102A1
公开(公告)日：2012-03-29
申请号：US13237248
申请日：2011-09-20
申请人： Shinjiro MORITA , Nobutaka Nakajima , Go Kikuchi , Nobuki Koiwa , Satoshi Tanimoto , Kentaro Nagoshi , Katsumi Hayashi , Koichiro Miyata , Hiroshi Morikawa , Kaoru Yamazaki , Takashi Yamamoto , Shinya Watanabe
发明人： Shinjiro MORITA , Nobutaka Nakajima , Go Kikuchi , Nobuki Koiwa , Satoshi Tanimoto , Kentaro Nagoshi , Katsumi Hayashi , Koichiro Miyata , Hiroshi Morikawa , Kaoru Yamazaki , Takashi Yamamoto , Shinya Watanabe
IPC分类号： H01M8/04
CPC分类号： H01M8/04955 , H01M8/04388 , H01M8/04753 , H01M8/04953 , H01M16/006 , Y02E60/50
摘要： A method of shutting down a fuel cell system includes a first step of supplying hydrogen gas and air to a fuel cell stack to thereby cause the fuel cell stack to generate electricity, and a second step of stopping supply of the hydrogen gas, and then supplying air to the fuel cell stack so as to cause the fuel cell stack to generate electricity upon detection of a command to shut down the fuel cell stack. In the second step, when the pressure of the hydrogen gas is lowered to a preset lower-limit value based on an anode pressure, which actually is measured, the fuel cell stack is caused to stop generating electricity.
摘要翻译：关闭燃料电池系统的方法包括：向燃料电池堆供给氢气和空气，从而使燃料电池堆发电的第一工序;停止氢气供给的第二工序，空气到燃料电池堆，以便在检测到关闭燃料电池堆的命令时使燃料电池堆发电。在第二步骤中，当基于实际测量的阳极压力将氢气的压力降低到预设的下限值时，燃料电池堆被停止发电。

46. 发明申请

US20110263124A1 Method of fabricating semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：US20110263124A1
公开(公告)日：2011-10-27
申请号：US13067840
申请日：2011-06-29
申请人： Shinichi Hirasawa , Shinya Watanabe
发明人： Shinichi Hirasawa , Shinya Watanabe
IPC分类号： H01L21/28
CPC分类号： H01L27/11521 , H01L29/40114 , H01L29/7881
摘要： A method of fabricating a semiconductor device according to one embodiment includes: forming a plurality of Si-based pattern portions above a semiconductor substrate, the plurality of Si-based pattern portions being adjacent in a direction substantially parallel to a surface of the semiconductor substrate via insulating films; forming a metal film above the plurality of Si-based pattern portions and the insulating films so as to contact with the plurality of Si-based pattern portions; processing whole areas or upper portions of the plurality of Si-based pattern portions into a plurality of silicide layers by a silicidation reaction between the plurality of Si-based pattern portions and the metal film by heat treatment; and removing the plurality of silicide layers formed above the insulating films by applying planarizing treatment to the plurality of silicide layers.
摘要翻译：根据一个实施例的制造半导体器件的方法包括：在半导体衬底之上形成多个Si基图案部分，所述多个Si基图案部分在基本上平行于半导体衬底的表面的方向上相邻的方向绝缘膜; 在所述多个Si基图案部分和所述绝缘膜之上形成金属膜以与所述多个Si基图案部分接触; 通过多个Si基图案部分和金属膜之间的硅化反应将多个Si基图案部分的整个区域或上部处理成多个硅化物层; 以及通过对所述多个硅化物层进行平坦化处理来去除在所述绝缘膜上形成的所述多个硅化物层。

47. 发明授权

US07904031B2 High-frequency module for transmitting and receiving transmission-reception signals of at least three communication systems using a single antenna 有权
标题翻译：用于使用单个天线发送和接收至少三个通信系统的发送 - 接收信号的高频模块
公开(公告)号：US07904031B2
公开(公告)日：2011-03-08
申请号：US10595783
申请日：2004-11-01
申请人： Koji Furutani , Shinya Watanabe
发明人： Koji Furutani , Shinya Watanabe
IPC分类号： H04B1/44
CPC分类号： H04B1/0057 , H04B1/006 , H04B1/48
摘要： A high-frequency module includes a GaAs switch defining an FET switch for selectively connecting one of four RF input-output terminals to an antenna input-output terminal to be connected to an antenna. A GSM transmission signal input terminal is connected to the RF input-output terminal of the GaAsSW through a low-pass filter, and a DCS/PCS transmission signal input terminal is connected to the RF input-output terminal through a low-pass filter. A GSM 850 reception signal output terminal and a PCS reception signal output terminal are connected to the RF input-output terminal through a diplexer, and a GSM 900 reception signal output terminal and a PCS reception signal output terminal are connected to the RF input-output terminal through a diplexer.
摘要翻译：高频模块包括限定用于选择性地将四个RF输入 - 输出端子中的一个连接到要连接到天线的天线输入 - 输出端子的FET开关的GaAs开关。 GSM发送信号输入端子通过低通滤波器连接到GaAsSW的RF输入输出端子，DCS / PCS发送信号输入端子通过低通滤波器连接到RF输入输出端子。 GSM 850接收信号输出端子和PCS接收信号输出端子通过双工器连接到RF输入输出端子，GSM 900接收信号输出端子和PCS接收信号输出端子连接到RF输入输出端终端通过双工器。

48. 发明授权

US07711389B2 High frequency module 有权
标题翻译：高频模块
公开(公告)号：US07711389B2
公开(公告)日：2010-05-04
申请号：US10595782
申请日：2004-10-21
申请人： Koji Furutani , Shinya Watanabe
发明人： Koji Furutani , Shinya Watanabe
IPC分类号： H04M1/00
CPC分类号： H04B1/0057 , H04B1/005 , H04B1/406 , H04B1/48
摘要： A high frequency module for transmitting and receiving, for example, communication signals of GSM/DCS/PCS/WCDMA systems through a single antenna, is provided at a relatively small size and low cost. The high frequency module includes a diplexer arranged to separate communication signals from the antenna into GSM communication signals in lower frequency bands and POS/DOS/WODMA communication signals in higher frequency bands, a diode switch circuit that is connected to a input and output terminal of the GSM communication signal of the diplexer and is arranged to switch transmission and reception of the GSM communication signal, and a multipoint GaAsIC switch that is connected to the GSM/DCS/PCS/WCDMA communication signals of the diplexer and is arranged to switch transmission and reception of these signals. The high frequency module switches the four types of communication signals by changing the patterns of controls signals VcG, VC1, and Vc2 that are applied to the diode switch circuit and the GaAsIC switch.
摘要翻译：以相对较小的尺寸和低成本提供用于例如通过单个天线发送和接收例如GSM / DCS / PCS / WCDMA系统的通信信号的高频模块。高频模块包括：双工器，被配置为将来自天线的通信信号分离成较低频带的GSM通信信号和较高频带的POS / DOS / WODMA通信信号;二极管开关电路，连接到输入和输出端子双工器的GSM通信信号，并且被设置为切换GSM通信信号的发送和接收，以及连接到双工器的GSM / DCS / PCS / WCDMA通信信号的多点GaAsIC开关，并且被布置成切换传输和接收这些信号。高频模块通过改变施加到二极管开关电路和GaAsIC开关的控制信号VcG，VC1和Vc2的模式来切换四种类型的通信信号。

49. 发明申请

US20090278031A1 Solid-state imaging device and imaging apparatus 有权
标题翻译：固态成像装置和成像装置
公开(公告)号：US20090278031A1
公开(公告)日：2009-11-12
申请号：US12458661
申请日：2009-07-20
申请人： YOSHIAKI KITANO , Keiji Tatani , Shinya Watanabe , Kouji Yahazu , Yosuke Isoo , Masaru Suzuki
发明人： YOSHIAKI KITANO , Keiji Tatani , Shinya Watanabe , Kouji Yahazu , Yosuke Isoo , Masaru Suzuki
IPC分类号： H01L27/00 , H01L31/0232
CPC分类号： H01L27/1462 , H01L27/14603 , H01L27/14627 , H01L27/14632 , H01L27/14645 , H01L27/14685 , H01L27/14868
摘要： There is provided a solid-state imaging device, including: a semiconductor substrate having a plurality of pixels, each having a photoelectric conversion portion, formed therein; and a laminated film formed on said semiconductor substrate; wherein said laminated film includes a hydrogen desorbing film for desorbing hydrogen, and a hydrogen blocking-off film disposed so as to overlie said hydrogen desorbing film.
摘要翻译：提供了一种固态成像装置，包括：形成有多个像素的半导体基板，每个像素具有光电转换部分; 以及形成在所述半导体衬底上的层压膜; 其中所述层压膜包括用于解吸氢的氢解吸膜和设置成覆盖所述氢解吸膜的氢封闭膜。

50. 发明申请

US20090257212A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090257212A1
公开(公告)日：2009-10-15
申请号：US12376541
申请日：2007-07-25
申请人： Fumitomo Takano , Shinya Watanabe , Tsukasa Aiba , Joji Nakashima , Hiroshi Otsuka
发明人： Fumitomo Takano , Shinya Watanabe , Tsukasa Aiba , Joji Nakashima , Hiroshi Otsuka
IPC分类号： H05K1/14
CPC分类号： H01L25/071 , H01L25/18 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.
摘要翻译：半导体器件包括第一和第二组装体（12A，12B）。第一组装体设置有第一半导体芯片，连接到第一半导体芯片的一个表面的高压母线（21），连接到第一半导体芯片的另一个表面的第一金属布线板（24-1）和与第一金属布线板连接的第三金属布线板（24-3）。第二组装体设置有第二半导体芯片，利用接合线连接到第二半导体芯片的一个表面的低压母线（23），连接到第二半导体芯片的另一个表面的第二金属布线板（24-2）第二半导体芯片和第四金属布线板（24-4），通过从第二金属布线板的端部返回并与第二金属布线板平行地布置。第一组装体和第二组装体被布置成堆叠结构，其中组装体被分离。通过半导体模块结构减小主电路的电感。

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