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41. 发明授权

US08588639B2 Fixing device and image forming apparatus 有权
标题翻译：固定装置和成像装置
公开(公告)号：US08588639B2
公开(公告)日：2013-11-19
申请号：US12929321
申请日：2011-01-14
申请人： Yoshiharu Takahashi , Toshio Ogiso
发明人： Yoshiharu Takahashi , Toshio Ogiso
IPC分类号： G03G15/20
CPC分类号： G03G15/20
摘要： A fixing device is disclosed, including: a fixing rotative body, a heat source, and a control part. The control part conducts a printing temperature control which varies an ON ratio per unit time of the heat source based on a detection result of the temperature detecting part to maintain a printing target temperature in a printing state, conducts a waiting temperature control which performs an ON/OFF control based on the detection result of the temperature detecting part to maintain a waiting target temperature in a waiting state after a printing operation ends, and conducts a forcible ON control which forcibly turns on the heat source for a predetermined time before starting the ON/OFF control when the detection result of the temperature detecting part after the printing operation ends is lower than the waiting target temperature.
摘要翻译：公开了一种固定装置，包括：固定旋转体，热源和控制部。控制部进行基于温度检测部的检测结果来改变热源的每单位时间的ON比的打印温度控制，以将打印目标温度保持在打印状态，进行进行ON的等待温度控制基于温度检测部的检测结果的/ OFF控制，以在打印操作结束后将待机目标温度维持在等待状态，并进行强制ON控制，强制开启热源一段预定时间，然后再开始ON 当打印操作结束后温度检测部分的检测结果低于等待目标温度时，/ OFF控制。

42. 发明申请

US20130004222A1 MEDIA GUIDE MECHANISM, FIXING DEVICE AND IMAGE FORMING APPARATUS INCORPORATING SAME 有权
标题翻译：媒体指导机构，固定装置和图像形成装置
公开(公告)号：US20130004222A1
公开(公告)日：2013-01-03
申请号：US13535931
申请日：2012-06-28
申请人： Kohta Sakaya , Yasuhide Ohkubo , Tamotsu Ikeda , Yoshiharu Takahashi , Chikara Hiraoka , Toshio Ogiso
发明人： Kohta Sakaya , Yasuhide Ohkubo , Tamotsu Ikeda , Yoshiharu Takahashi , Chikara Hiraoka , Toshio Ogiso
IPC分类号： G03G15/00 , B65H9/00
CPC分类号： G03G15/2028 , B65H5/062 , B65H5/36 , B65H2402/24 , B65H2511/212 , B65H2515/81 , B65H2220/01 , B65H2220/08 , B65H2220/11
摘要： A mechanism for guiding a recording medium into a nip formed between a first rotary member subjected to heating, and a second rotary member pressed against the first rotary member includes a guide member and a biasing member. The guide member is disposed upstream from the nip to guide the recording medium therealong. The biasing member is connected to the guide member to mechanically bias the guide member. The guide member is subjected to a constant biasing force from the biasing member and to a pressure force from the recording medium. The pressure force is opposite the biasing force and variable with a stiffness of the recording medium being guided. The guide member is movable to different operational positions depending on the biasing and pressure forces acting thereon.
摘要翻译：用于将记录介质引导到形成在经受加热的第一旋转构件之间的辊隙中的机构和被压靠在第一旋转构件上的第二旋转构件包括引导构件和施力构件。引导构件设置在辊隙的上游，以在其上引导记录介质。偏置构件连接到引导构件以机械地偏置引导构件。引导构件受到来自偏压构件的恒定的偏压力和来自记录介质的压力。压力与偏压力相反，并且随着记录介质的刚度被引导而变化。引导构件可以根据作用在其上的偏压和压力而移动到不同的操作位置。

43. 发明申请

US20110188874A1 Fixing device and image forming apparatus 有权
标题翻译：固定装置和成像装置
公开(公告)号：US20110188874A1
公开(公告)日：2011-08-04
申请号：US12929321
申请日：2011-01-14
申请人： Yoshiharu Takahashi , Toshio Ogiso
发明人： Yoshiharu Takahashi , Toshio Ogiso
IPC分类号： G03G15/20
CPC分类号： G03G15/20
摘要： A fixing device is disclosed, including: a fixing rotative body, a heat source, and a control part. The control part conducts a printing temperature control which varies an ON ratio per unit time of the heat source based on a detection result of the temperature detecting part to maintain a printing target temperature in a printing state, conducts a waiting temperature control which performs an ON/OFF control based on the detection result of the temperature detecting part to maintain a waiting target temperature in a waiting state after a printing operation ends, and conducts a forcible ON control which forcibly turns on the heat source for a predetermined time before starting the ON/OFF control when the detection result of the temperature detecting part after the printing operation ends is lower than the waiting target temperature.
摘要翻译：公开了一种固定装置，包括：固定旋转体，热源和控制部。控制部进行基于温度检测部的检测结果来改变热源的每单位时间的ON比的打印温度控制，以将打印目标温度保持在打印状态，进行进行ON的等待温度控制基于温度检测部的检测结果的/ OFF控制，以在打印操作结束后将待机目标温度维持在等待状态，并进行强制ON控制，强制开启热源一段预定时间，然后再开始ON 当打印操作结束后温度检测部分的检测结果低于等待目标温度时，/ OFF控制。

44. 发明申请

US20060177517A1 Antiinflammtory agent and antiinflammatory medical material 审中-公开
标题翻译：抗炎药和抗炎药物
公开(公告)号：US20060177517A1
公开(公告)日：2006-08-10
申请号：US10546922
申请日：2004-02-25
申请人： Toshikazu Shiba , Toshie Shiba , Mimoru Yamaoka , Takashi Uematsu , Yoshiharu Takahashi , Hitoshi Tanaka , Takao Kogo , Masanobu Shindo
发明人： Toshikazu Shiba , Toshie Shiba , Mimoru Yamaoka , Takashi Uematsu , Yoshiharu Takahashi , Hitoshi Tanaka , Takao Kogo , Masanobu Shindo
IPC分类号： A61K33/42
CPC分类号： A61K33/42
摘要： An object of the present invention is to provide an anti-inflammatory agent and an anti-inflammatory medical material, which have a good anti-inflammatory effect and high safety. The present invention relates to an anti-inflammatory agent and an anti-inflammatory medical material, which contain as an active ingredient a polyphosphoric acid that is particularly 1 type of liner phosphoric acid represented by a general formula Hn+2(PnO3n+1) (wherein n denotes an integer between 3 and 800) or a mixture of 2 or more types of such linear phosphoric acid.
摘要翻译：本发明的目的是提供具有良好的抗炎作用和高安全性的抗炎药和抗炎药物。本发明涉及一种消炎药和抗炎药物，其含有作为活性成分的多磷酸，特别是1种由通式H n + 2表示的内衬磷酸，（其中n表示3和800之间的整数）或2种或更多种这种线型磷酸的混合物。

45. 发明授权

US06516994B2 Wire bonding apparatus for connecting semiconductor devices 失效
标题翻译：用于连接半导体器件的引线接合装置
公开(公告)号：US06516994B2
公开(公告)日：2003-02-11
申请号：US09932947
申请日：2001-08-21
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： B23K3704
CPC分类号： H01L24/85 , H01L23/49503 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/05624 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49171 , H01L2224/73265 , H01L2224/78251 , H01L2224/78703 , H01L2224/78743 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/3511 , H01L2224/78 , H01L2924/00 , H01L2924/00015 , H01L2924/00012
摘要： A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of inner leads which are aligned along a periphery of the die pad at intervals. The apparatus includes a heat block having an inner lead mounting portion for mounting the inner leads, a concave portion located inward of the inner lead mounting portion, and at least one supporting pad for mounting the semiconductor chip. Restoration of the lead frame at wire bonding portions are decreased at the time a lead frame forcing mold holding the lead frame to heat block is detached.
摘要翻译：一种用于将包括半导体芯片的半导体器件连接到具有半导体芯片所连接的管芯焊盘的引线框架的引线接合装置，其通过沿着管芯焊盘周边排列的多个内部引线。该装置包括具有用于安装内引线的内引线安装部分，位于内引线安装部分内侧的凹部和用于安装半导体芯片的至少一个支撑焊盘的加热块。在将引线框架固定在加热块上的强制模具的引线框架被拆卸时，引线接合部分处的引线框架的恢复被减小。

46. 发明授权

US06268647B1 Electronic component with an insulating coating 失效
标题翻译：具有绝缘涂层的电子部件
公开(公告)号：US06268647B1
公开(公告)日：2001-07-31
申请号：US09249311
申请日：1999-02-12
申请人： Yoshiharu Takahashi , Toshiaki Shinohara
发明人： Yoshiharu Takahashi , Toshiaki Shinohara
IPC分类号： H01L23495
CPC分类号： H01L23/4951 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/05554 , H01L2224/13144 , H01L2224/16 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/81801 , H01L2224/83894 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic component includes a semiconductor chip with a rear surface; an insulating coating that is electrically conductive when heated adhered to the rear surface of a semi-conductor chip; and a lead frame having a die pad, the insulating coating and the die pad being anodically bonded to each other.
摘要翻译：电子部件包括具有后表面的半导体芯片; 当被加热粘接到半导体芯片的后表面时导电的绝缘涂层; 以及具有芯片焊盘的引线框架，绝缘涂层和芯片焊盘彼此阳极接合。

47. 发明授权

US6133069A Method of manufacturing the electronic using the anode junction method 失效
标题翻译：使用阳极连接法制造电子的方法
公开(公告)号：US6133069A
公开(公告)日：2000-10-17
申请号：US249090
申请日：1999-02-12
申请人： Yoshiharu Takahashi , Toshiaki Shinohara
发明人： Yoshiharu Takahashi , Toshiaki Shinohara
IPC分类号： H01L21/56 , H01L21/60 , H01L21/603 , H01L21/607 , H01L23/31 , H01L23/495 , H01L21/48
CPC分类号： H01L23/4951 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/81 , H01L2224/05554 , H01L2224/13144 , H01L2224/16 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/81801 , H01L2224/83894 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/3025
摘要： An electronic component includes an inner lead having a tip with a projection; an insulating coating that is electrically conductive when heated disposed around the projection; and a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching the electrode, the projection engaging the crater to make a contact between the inner lead and the electrode, the insulating coating and the metallic coating being anodically bonded to each other.
摘要翻译：电子部件包括具有突起的尖端的内引线; 绝缘涂层，其被加热设置在所述突起周围时是导电的; 以及设置在半导体芯片上的电极周围的金属涂层，其中火山口到达电极，突起接合火山口以在内引线和电极之间进行接触，绝缘涂层和金属涂层彼此阳极接合。

48. 发明授权

US6087201A Method of manufacturing ball grid array electronic component 有权
标题翻译：制造球栅阵列电子元件的方法
公开(公告)号：US6087201A
公开(公告)日：2000-07-11
申请号：US249071
申请日：1999-02-12
申请人： Yoshiharu Takahashi , Toshiaki Shinohara
发明人： Yoshiharu Takahashi , Toshiaki Shinohara
IPC分类号： H01L21/56 , H01L21/60 , H01L21/603 , H01L21/607 , H01L23/31 , H01L23/495
CPC分类号： H01L23/4951 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/81 , H01L2224/05554 , H01L2224/13144 , H01L2224/16 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/81801 , H01L2224/83894 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/3025
摘要： A method of manufacturing an electronic component with an insulating coating that is electrically conductive when heated adhered to a bottom surface of a semiconductor device with an external wiring ball grid array so that a top portion of the ball grid array is exposed, the method including locating the ball grid array on a wiring conductor on a circuit substrate and anodically bonding the insulating coating to the wiring conductor so that the ball grid array and the wiring conductor are electrically connected to each other.
摘要翻译：一种制造具有绝缘涂层的电子部件的方法，所述绝缘涂层在通过外部布线球栅格阵列加热粘附到半导体器件的底表面时导电，使得球栅阵列的顶部暴露，所述方法包括定位所述球栅阵列在电路基板上的布线导体上，并且将所述绝缘涂层阳极接合到所述布线导体，使得所述球栅阵列和所述布线导体彼此电连接。

49. 发明授权

US5872394A Lead frame 失效
公开(公告)号：US5872394A
公开(公告)日：1999-02-16
申请号：US708706
申请日：1996-09-05
申请人： Toshiaki Shinohara , Yoshiharu Takahashi
发明人： Toshiaki Shinohara , Yoshiharu Takahashi
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49558 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019
摘要： In a lead frame, L-shaped support tapes are applied to inner leads and suspension leads. Ends of the support tapes are overlapped with each other at the suspension leads to form, together, a rectangular ring shape. Since the support tapes are L-shaped, when the overlapped portions are positioned at the suspension leads, there are only two overlapped portions of the support tapes at the suspension leads. Thus, the number of overlapped portions requiring accurate alignment is reduced. Moreover, the L-shaped support tapes can be cut from the material for the support tape with higher efficiency.

50. 发明授权

US5766972A Method of making resin encapsulated semiconductor device with bump electrodes 失效
标题翻译：制造具有凸块电极的树脂封装半导体器件的方法
公开(公告)号：US5766972A
公开(公告)日：1998-06-16
申请号：US443025
申请日：1995-05-17
申请人： Yoshiharu Takahashi , Jiro Oseto , Teru Hirata
发明人： Yoshiharu Takahashi , Jiro Oseto , Teru Hirata
IPC分类号： H01L21/56 , H01L23/31 , H01L29/06
CPC分类号： H01L23/3107 , H01L21/565 , H01L29/0657 , H01L2224/16 , H01L2224/16245 , H01L2224/45144 , H01L2224/48247 , H01L2924/01057 , H01L2924/01079 , H01L2924/10155 , H01L2924/10158 , H01L2924/1815
摘要： A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.
摘要翻译：半导体器件包括附接到引线框架的半导体芯片，半导体芯片的与引线框架相对的后表面上具有凹部。这些凹槽增加了半导体芯片的散热面积。在制造半导体器件的方法中，上模具和下模具之间的空腔的高度小于包括凸起电极的半导体芯片的高度。在模制过程中，凸起电极接触上模或围绕凸块电极的坝，使得在模制过程中在凸块电极的表面上不产生细毛刺。

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