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41. 发明专利

JP2002124743A PHOTOSENSITIVE RESIN COMPOSITION LAYER, POROUS RESIN LAYER, CIRCUIT BOARD AND SUSPENSION SUBSTRATE WITH CIRCUIT 失效
公开(公告)号：JP2002124743A
公开(公告)日：2002-04-26
申请号：JP2000319439
申请日：2000-10-19
申请人： NITTO DENKO CORP
发明人： MOCHIZUKI SHU , FUKUOKA TAKAHIRO , KANEDA MITSUHIRO , YAMAMOTO TAKAYUKI , TARUNO TOMOHIRO
IPC分类号： G03F7/004 , B29C67/20 , C08J9/26 , C08K5/00 , C08L79/08 , C08L101/00 , G03F7/037 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a porous resin layer, which has a high heat resistance, a high dimensional stability and high insulation characteristics and moreover, has uniform and microscopic bubbles, a photosensitive resin composition layer for obtaining the porous resin layer, a circuit board having such a porous resin layer as an insulating layer and a suspension substrate with a circuit. SOLUTION: A polyamic acid resin 4, a photosensitizer, a dispersive compound 3 capable of being dispersed in the resin 4, and a solvent are made to be contained as a photosensitive resin composition on a circuit board 1. By removing the solvent from this composition layer 2, a state that the compound 3 is dispersed in the resin 4 is formed, then the compound 3 is removed from the composition layer 2 to bring the composition layer 2 into a porous state and after that, the composition layer 2 is cured to obtain a porous resin layer. The obtained porous resin layer is low in a dielectric constant. Therefore, if the porous resin layer is used as an insulating layer 6 on the circuit board 1, the high-frequency characteristics of the circuit board 1 can be raised.

42. 发明专利

JP2001323099A PHOTOSENSITIVE RESIN COMPOSITION, POROUS RESIN, CIRCUIT SUBSTRATE AND CIRCUIT-PRINTED SUSPENSION SUBSTRATE 失效
公开(公告)号：JP2001323099A
公开(公告)日：2001-11-20
申请号：JP2000142129
申请日：2000-05-15
申请人： NITTO DENKO CORP
发明人： MOCHIZUKI SHU , FUKUOKA TAKAHIRO , KANESHIRO NAOTAKA , KURATA NAOKI
IPC分类号： G03F7/004 , C08F2/50 , C08G73/10 , C08G73/12 , C08J9/26 , C08K5/00 , C08L67/00 , C08L71/00 , C08L75/04 , C08L79/04 , G03F7/027 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a porous resin that has high heat resistance, dimensional stability and insulation properties and includes uniform and very fine pores, a photosensitive resin composition for preparing the porous resin and, in addition, circuit substrates and circuit-printed suspension substrates having such the porous resin as an insulating layer. SOLUTION: The objective photosensitive resin composition comprises a polyimide resin precursor bearing a unit structure represented by general formula (1): -R2NHCO-R1(COR3)(COR4)-CONH- (wherein R1 and R2 are each an aromatic group, R3 and R4 are each hydroxy group or a monovalent organic group wherein at least one bears a photosensitive monovalent organic group), a photosensitizer and a compound that is dispersible in the polyimide resin precursor. The solvent is removed from this resin composition, further dispersible compound is removed to make the resin porous and the resultant porous resin is cured.

43. 发明专利

JP2000104026A ULTRAVIOLET CURABLE ADHESIVE SHEET 失效
公开(公告)号：JP2000104026A
公开(公告)日：2000-04-11
申请号：JP7474699
申请日：1999-03-19
申请人： NITTO DENKO CORP
发明人： YAMAMOTO MASASHI , NAKAGAWA YOSHIO , KUBOZONO TATSUYA , AKAZAWA MITSUHARU , HASHIMOTO KOICHI , FUKUOKA TAKAHIRO
IPC分类号： H01L21/301 , C09J7/02 , C09J9/00 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor protective pressure-sensitive adhesive sheet which has an adhesive being free from the occurrence of reaction by exposure to a trace of ultraviolet rays irradiated from the surroundings during standby for its application to wafers, and thus can remain intact and be used with good pressure-sensitive adhesion properties at the time of its application to the wafers; and an ultraviolet curable pressure-sensitives adhesive sheet useful as a semiconductor wafer fixing sheet and the like. SOLUTION: An ultraviolet curable pressure-sensitive adhesive sheet is obtained by providing an ultraviolet curable pressure-sensitive adhesive layer 2 at least on one side of a base film 1 and further applying a separator 3 to the surface of this pressure-sensitive adhesive layer, and the ultraviolet transmissivity at a wavelength of 300-400 nm of the separator is not more than 65%. The methods for rendering the ultraviolet transmissivity not more than 65% include, for example, a method for providing an ultraviolet absorber- containing layer on a film constituting the separator at the opposite side of the pressure-sensitive adhesive layer-application side and a method for incorporating an ultraviolet absorber into said film.

44. 发明专利

JPH11315129A AROMATIC POLYCARBODIIMIDE AND FILM THEREFROM 失效
公开(公告)号：JPH11315129A
公开(公告)日：1999-11-16
申请号：JP14216098
申请日：1998-05-07
申请人： NITTO DENKO CORP
发明人： FUKUOKA TAKAHIRO , MOCHIZUKI SHU , SAKAMOTO YUKIE , YOSHIOKA MASAHIRO
IPC分类号： C08J5/18 , C08G18/00 , C08G18/02 , C08L79/00
摘要： PROBLEM TO BE SOLVED: To obtain an aromatic polycarbodiimide having high solubility in an organic solvent, good processability and excellent heat resistance and moisture resistance, and useful as a heat-resistant covering material in a soldering step when producing electronic parts, a nonlinear optical material or the like by including a specific constituent unit. SOLUTION: This aromatic polycarbodiimide contains a constituent unit of formula I [R is a group of formulas II to IV; X is nitro or H; Y is cyano or H; (n) is 2-200]. The compound is obtained by using a diisocyanate of formula V as a monomer and polymerizing the diisocyanate in the presence of a phosphorus-based catalyst such as 3-methyl-1-phenyl-2-phosphorane-1-oxide in an organic solvent such as tetrahyclrofuran preferably at 50-140 deg.C by a well- known method. The compound preferably has 3,000-17,000 molecular weight expressed in terms of the number average molecular weight.

45. 发明专利

JPH10218959A AROMATIC POLYCARBODIIMIDE AND FILM 失效
公开(公告)号：JPH10218959A
公开(公告)日：1998-08-18
申请号：JP4473397
申请日：1997-02-12
申请人： NITTO DENKO CORP
发明人： FUKUOKA TAKAHIRO , SAKAMOTO YUKIE , YOSHIOKA MASAHIRO , MOCHIZUKI SHU
IPC分类号： C08J5/18 , C08G18/02 , C08L79/00
摘要： PROBLEM TO BE SOLVED: To provide a new aromatic polycarbodiimide which has excellent solubility in organic solvents and can give a film having good processability and excellent heat resistance and humidity resistance. SOLUTION: This polycarbodiimide comprises structural units represented by the formula (wherein X to X are each H or a 1-3C alkyl; and n is 2-400). It can be produced by polymerizing the corresponding diisocyanate monomer in the presence of a phosphorous-containing catalyst by a known process. The diisocyanate may be used alone or in combination with other organic diisocyanates in an amount not detrimental to its properties. The reaction temperature is desirably 40-150 deg.C. In the synthesis of the polycarbodiimide, the isocyanate concentration is 5-70wt.%. The organic solvent used in the synthesis e.g. tetrachloroethylene. The phosphorus-containing catalyst used is exemplified by 1-phenyl-2-phospholene 1-oxide. The number-average molecular weight of the polycarbodiimide is 1,000-100,000.

46. 发明专利

JP2012212727A Method of manufacturing thermally conductive sheet and thermally conductive sheet 有权
标题翻译：制造导热片和导热片的方法
公开(公告)号：JP2012212727A
公开(公告)日：2012-11-01
申请号：JP2011076542
申请日：2011-03-30
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UCHIYAMA HISAE , IZUMITANI SEIJI , FUKUOKA TAKAHIRO , YAMAGUCHI YOSHIO
IPC分类号： H05K7/20 , C09K5/08 , H01L23/36
CPC分类号： B29C51/18 , B29C2043/561 , C09K5/14 , H01L23/3737 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermal conductive sheet which is excellent in thermal conductivity in surface direction and whose internal voids are reduced, and a method of manufacturing the same.SOLUTION: A resin composition containing resin and thermally conductive inorganic particles are prepared, and the thermal composition is thermally pressed to change the state of the resin composition from a molten state to a semi-solid state. Thereafter, the resin composition is further increased in viscosity to be sheeted, thereby manufacturing a thermally conductive sheet in which the thermal conductivity in a direction orthogonal to the thickness direction is not less than 10 W/mK. The above manufacturing method can provide a thermally conductive sheet that has an excellent thermal conductivity in the plane direction orthogonal to the thickness direction and various excellent electrical characteristics such as dielectric strength (breakdown voltage), etc.
摘要翻译：要解决的问题：提供一种表面方向热导率优异且内部空隙减小的导热片及其制造方法。解决方案：制备含有树脂和导热无机颗粒的树脂组合物，并将热组合物热压，以将树脂组合物的状态从熔融状态改变为半固态。此后，树脂组合物的粘度进一步提高，从而制造与厚度方向正交的方向的热传导率不低于10W / m·K的导热片。上述制造方法可以提供在与厚度方向正交的平面方向上具有优异导热性的导热片和各种优异的电特性如绝缘强度（击穿电压）等。版权所有（C）2013 ，JPO＆INPIT

47. 发明专利

JP2012039065A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039065A
公开(公告)日：2012-02-23
申请号：JP2011016921
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent thermoconductivity in the plane direction as well as excellent concealment properties.SOLUTION: The heat-conductive sheet 1 comprising plate-like boron nitride particles 2 has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction SD of the heat-conductive sheet 1, and the heat-conductive sheet 1 having thickness of 300 μm has a transmission coefficient of ≤10% relative to light having a wavelength of 500nm. This heat-conductive sheet 1 exhibits excellent thermoconductivity in the plane direction SD as well as excellent concealment properties.
摘要翻译：要解决的问题：提供在平面方向上显示出优异的热传导性以及优异的隐藏性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1在导热片1的平面方向SD上具有≥4W/ m K的导热系数，并且导热片 1相对于波长为500nm的光具有≤10％的透射系数。该导热片1在平面方向SD上表现出优异的导热性，并且具有优异的隐蔽性。版权所有（C）2012，JPO＆INPIT

48. 发明专利

JP2012039061A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039061A
公开(公告)日：2012-02-23
申请号：JP2011016917
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/373 , C01B21/064 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent thermoconductivity in the plane direction and also excels in electric insulation.SOLUTION: The heat-conductive sheet 1 comprising plate-like boron nitride particles 2 has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction SD of the heat-conductive sheet 1, and volume resistivity R of ≥1×10Ω cm. This heat-conductive sheet 1, when covering electronic elements, can protect the electronic elements, effectively conduct the heat of the electronic elements and prevent short circuit among the electronic elements.
摘要翻译：要解决的问题：提供在平面方向上显示优异的导热性并且还具有优异的电绝缘性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1在导热片1的平面方向SD上的导热系数为≥4W/ m K，体积电阻率R为≥ 1×10 10 Ωcm。该导热片1在覆盖电子元件时可以保护电子元件，有效地传导电子元件的热量并防止电子元件之间的短路。版权所有（C）2012，JPO＆INPIT

49. 发明专利

JP2012036364A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012036364A
公开(公告)日：2012-02-23
申请号：JP2011016923
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA TOSHIE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： C08J5/18
CPC分类号： C09K5/14
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive sheet excellent in surface-directional thermal conductivity, and excellent in heat resistance.SOLUTION: The heat-conductive sheet 1 contains a plate-like boron nitride particle 2, and has 4 W/mK or more of thermal conductivity along a surface direction (orthogonal direction) SD orthogonal to a thickness direction TD of the heat-conductive sheet 1, and 125°C or more of glass transition point determined as a peak value of tanδ obtained in dynamic viscoelastic measurement at 10 Hz of frequency. The heat-conductive sheet 1 is excellent in the surface-directional thermal conductivity along the surface direction orthogonal to the thickness direction, further reduces deformation under high temperatures, restrains separation, and is usable for various heat radiation applications, as the heat-conductive sheet 1 superior in handleability and superior in the surface-directional thermal conductivity.
摘要翻译：要解决的问题：提供表面方向导热性优异，耐热性优异的导热片。解决方案：导热片1包含板状氮化硼颗粒2，并且沿着与热的厚度方向TD正交的表面方向（正交方向）SD具有4W / mK或更高的热导率导电片1和125℃或更高的玻璃化转变点，其确定为在频率为10Hz的动态粘弹性测量中获得的tanδ的峰值。导热片1沿着与厚度方向正交的表面方向的表面方向导热性优异，进一步减少高温下的变形，抑制分离，可用于各种散热用途，作为导热片 1优异的可操作性和优异的表面方向热导率。版权所有（C）2012，JPO＆INPIT

50. 发明专利

JP2012031290A Phase-separated structure and production method therefor 审中-公开
标题翻译：相分离结构及其生产方法
公开(公告)号：JP2012031290A
公开(公告)日：2012-02-16
申请号：JP2010172308
申请日：2010-07-30
申请人： Nitto Denko Corp , Tohoku Univ , 国立大学法人東北大学 , 日東電工株式会社
发明人： HATAKEYAMA YOSHIJI , FUKUZAKI SAORI , FUKUOKA TAKAHIRO , AJIRI MASAFUMI
IPC分类号： C08L101/00 , C08J3/20 , C08K9/04
CPC分类号： C08J3/212 , C08J2325/06 , Y10T428/25
摘要： PROBLEM TO BE SOLVED: To provide a phase-separated structure in which a resin phase and a particle phase are separated.SOLUTION: The method includes the steps of: blending a resin and organic-inorganic composite particles having an organic group on the surface of inorganic particles and having a shape in which the steric hindrance of the organic group prevents the inorganic particles from contacting each other to prepare a particle-containing resin composition; and forming from the particle-containing resin composition a phase-separated sheet 1 composed of a resin phase 2 and a particle phase 3 arranged adjacent to the resin phase 2 and formed from the organic-inorganic composite particles.

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