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41. 发明授权

US07687869B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07687869B2
公开(公告)日：2010-03-30
申请号：US12081824
申请日：2008-04-22
申请人： Akio Kaneko , Seiji Inumiya , Katsuyuki Sekine , Kazuhiro Eguchi , Motoyuki Sato
发明人： Akio Kaneko , Seiji Inumiya , Katsuyuki Sekine , Kazuhiro Eguchi , Motoyuki Sato
IPC分类号： H01L29/78 , H01L21/8238
CPC分类号： H01L21/28194 , H01L21/28079 , H01L21/823842 , H01L21/823857 , H01L29/495 , H01L29/513 , H01L29/517 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device according to the present invention comprises a semiconductor substrate, a gate insulating film which is composed of a material whose main component is a tetravalent metal oxide, a mixture of a tetravalent metal oxide and SiO2, or a mixture of a tetravalent metal oxide and SiON and which containing B when it is in an nMOS structure on the semiconductor substrate or containing at least one of P and As when it is in a pMOS structure on the semiconductor substrate, and a gate electrode made of a metal having a work function of 4 eV to 5.5 eV.
摘要翻译：根据本发明的半导体器件包括半导体衬底，由主要成分为四价金属氧化物的材料，四价金属氧化物和SiO 2的混合物或四价金属氧化物的混合物构成的栅极绝缘膜和SiON，并且当其在半导体衬底上处于pMOS结构中时在半导体衬底上为nMOS结构或含有P和As中的至少一种时含有B，并且由具有功函数的金属制成的栅电极 4 eV至5.5 eV。

42. 发明申请

US20080242115A1 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US20080242115A1
公开(公告)日：2008-10-02
申请号：US11902300
申请日：2007-09-20
申请人： Kazuhiro Eguchi , Seiji Inumiya , Yoshitaka Tsunashima
发明人： Kazuhiro Eguchi , Seiji Inumiya , Yoshitaka Tsunashima
IPC分类号： H01L21/31
CPC分类号： H01L29/511 , C23C16/30 , C23C16/45523 , H01L21/28176 , H01L21/28185 , H01L21/28194 , H01L21/28202 , H01L21/28211 , H01L21/28229 , H01L21/31604 , H01L28/56 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/78
摘要： A semiconductor device comprising a semiconductor substrate, a gate dielectrics formed on the semiconductor substrate and including a silicon oxide film containing a metallic element, the silicon oxide film containing the metallic element including a first region near a lower surface thereof, a second region near an upper surface thereof, and a third region between the first and second regions, the metallic element contained in the silicon oxide film having a density distribution in a thickness direction of the silicon oxide film, a peak of the density distribution existing in the third region, and an electrode formed on the gate dielectrics.
摘要翻译：一种半导体器件，包括半导体衬底，形成在所述半导体衬底上并包括含有金属元素的氧化硅膜的栅极电介质，所述氧化硅膜含有所述金属元素，所述金属元素包括在其下表面附近的第一区域，上表面和第一和第二区域之间的第三区域，包含在氧化硅膜中的金属元素在氧化硅膜的厚度方向上具有密度分布，存在于第三区域中的密度分布的峰值，以及形成在栅极电介质上的电极。

43. 发明授权

US07282774B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US07282774B2
公开(公告)日：2007-10-16
申请号：US11475879
申请日：2006-06-28
申请人： Kazuhiro Eguchi , Seiji Inumiya , Yoshitaka Tsunashima
发明人： Kazuhiro Eguchi , Seiji Inumiya , Yoshitaka Tsunashima
IPC分类号： H01L29/76 , H01L29/94
CPC分类号： H01L29/511 , C23C16/30 , C23C16/45523 , H01L21/28176 , H01L21/28185 , H01L21/28194 , H01L21/28202 , H01L21/28211 , H01L21/28229 , H01L21/31604 , H01L28/56 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/78
摘要： A semiconductor device comprising a semiconductor substrate, a gate dielectrics formed on the semiconductor substrate and including a silicon oxide film containing a metallic element, the silicon oxide film containing the metallic element including a first region near a lower surface thereof, a second region near an upper surface thereof, and a third region between the first and second regions, the metallic element contained in the silicon oxide film having a density distribution in a thickness direction of the silicon oxide film, a peak of the density distribution existing in the third region, and an electrode formed on the gate dielectrics.
摘要翻译：一种半导体器件，包括半导体衬底，形成在所述半导体衬底上并包括含有金属元素的氧化硅膜的栅极电介质，所述氧化硅膜含有所述金属元素，所述金属元素包括在其下表面附近的第一区域，上表面和第一和第二区域之间的第三区域，包含在氧化硅膜中的金属元素在氧化硅膜的厚度方向上具有密度分布，存在于第三区域中的密度分布的峰值，以及形成在栅极电介质上的电极。

44. 发明申请

US20050110101A1 Semiconductor apparatus and method of manufacturing the semiconductor apparatus 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050110101A1
公开(公告)日：2005-05-26
申请号：US10927115
申请日：2004-08-27
申请人： Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
发明人： Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
IPC分类号： C23C14/10 , C23C16/42 , H01L21/28 , H01L21/316 , H01L21/336 , H01L21/822 , H01L21/8234 , H01L21/8238 , H01L27/04 , H01L27/08 , H01L27/088 , H01L27/092 , H01L27/115 , H01L27/12 , H01L29/423 , H01L29/49 , H01L29/51 , H01L29/78 , H01L29/786 , H01L29/76
CPC分类号： H01L21/28185 , H01L21/28194 , H01L21/28211 , H01L27/115 , H01L27/1203 , H01L29/513 , H01L29/517 , H01L29/665 , H01L29/66825 , H01L29/78
摘要： A semiconductor apparatus wherein a device formed on a semiconductor substrate comprises a gate insulating film including a high dielectric constant film formed on the substrate and an anti-reaction film formed on the high dielectric constant film, and a gate electrode formed on the anti-reaction film, the high dielectric constant film comprises a film containing at least one of Hf and Zr, and Si and O, or a film containing at least one of Hf and Zr, and Si, O and N, the anti-reaction film comprises an SiO2 film, a film containing SiO2 as a main component and at least one of Hf and Zr, a film containing SiO2 as a main component and N, a film containing SiO2 as a main component, Hf and N, a film containing SiO2 as a main component, Zr and N, or a film containing SiO2 as a main component, Hf, Zr and N.
摘要翻译：一种半导体装置，其中形成在半导体衬底上的器件包括栅极绝缘膜，该栅极绝缘膜包括形成在基底上的高介电常数膜和形成在高介电常数膜上的抗反应膜，以及形成在抗反应上的栅电极高介电常数膜包括含有Hf和Zr中的至少一种以及Si和O的膜，或包含Hf和Zr中的至少一种以及Si，O和N的膜，所述抗反应膜包括 SiO 2膜，含有SiO 2作为主要成分的膜和Hf和Zr中的至少一种的膜，含有SiO 2的膜作为主要成分为N，以SiO 2为主要成分的膜，Hf和N，以SiO 2为主要成分的膜，Zr和N，或膜含有SiO 2作为主要成分的Hf，Zr和N.

45. 发明申请

US20050067704A1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050067704A1
公开(公告)日：2005-03-31
申请号：US10738049
申请日：2003-12-18
申请人： Akio Kaneko , Seiji Inumiya , Katsuyuki Sekine , Kazuhiro Eguchi , Motoyuki Sato
发明人： Akio Kaneko , Seiji Inumiya , Katsuyuki Sekine , Kazuhiro Eguchi , Motoyuki Sato
IPC分类号： H01L21/283 , H01L21/28 , H01L21/316 , H01L21/336 , H01L21/8238 , H01L23/48 , H01L27/092 , H01L29/423 , H01L29/49 , H01L29/51 , H01L29/78
CPC分类号： H01L21/28194 , H01L21/28079 , H01L21/823842 , H01L21/823857 , H01L29/495 , H01L29/513 , H01L29/517 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device according to the present invention comprises a semiconductor substrate, a gate insulating film which is composed of a material whose main component is a tetravalent metal oxide, a mixture of a tetravalent metal oxide and SiO2, or a mixture of a tetravalent metal oxide and SiON and which containing B when it is in an nMOS structure on the semiconductor substrate or containing at least one of P and As when it is in a pMOS structure on the semiconductor substrate, and a gate electrode made of a metal having a work function of 4 eV to 5.5 eV.
摘要翻译：根据本发明的半导体器件包括半导体衬底，由主要成分为四价金属氧化物的材料，四价金属氧化物和SiO 2的混合物或四价金属氧化物的混合物构成的栅极绝缘膜和SiON，并且当其在半导体衬底上处于pMOS结构中时在半导体衬底上为nMOS结构或含有P和As中的至少一种时含有B，并且由具有功函数的金属制成的栅电极 4 eV至5.5 eV。

46. 发明授权

US08198155B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US08198155B2
公开(公告)日：2012-06-12
申请号：US12693985
申请日：2010-01-26
申请人： Daisuke Ikeno , Tomonori Aoyama , Kazuaki Nakajima , Seiji Inumiya , Takashi Shimizu , Takuya Kobayashi
发明人： Daisuke Ikeno , Tomonori Aoyama , Kazuaki Nakajima , Seiji Inumiya , Takashi Shimizu , Takuya Kobayashi
IPC分类号： H01L21/8234 , H01L21/8238 , H01L29/51
CPC分类号： H01L21/823842 , H01L21/28088 , H01L21/823807 , H01L21/82385 , H01L29/1054 , H01L29/4966 , H01L29/513 , H01L29/517 , H01L29/6659
摘要： A semiconductor device according to an embodiment of the present invention includes an N-type transistor formed in a first region on a substrate, and a P-type transistor formed in a second region on the substrate. The device includes the substrate, a first gate insulation film formed on the substrate in the first and second regions, and containing silicon, a second gate insulation film formed on the first gate insulation film in the first region, and containing first metal and oxygen, a third gate insulation film formed on the first gate insulation film in the second region, and containing second metal different from the first metal and oxygen, a fourth gate insulation film formed on the second and third gate insulation films in the first and second regions, and containing hafnium, and a gate electrode layer formed on the fourth gate insulation film in the first and second regions, and containing metal and nitrogen, a thickness of the gate electrode layer formed in the second region being greater than a thickness of the gate electrode layer formed in the first region.
摘要翻译：根据本发明的实施例的半导体器件包括形成在衬底上的第一区域中的N型晶体管和形成在衬底上的第二区域中的P型晶体管。该器件包括衬底，形成在第一和第二区域的衬底上并含有硅的第一栅极绝缘膜，形成在第一区域中的第一栅极绝缘膜上并且包含第一金属和氧的第二栅极绝缘膜，形成在所述第二区域中的所述第一栅极绝缘膜上并且包含不同于所述第一金属和氧的第二金属的第三栅极绝缘膜，形成在所述第一和第二区域中的所述第二和第三栅极绝缘膜上的第四栅极绝缘膜，并且含有铪，以及形成在第一和第二区域中的第四栅极绝缘膜上并且包含金属和氮的栅极电极层，在第二区域中形成的栅电极层的厚度大于栅电极的厚度层形成在第一区域中。

47. 发明授权

US08168499B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08168499B2
公开(公告)日：2012-05-01
申请号：US12662581
申请日：2010-04-23
申请人： Masato Koyama , Yoshinori Tsuchiya , Seiji Inumiya
发明人： Masato Koyama , Yoshinori Tsuchiya , Seiji Inumiya
IPC分类号： H01L21/8234
CPC分类号： H01L21/823842 , H01L21/28097 , H01L21/823835 , H01L21/823857 , H01L29/4975 , H01L29/517 , H01L29/665 , H01L29/66545
摘要： It is made possible to provide a method for manufacturing a semiconductor device that includes CMISs each having a low threshold voltage Vth and a Ni-FUSI/SiON or high-k gate insulating film structure. The method comprises: forming a p-type semiconductor region and an n-type semiconductor region insulated from each other in a substrate; forming a first and second gate insulating films on the p-type and n-type semiconductor regions, respectively; forming a first nickel silicide having a composition of Ni/Si
摘要翻译：可以提供一种半导体器件的制造方法，该半导体器件包括具有低阈值电压Vth和Ni-FUSI / SiON或高k栅极绝缘膜结构的CMIS。该方法包括：在衬底中形成彼此绝缘的p型半导体区域和n型半导体区域; 在p型和n型半导体区分别形成第一和第二栅极绝缘膜; 在所述第一栅极绝缘膜上方形成具有Ni / Si <31/12的组成的第一硅化镍和在所述第二栅极绝缘膜上具有Ni /Si≥31/ 12的组成的第二硅化镍; 以及通过使铝通过第一硅化镍扩散，在第一硅化镍和第一栅极绝缘膜之间的界面处分离铝。

48. 发明授权

US08143676B2 Semiconductor device having a high-dielectric-constant gate insulating film 失效
标题翻译：具有高介电常数栅极绝缘膜的半导体器件
公开(公告)号：US08143676B2
公开(公告)日：2012-03-27
申请号：US12261770
申请日：2008-10-30
申请人： Seiji Inumiya , Takuya Kobayashi , Tomonori Aoyama
发明人： Seiji Inumiya , Takuya Kobayashi , Tomonori Aoyama
IPC分类号： H01L21/02
CPC分类号： H01L21/823857 , H01L21/02148 , H01L21/02156 , H01L21/02161 , H01L21/02178 , H01L21/02192 , H01L21/022 , H01L21/0228 , H01L21/02332 , H01L21/0234 , H01L21/3162 , H01L21/31641 , H01L21/31645
摘要： A semiconductor device includes a substrate having first and second regions on a surface thereof, a first conductivity type first MISFET formed in the first region and a second conductivity type second MISFET formed in the second region. The first MISFET includes a silicon oxide film or a silicon oxynitride film formed on the surface of the substrate and a first insulating film which is formed in contact with the silicon oxide film or the silicon oxynitride film and which has a first element forming electric dipoles that reduce a threshold voltage of the first MISFET and the second MISFET includes a silicon oxide film or a silicon oxynitride film formed on the surface of the substrate, and a second insulating film which is formed in contact with the silicon oxide film or the silicon oxynitride film formed on the surface of the substrate and which has a second element forming electric dipoles in a direction opposite to that in the first MISFET.
摘要翻译：半导体器件包括在其表面上具有第一和第二区域的衬底，在第一区域中形成的第一导电类型的第一MISFET和形成在第二区域中的第二导电类型的第二MISFET。第一MISFET包括在基板的表面上形成的氧化硅膜或氮氧化硅膜，以及形成为与氧化硅膜或氮氧化硅膜接触形成的第一元件的第一绝缘膜，其具有形成电偶极子的第一元件，降低第一MISFET的阈值电压，并且第二MISFET包括在衬底的表面上形成的氧化硅膜或氧氮化硅膜，以及形成为与氧化硅膜或氮氧化硅膜接触的第二绝缘膜形成在基板的表面上，并且具有在与第一MISFET中的方向相反的方向上形成电偶极子的第二元件。

49. 发明申请

US20120045882A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：半导体器件制造方法
公开(公告)号：US20120045882A1
公开(公告)日：2012-02-23
申请号：US13282507
申请日：2011-10-27
申请人： Seiji Inumiya , Tomonori Aoyama
发明人： Seiji Inumiya , Tomonori Aoyama
IPC分类号： H01L21/762 , H01L21/28
CPC分类号： H01L21/28167 , H01L21/02057 , H01L21/28088 , H01L21/28194 , H01L21/28202 , H01L21/7624 , H01L21/823857 , H01L29/4966 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/66795 , H01L29/785
摘要： A semiconductor device manufacturing method includes: removing an insulating film on a semiconductor substrate by etching and subsequently oxidizing a surface of the semiconductor substrate by using a liquid oxidation agent without exposing this surface to an atmosphere, thereby forming a first insulating film containing an oxide of a constituent element of the semiconductor substrate on the surface of the semiconductor substrate; forming a second insulating film containing an aluminum oxide on the first insulating film; forming a third insulating film containing a rare earth oxide on the second insulating film; forming a high-k insulating film on the third insulating film; introducing nitrogen into the high-k insulating film to thereby make it a fourth insulating film; and conducting heat treatment to change the first through third insulating films into a insulating film made of a mixture containing aluminum, a rare earth element, the constituent element of the semiconductor substrate, and oxygen.
摘要翻译：半导体器件制造方法包括：通过使用液体氧化剂蚀刻并随后氧化半导体衬底的表面而在半导体衬底上去除绝缘膜而不将该表面暴露在大气中，从而形成含有氧化物的第一绝缘膜半导体衬底的表面上的构成元件; 在所述第一绝缘膜上形成含有氧化铝的第二绝缘膜; 在所述第二绝缘膜上形成含有稀土类氧化物的第三绝缘膜; 在第三绝缘膜上形成高k绝缘膜; 将氮引入高k绝缘膜，从而使其成为第四绝缘膜; 并且进行热处理以将第一至第三绝缘膜改变为由含有铝，稀土元素，半导体衬底的构成元素和氧的混合物制成的绝缘膜。

50. 发明授权

US07824976B2 Semiconductor apparatus and method of manufacturing the semiconductor apparatus 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07824976B2
公开(公告)日：2010-11-02
申请号：US12654559
申请日：2009-12-23
申请人： Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
发明人： Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
IPC分类号： H01L21/8249
CPC分类号： H01L21/28185 , H01L21/28194 , H01L21/28211 , H01L27/115 , H01L27/1203 , H01L29/513 , H01L29/517 , H01L29/665 , H01L29/66825 , H01L29/78
摘要： A semiconductor apparatus wherein a device formed on a semiconductor substrate comprises a gate insulating film including a high dielectric constant film formed on the substrate and an anti-reaction film formed on the high dielectric constant film, and a gate electrode formed on the anti-reaction film, the high dielectric constant film comprises a film containing at least one of Hf and Zr, and Si and O, or a film containing at least one of Hf and Zr, and Si, O and N, the anti-reaction film comprises an SiO2 film, a film containing SiO2 as a main component and at least one of Hf and Zr, a film containing SiO2 as a main component and N, a film containing SiO2 as a main component, Hf and N, a film containing SiO2 as a main component, Zr and N, or a film containing SiO2 as a main component, Hf, Zr and N.
摘要翻译：一种半导体装置，其中形成在半导体衬底上的器件包括栅极绝缘膜，该栅极绝缘膜包括形成在基底上的高介电常数膜和形成在高介电常数膜上的抗反应膜，以及形成在抗反应上的栅电极高介电常数膜包括含有Hf和Zr中的至少一种以及Si和O的膜，或包含Hf和Zr中的至少一种以及Si，O和N的膜，所述抗反应膜包括 SiO 2膜，含有SiO 2作为主要成分的膜和Hf和Zr中的至少一种，以SiO 2为主要成分的膜和N，以SiO 2为主要成分的膜，Hf和N，含有SiO 2作为主成分Zr和N，或以SiO2为主要成分的膜，Hf，Zr和N.

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