专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US06298282B1 Robot crash sensor system 有权
标题翻译：机器人碰撞传感器系统
公开(公告)号：US06298282B1
公开(公告)日：2001-10-02
申请号：US09338753
申请日：1999-06-23
申请人： Richard L. Guldi , Robin D. Worley , Keith W. Melcher
发明人： Richard L. Guldi , Robin D. Worley , Keith W. Melcher
IPC分类号： G06F1900
CPC分类号： B25J9/1674 , G05B19/4061 , G05B2219/37434 , G05B2219/39082 , Y10S477/906 , Y10S477/907 , Y10T74/20305
摘要： A method of detecting object scratching during robotic arm movement of the object. The method includes providing a robotic arm for grasping and placing of an object into a cassette and providing a cassette having an entrance for receiving an object therein. A vibration sensor is placed on at least one of the robotic arm or under the cassette control of the robotic arm is provided in response to a malfunction indication at least one of the vibration sensors. There can further be provided an air flow across the entrance of the cassette with placement of a particle counter at the downstream end of the air flow across cassette entrance, wherein the control of said robotic arm is provided in response to a malfunction indication at least one of the vibration sensors and the particle counter. The control can also be provided in response to both of the vibration sensors or one or both of the vibration sensors and the particle counter. The control can be one or more of making a record of the malfunction, providing an alarm signal or terminating operation of the arm. The object is preferably some form of disc or disc-shaped object.
摘要翻译：一种在物体的机器人臂运动期间检测物体划伤的方法。该方法包括提供用于将物体夹持并放置到盒中的机器臂，并提供具有用于在其中接收物体的入口的盒。响应于至少一个振动传感器的故障指示，设置有振动传感器，所述振动传感器被放置在所述机器臂的至少一个上或所述机器人臂的盒控制下。可以进一步提供穿过盒的入口的空气流，其中颗粒计数器位于穿过盒入口的空气流的下游端，其中响应于故障指示提供所述机器人手臂的控制，至少一个的振动传感器和粒子计数器。还可以响应于两个振动传感器或者一个或两个振动传感器和粒子计数器来提供控制。该控制可以是记录故障的一个或多个，提供报警信号或手臂的终止操作。该物体最好是某种形式的盘或盘形物体。

42. 发明授权

US06197123B1 Method for cleaning a process chamber used for manufacturing substrates during nonproduction intervals 有权
标题翻译：用于在非生产间隔期间清洁用于制造基板的处理室的方法
公开(公告)号：US06197123B1
公开(公告)日：2001-03-06
申请号：US09212027
申请日：1998-12-15
申请人： Frank D. Poag , Richard L. Guldi
发明人： Frank D. Poag , Richard L. Guldi
IPC分类号： B08B504
CPC分类号： C23C16/45561 , C23C16/4405 , C23C16/52 , H01L21/67028 , Y10S134/902
摘要： A method for processing substrates such as semiconductor wafers (21) includes providing a chamber (12) having a production nozzle (26) and two cleaning nozzles (36, 41). During production intervals, a level of particles carried by gases exiting the chamber are measured by an in-situ particle monitor (53). If an abnormally high particle level is detected, a cleaning procedure is carried out during a nonproduction interval which exists between production intervals in a production mode. During this cleaning, the chamber is maintained at a low pressure by a vacuum pump (56), and a cleaning gas (GAS1) is supplied through valves (83, 103, 108) and mass flow controllers (81, 101, 106) to respective nozzles. The valves are controlled so as to pulse or modulate the flow of the cleaning gas to the nozzles.
摘要翻译：一种用于处理诸如半导体晶片（21）的基板的方法包括提供具有生产喷嘴（26）和两个清洁喷嘴（36,41）的腔室（12）。在生产间隔期间，通过原位颗粒监测器（53）测量离开室的气体携带的颗粒水平。如果检测到异常高的颗粒水平，则在生产模式中的生产间隔之间存在的非生产间隔期间执行清洁程序。在该清洗期间，通过真空泵（56）将室保持在低压状态，通过阀（83,103,108）和质量流量控制器（81,101,106）供给清洁气体（GAS1）至各个喷嘴。控制阀门以便将清洁气体的流动脉冲或调节到喷嘴。

43. 发明授权

US5958517A System and method for cleaning nozzle delivering spin-on-glass to substrate 失效
标题翻译：用于清洗喷嘴的旋转玻璃到基板的系统和方法
公开(公告)号：US5958517A
公开(公告)日：1999-09-28
申请号：US994910
申请日：1997-12-19
申请人： Frank D. Poag , Richard L. Guldi , Douglas E. Paradis , Paul C. Hashim
发明人： Frank D. Poag , Richard L. Guldi , Douglas E. Paradis , Paul C. Hashim
IPC分类号： B05B15/02 , B05C11/08 , H01L21/00 , H01L21/31 , H01L21/316 , B05D1/02 , B05B7/16
CPC分类号： H01L21/6715 , B05B15/025 , B05B15/0258 , B05C11/08
摘要： A system (12) for delivering spin-on-glass (SOG) to a substrate (14) has a spin chuck (16) for spinning a substrate (14), a delivery nozzle (18, 118, 218, 318, 418) having an interior conduit (419), a delivery nozzle-positioning subsystem (62) coupled to the delivery nozzle (18, 118, 218, 318, 418) for selectively positioning the delivery nozzle (18, 118, 218, 318, 418) over the spin chuck (16) for delivery of SOG, a SOG supply line (60, 160, 360) for supplying SOG, a cleaning fluid supply line (22, 122, 322) for supplying a cleaning fluid used to remove dried SOG, and a valve subsystem (20, 120, 320) fluidly coupled to the SOG supply line (60, 160, 360), cleaning-fluid supply line (22, 122, 322), and delivery nozzle (18, 118, 218, 318, 418) for selectively delivering SOG or a cleaning fluid through the interior conduit (419) of the delivery nozzle (18, 118, 218, 318, 418). A cleaning station 466 may be used to clean an exterior (421) of the nozzle (18, 118 218, 318, 418). A method for applying SOG to a substrate (14) through a delivery nozzle (18, 118,218,318,418) and for cleaning the delivery nozzle (18, 118, 218, 318, 418) includes the steps of delivering SOG to the substrate (14) and cleaning the nozzle (18, 118, 218, 318, 418) when cleaning is desirable by among other things delivering a cleaning fluid from a cleaning fluid supply line (22, 122, 322) through the valve subsystem (20, 120, 320) to the interior conduit (419) of the delivery nozzle (18, 118, 218, 318, 418) to remove any SOG from the interior conduit (419).
摘要翻译：用于将旋涂玻璃（SOG）输送到基材（14）的系统（12）具有用于纺丝基材（14）的旋转卡盘（16），输送喷嘴（18,118,218,318,418）具有内部导管（419），联接到所述输送喷嘴（18,118,218,318,418）的输送喷嘴定位子系统（62），用于选择性地定位所述输送喷嘴（18,118,218,318,418）通过用于输送SOG的旋转卡盘（16），用于供应SOG的SOG供应管线（60,160,360），用于供应用于去除干燥的SOG的清洁流体的清洁流体供应管线（22,122,322）和流体耦合到SOG供应管线（60,160,360），清洁液供应管线（22,122,322）和输送喷嘴（18,118,218,318）的阀门子系统（20,120,320），418），用于通过所述输送喷嘴（18,118,218,318,418）的内部导管（419）选择性地输送SOG或清洁流体。清洁站466可用于清洁喷嘴（18,118,218,218,418）的外部（421）。通过输送喷嘴（18,118,218,318,418）将SOG施加到基底（14）并用于清洁输送喷嘴（18,118,218,318,418）的方法包括以下步骤：将SOG输送到基底（14）和当通过阀子系统（20,120,320）从清洁流体供应管线（22,122,322）输送清洁流体时，清洁是理想的，清洁喷嘴（18,118,218,318,418）到达输送喷嘴（18,118,218,318,418）的内部导管（419）以从内部导管（419）去除任何SOG。

44. 发明授权

US5841543A Method and apparatus for verifying the presence of a material applied to a substrate 失效
标题翻译：用于验证施加到基底的材料的存在的方法和装置
公开(公告)号：US5841543A
公开(公告)日：1998-11-24
申请号：US401741
申请日：1995-03-09
申请人： Richard L. Guldi , Douglas E. Paradis
发明人： Richard L. Guldi , Douglas E. Paradis
IPC分类号： G01N21/956 , G01N11/00
CPC分类号： G01N21/956
摘要： The invention provides a process for evaluating a substrate, such as a wafer of semiconductive material having a semiconductor die at least partially formed thereon, as to the condition of an overlying film, such as an overlying film of photoresist that is applied to the semiconductor die prior to metal etching and ion implantation. The condition of the film is evaluated by exposing at least a portion of the substrate to electromagnetic radiation and evaluating the wave profile of the reflected beam. In instances where it is desirable to evaluate the substrate for the presence or absence of photoresist, ultraviolet or near ultraviolet light having a wavelength of about 240-650 nm can be used, as such wavelengths are strongly absorbed by photoresist. In contrast, areas of the substrate that are not covered by photoresist will not significantly absorb ultraviolet or near ultraviolet radiation. The presence or absence of the film under study can be evaluated by detecting reflected light from the substrate and comparing the detected light to a known profile. When photoresist films are under evaluation, the profile will feature portions of relatively low amplitude, which correspond to absorption of uv due to the presence of photoresist, and portions of relatively high amplitude, which correspond to non-absorption (reflectance) of uv. While the principles of the invention are applicable to single-point testing of a substrate, it is preferable to undertake a multi-point, and more preferably a continuous scan, of at least a portion of the substrate to minimize the occurrence of possibly erroneous results, as could occur from sampling a portion of the substrate that was deliberately not patterned with the film under study.
摘要翻译：本发明提供了一种用于评估衬底的方法，例如半导体材料的晶片，其半导体晶片至少部分地形成在其上，关于覆盖膜的状态，例如施加到半导体管芯的光致抗蚀剂的覆盖膜在金属蚀刻和离子注入之前。通过将基板的至少一部分暴露于电磁辐射并评估反射光束的波形来评估膜的状态。在需要评价基板是否存在光致抗蚀剂的情况下，可以使用波长为约240-650nm的紫外线或近紫外光，因为这些波长被光致抗蚀剂强烈吸收。相比之下，未被光致抗蚀剂覆盖的基板的区域将不会显着吸收紫外线或近紫外线。可以通过检测来自衬底的反射光并将检测到的光与已知的光谱进行比较来评估所研究的膜的存在或不存在。当正在评价光致抗蚀剂膜时，轮廓将具有相对于由于存在光致抗蚀剂而对uv的吸收以及对应于uv的非吸收（反射率）的相对高幅度的部分的相对低振幅的部分。虽然本发明的原理适用于基板的单点测试，但是优选进行至少一部分基板的多点，更优选连续扫描，以最小化可能错误结果的发生，这可能是由于对正在研究的膜故意未图案化的一部分基底进行取样而发生的。

45. 发明授权

US5839455A Enhanced high pressure cleansing system for wafer handling implements 失效
标题翻译：用于晶片处理工具的增强型高压清洗系统
公开(公告)号：US5839455A
公开(公告)日：1998-11-24
申请号：US422331
申请日：1995-04-13
申请人： Virgil Q. Turner , William D. Light , Hilario T. Trevino , Richard L. Guldi , Frank Poag , Douglas E. Paradis
发明人： Virgil Q. Turner , William D. Light , Hilario T. Trevino , Richard L. Guldi , Frank Poag , Douglas E. Paradis
IPC分类号： B08B5/02 , H01L21/00 , B08B3/02
CPC分类号： H01L21/67017 , B08B5/02 , Y10S134/902
摘要： Methods and apparatus are providing for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination of semiconductor devices being assembled upon the semiconductor wafers. In one aspect of the invention, a substrate such as a semiconductor cassette or other semiconductor wafer handling implement, is inserted into a chamber that is substantially isolated from a surrounding environment. A pressurized, and optionally purified, cleansing medium is directed against at least one surface of the substrate to dislodge contaminants from the substrate surface. Dislodged contaminants are evacuated with negative pressure from the chamber. In a preferred aspect of the invention, the cleansing medium is an inert gas, such as nitrogen, and is applied to the substrate at a pressure from about 10 p.s.i. to about 100 or more p.s.i. The chamber can be provided with sidewalls define a convergent evacuation path that is in fluid communication with an exhaust stream, such as the exhaust stack of the manufacturing facility.
摘要翻译：方法和设备提供用于清洁基底（例如半导体晶片处理工具）的污染物，从而减少组装在半导体晶片上的半导体器件的污染的发生。在本发明的一个方面，诸如半导体盒或其他半导体晶片处理工具的衬底被插入到与周围环境基本隔离的室中。加压和任选地纯化的清洁介质被引导到基底的至少一个表面以从基底表面去除污染物。移出的污染物用来自室的负压抽真空。在本发明的优选方面，清洁介质是惰性气体，例如氮气，并以约10p.s.i的压力施加到基材上。至约100个或更多p.s.i。腔室可以设置有限定与排气流（例如制造设备的排气叠层）流体连通的会聚排气路径的侧壁。

46. 发明授权

US5525529A Method for reducing dopant diffusion 失效
标题翻译：降低掺杂剂扩散的方法
公开(公告)号：US5525529A
公开(公告)日：1996-06-11
申请号：US340770
申请日：1994-11-16
申请人： Richard L. Guldi
发明人： Richard L. Guldi
IPC分类号： H01L21/265 , H01L21/336 , H01L21/8238 , H01L21/266
CPC分类号： H01L29/6659 , H01L21/2652 , H01L21/823814 , Y10S148/007 , Y10S438/902 , Y10S438/976
摘要： A process is disclosed for inhibiting undesired diffusion of implanted dopants during and after dopant activation, as can occur during source/drain anneal. Undesired dopant diffusion is minimized by a dopant blocking layer, which is applied to the semiconductor body prior to dopant activation, and preferably prior to dopant implantation. The composition of the blocking layer is selected in accordance with the diffusion mechanism of the dopant to be implanted so that the concentration of lattice vacancies or interstitials (depending upon the dopant diffusion mechanism) is reduced, thereby inhibiting undesired migration of the implanted species.
摘要翻译：公开了一种用于在掺杂剂激活期间和之后抑制注入的掺杂剂的不期望的扩散的过程，如在源/漏退火期间可能发生的那样。不期望的掺杂剂扩散被掺杂剂阻挡层最小化，掺杂剂阻挡层在掺杂剂激活之前施加到半导体主体，并且优选在掺杂剂注入之前。根据待注入的掺杂剂的扩散机理来选择阻挡层的组成，使得晶格空位或间隙的浓度（取决于掺杂剂扩散机理）降低，由此抑制植入物质的不期望的迁移。

47. 发明授权

US08273523B2 By-die-exposure for patterning of holes in edge die 有权
标题翻译：用于图案化边缘模具中的孔的逐模曝光
公开(公告)号：US08273523B2
公开(公告)日：2012-09-25
申请号：US11617130
申请日：2006-12-28
申请人： Shangting Detweiler , Basab Chatterjee , Chris D. Atkinson , Richard L. Guldi
发明人： Shangting Detweiler , Basab Chatterjee , Chris D. Atkinson , Richard L. Guldi
IPC分类号： G03F7/20
CPC分类号： H01L21/76816 , G03F7/70425 , G03F7/70625
摘要： In accordance with the invention, there are semiconductor devices and methods of making semiconductor devices and holes. The method of making a semiconductor device can comprise forming a photoresist layer over a surface of a wafer, wherein the wafer comprises an edge that has a substantially rounded profile, an array of dies, and at least one edge die. The method can also comprise dividing a shot area into a plurality of shot portions and assigning a blind ID to each of the plurality of shot portions. The method can further comprise identifying one or more edge shot portions on the edge of the wafer for additional exposure; and exposing one or more times identified one or more edge shot portions on the edge of the wafer and blocking non-identified one or more non-edge shot portions.
摘要翻译：根据本发明，存在制造半导体器件和孔的半导体器件和方法。制造半导体器件的方法可以包括在晶片的表面上形成光致抗蚀剂层，其中晶片包括具有基本圆形轮廓的边缘，模具阵列和至少一个边缘模具。该方法还可以包括将拍摄区域分成多个拍摄部分，并将多个拍摄部分中的每一个分配盲ID。该方法还可以包括识别晶片边缘上的一个或多个边缘照射部分用于附加曝光; 并且在晶片的边缘上暴露出一个或多个标识出的一个或多个边缘射出部分并且阻挡未识别的一个或多个非边缘射出部分。

48. 发明授权

US07897410B2 Close proximity scanning surface contamination analyzer 有权
标题翻译：近距离扫描表面污染分析仪
公开(公告)号：US07897410B2
公开(公告)日：2011-03-01
申请号：US11959080
申请日：2007-12-18
申请人： Sean M. Collins , Jeffrey W. Ritchison , Richard L. Guldi , Kelly J. Taylor
发明人： Sean M. Collins , Jeffrey W. Ritchison , Richard L. Guldi , Kelly J. Taylor
IPC分类号： G01N33/00 , G01N27/00
CPC分类号： H01J49/0004 , G01R31/2648 , Y10T29/49004
摘要： Reducing chemical contaminants is increasingly important for maintaining competitive production costs during fabrication of electronic devices. There is currently no production floor capability for mapping chemical contaminants across an electronic device substrate on a routine basis. A scanning surface chemical analyzer for mapping the distributions of a variety of chemicals on substrates is disclosed. The analyzer includes an array of sensors, each of which detects a single chemical or narrow range of chemicals, a scanning mechanism to provide a mapping capability, an electrical signal analyzer to collect and analyze signals from the array of sensors and generate reports of chemical distributions, and an optical desorption mechanism to amplify detection. A preferred embodiment includes an array of miniature quadrupole mass spectrometers in the sensor array. Scanning modes include whole substrate mapping, region sampling, and spot sampling of known defect sites.
摘要翻译：减少化学污染物对于在电子设备制造过程中保持竞争性的生产成本越来越重要。目前没有生产基地的能力，用于在日常的基础上映射电子设备基板上的化学污染物。公开了一种用于映射各种化学品在基片上的分布的扫描表面化学分析仪。该分析仪包括一组传感器，每个传感器检测化学品的单一化学或窄范围，提供映射能力的扫描机构，电信号分析仪，用于收集和分析来自传感器阵列的信号，并生成化学分布的报告，以及用于放大检测的光解吸机理。优选实施例包括传感器阵列中的微型四极杆质谱仪阵列。扫描模式包括全基板映射，区域采样和已知缺陷位点的采样。

49. 发明授权

US07596456B2 Method and apparatus for cassette integrity testing using a wafer sorter 有权
标题翻译：使用晶片分选机进行盒式磁带完整性测试的方法和装置
公开(公告)号：US07596456B2
公开(公告)日：2009-09-29
申请号：US11282997
申请日：2005-11-18
申请人： Kelly C. Mollenkopf , Chris D. Atkinson , Richard L. Guldi
发明人： Kelly C. Mollenkopf , Chris D. Atkinson , Richard L. Guldi
IPC分类号： G01B3/00 , G01B5/00 , G01B3/44 , G01B3/52 , G01N37/00
CPC分类号： H01L21/67265 , H01L21/67271
摘要： A system and methods for the evaluation of the integrity of a wafer cassette and the disposition thereof are based upon evaluation of wafer measurement data obtained using a wafer sorter cassette mapping system utilized in-line during wafer sorting operations. In one embodiment, wafers are placed into slots in the wafer cassette. A wafer sorter cassette mapping sensor is scanned over the wafers in the wafer cassette. The positions of the wafers are measured while scanning the sensor over the wafers. The wafer position measurements are evaluated using a modeling system to determine slot positions, and a determination of the integrity of the cassette is generated. If the integrity determination indicates that the cassette is deformed beyond a predetermined value, the cassette is replaced. The measurement data may be stored in a data base for further trend analysis or for replacement forecasting.
摘要翻译：用于评估晶片盒的完整性的系统和方法及其配置基于在晶片分选操作期间使用在线使用的晶片分拣机盒式测绘系统获得的晶片测量数据的评估。在一个实施例中，将晶片放置在晶片盒中的槽中。在晶片盒中的晶片上扫描晶片分拣机盒映射传感器。在晶片上扫描传感器时测量晶片的位置。使用建模系统评估晶片位置测量以确定槽位置，并且产生盒的完整性的确定。如果完整性确定指示盒变形超过预定值，则更换盒。测量数据可以存储在用于进一步趋势分析或替换预测的数据库中。

50. 发明申请

US20080160779A1 BY-DIE-EXPOSURE FOR PATTERNING OF HOLES IN EDGE DIE 有权
标题翻译：用于在边缘模具中嵌入孔的旁路曝光
公开(公告)号：US20080160779A1
公开(公告)日：2008-07-03
申请号：US11617130
申请日：2006-12-28
申请人： Shangting Detweiler , Basab Chatterjee , Chris D. Atkinson , Richard L. Guldi
发明人： Shangting Detweiler , Basab Chatterjee , Chris D. Atkinson , Richard L. Guldi
IPC分类号： H01L21/469
CPC分类号： H01L21/76816 , G03F7/70425 , G03F7/70625
摘要： In accordance with the invention, there are semiconductor devices and methods of making semiconductor devices and holes. The method of making a semiconductor device can comprise forming a photoresist layer over a surface of a wafer, wherein the wafer comprises an edge that has a substantially rounded profile, an array of dies, and at least one edge die. The method can also comprise dividing a shot area into a plurality of shot portions and assigning a blind ID to each of the plurality of shot portions. The method can further comprise identifying one or more edge shot portions on the edge of the wafer for additional exposure; and exposing one or more times identified one or more edge shot portions on the edge of the wafer and blocking non-identified one or more non-edge shot portions.
摘要翻译：根据本发明，存在制造半导体器件和孔的半导体器件和方法。制造半导体器件的方法可以包括在晶片的表面上形成光致抗蚀剂层，其中晶片包括具有基本圆形轮廓的边缘，模具阵列和至少一个边缘模具。该方法还可以包括将拍摄区域分成多个拍摄部分，并将多个拍摄部分中的每一个分配盲ID。该方法还可以包括识别晶片边缘上的一个或多个边缘照射部分用于附加曝光; 并且在晶片的边缘上暴露出一个或多个标识出的一个或多个边缘射出部分并且阻挡未识别的一个或多个非边缘射出部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式