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    • 49. 发明授权
    • Molding compound adhesion for map-molded flip-chip
    • 成型复合贴片贴图模制倒装芯片
    • US08450148B2
    • 2013-05-28
    • US11638671
    • 2006-12-14
    • Joachim MahlerEdward Fuergut
    • Joachim MahlerEdward Fuergut
    • H01L21/00
    • H01L23/3142H01L21/563H01L2224/73203
    • A semiconductor device whose semiconductor device components have particularly reliable adhesion to a plastic housing composition surrounding them is intended to be produced by a simplest possible method. An adhesion promoting solution is introduced into the interspace between the front side of the flip-chips and the top side of the substrate and the solvent from the adhesion promoting solution is evaporated with formation of an adhesion promoting coating on the front sides of the semiconductor chips and the top side of the substrate. The semiconductor chip and the top side of the substrate are subsequently embedded into a plastic housing composition.
    • 其半导体器件组件对围绕它们的塑料外壳组合物具有特别可靠的粘合性的半导体器件旨在通过最简单的方法来生产。 将粘合促进溶液引入到倒装芯片的前侧和基板的顶侧之间的间隙中,并且来自粘合促进溶液的溶剂被蒸发,在半导体芯片的前侧形成粘附促进涂层 和基板的顶面。 随后将半导体芯片和衬底的顶侧嵌入塑料外壳组合物中。