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41. 发明申请

US20050009244A1 Method for sealing semiconductor component 有权
标题翻译：密封半导体元件的方法
公开(公告)号：US20050009244A1
公开(公告)日：2005-01-13
申请号：US10885678
申请日：2004-07-08
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L23/28 , H01L21/44 , H01L21/56 , H01L23/12 , H01L23/31 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L23/3157 , H01L21/56 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.
摘要翻译：结合具有电路区域和形成在基板表面上的电极的半导体部件，通过（1）在基板表面上施加抗蚀剂材料以形成抗蚀剂层来密封电路区域，（2）将抗蚀剂层选择性地暴露于辐射并用液体显影剂显影抗蚀剂，从而仅去除覆盖电路区域的抗蚀剂层的部分，（3）将树脂密封剂施加到电路区域上并将树脂密封剂固化成覆盖电路的固化树脂层区域，（4）使用溶剂除去残留抗蚀剂层。

42. 发明授权

US09397271B2 UV- and heat-resistant optoelectronic semiconductor component 有权
标题翻译：耐紫外线和耐热光电半导体元件
公开(公告)号：US09397271B2
公开(公告)日：2016-07-19
申请号：US12922240
申请日：2009-04-20
申请人： Harald Jaeger , Joerg Erich Sorg , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Harald Jaeger , Joerg Erich Sorg , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00 , H01L33/48 , H05K1/03
CPC分类号： H01L33/483 , H01L2224/48091 , H01L2924/12044 , H01L2924/181 , H05K1/0366 , H05K2201/0162 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.
摘要翻译：光电子半导体部件包括具有至少两个连接点的连接载体和在连接载体的主侧中的载体顶部，其中连接载体配置有具有纤维增强的硅树脂基体，至少一个光电子半导体芯片安装在连接承载件并且与其直接接触，环形灌封体包括载体顶部上的软硅胶，并且与载体顶部直接接触，但不与半导体芯片直接接触;以及玻璃体，其包括施加在玻璃片上的玻璃体半导体芯片和灌封体的上侧远离连接载体，从而在半导体芯片和灌封体之间形成空间。

43. 发明授权

US09074101B2 Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith 有权
标题翻译：硅氧烷接枝二氧化硅，透明硅氧烷组合物和用其封装的光电器件
公开(公告)号：US09074101B2
公开(公告)日：2015-07-07
申请号：US12270720
申请日：2008-11-13
申请人： Norio Tsubokawa , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Norio Tsubokawa , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06 , C08F30/08 , C09C1/30 , B82Y30/00 , C01B33/149 , C01B33/18 , H01L23/29 , H05B33/04
CPC分类号： C09C1/3081 , B82Y30/00 , C01B33/149 , C01B33/18 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C01P2006/32 , C01P2006/60 , H01L23/295 , H01L23/296 , H01L2924/0002 , H01L2924/12044 , H05B33/04 , H01L2924/00
摘要： Silica particles having 4-30% of an organopolysiloxane grafted to surfaces thereof are provided. A silicone composition loaded with such silica particles has high transparency, minimized permeability to corrosive gases, and improved encapsulation ability.
摘要翻译：提供了具有4-30％接枝到其表面的有机聚硅氧烷的二氧化硅颗粒。装有这种二氧化硅颗粒的硅氧烷组合物具有高透明度，最小化对腐蚀性气体的渗透性和改进的包封能力。

44. 发明授权

US08759456B2 Addition reaction-curable organopolysilmethylenesiloxane copolymer composition 有权
标题翻译：加成反应可固化的有机聚硅氧烷硅氧烷共聚物组合物
公开(公告)号：US08759456B2
公开(公告)日：2014-06-24
申请号：US13405588
申请日：2012-02-27
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Takeshi Fukuda
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Takeshi Fukuda
IPC分类号： C08G77/50 , C08L83/10 , C08L83/14
CPC分类号： C08G77/50 , C08L83/10 , C08L83/14
摘要： Disclosed is an addition reaction-curable organopolysilmethylenesiloxane copolymer composition including: (A) an organopolysilmethylenesiloxane copolymer represented by formula (a) shown below: which has in one molecule at least two alkenyl groups bonding to silicon atoms; (B) an organopolysiloxane represented by formula (b) shown below: R2aSiO(4-a)/2 (b) which has in one molecule at least two alkenyl groups bonding to silicon atoms; (C) an organohydrogenpolysilmethylenesiloxane and/or organohydrogenpolysiloxane; and (D) a platinum group metal-based catalyst. The copolymer composition excels in heat resistance, electrical insulation, mechanical strength, and optical properties, and exhibits good water resistance, hydrolysis resistance and gas barrier properties under severe use conditions without suffering gas permeability and poor chemical resistance inherent in silicone rubber.
摘要翻译：公开了一种加成反应可固化的有机聚硅氧烷硅氧烷共聚物组合物，其包含：（A）由下式（a）表示的有机聚硅氧烷基硅氧烷共聚物：其在一个分子中具有至少两个与硅原子键合的烯基; （B）由下式（b）表示的有机聚硅氧烷：在一分子中具有至少两个与硅原子键合的烯基的R2aSiO（4-a）/ 2（b）（C）有机氢聚硅亚甲基硅氧烷和/或有机氢聚硅氧烷; 和（D）铂族金属类催化剂。该共聚物组合物的耐热性，电绝缘性，机械强度和光学性能优异，并且在严苛的使用条件下表现出良好的耐水性，耐水解性和气体阻隔性，而不会导致硅橡胶固有的气体渗透性和差的耐化学性。

45. 发明授权

US08610293B2 Resin composition for encapsulating optical semiconductor element and optical semiconductor device 有权
标题翻译：用于封装光学半导体元件和光学半导体器件的树脂组合物
公开(公告)号：US08610293B2
公开(公告)日：2013-12-17
申请号：US12967746
申请日：2010-12-14
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L23/29 , H01L23/28 , H01L31/0203 , H01L33/00
CPC分类号： C08K3/34 , C08K3/36 , H01L23/295 , H01L24/73 , H01L33/56 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： A resin composition containing a silica-based filler which differs in refractive index by ±0.03 from the curable base resin and has a thermal conductivity no lower than 0.5 W/m·K, and a light-emitting diode encapsulated with said resin composition. The resin composition is preferably prepared from a curable silicone resin which imparts a cured product having a refractive index of 1.45 to 1.55 and cristobalite powder dispersed therein.
摘要翻译：一种含有二氧化硅系填料的树脂组合物，其折射率与可固化基础树脂的折射率不同，具有不低于0.5W / m·K的热导率，和用该树脂组合物封装的发光二极管。树脂组合物优选由赋予折射率为1.45〜1.55的固化物和分散在其中的方石英粉末的可固化有机硅树脂制成。

46. 发明授权

US08319242B2 Light-emitting semiconductor device, mounted substrate, and fabrication method thereof 有权
标题翻译：发光半导体装置，安装基板及其制造方法
公开(公告)号：US08319242B2
公开(公告)日：2012-11-27
申请号：US13179200
申请日：2011-07-08
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/8592 , H01L2933/0025 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.
摘要翻译：发光半导体器件包括具有引线电极的引线框架，布置有引线框架的反射器和容纳在反射器中的发光半导体芯片，并且具有通过倒装芯片接合方法连接到引线电极的电极，其中：引线框与发光半导体芯片之间的间隙填充有固化的底部填充材料，并且形成厚度为0.05至10μm的固化的氧化硅膜覆盖表面的发光半导体芯片和反射器。

47. 发明申请

US20110105713A1 ISOCYANURIC RING-CONTAINING POLYSILOXANE HAVING VINYL GROUPS AT THE TERMINALS 有权
标题翻译：在端子上具有乙烯基团的含异氰酸酯环的聚硅氧烷
公开(公告)号：US20110105713A1
公开(公告)日：2011-05-05
申请号：US12938639
申请日：2010-11-03
申请人： Hayato TANAKA , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hayato TANAKA , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08G77/20
CPC分类号： C08G77/26 , C07F7/0838 , C08G77/20 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.
摘要翻译：本发明的目的是提供一种可以提供可以利用氢化硅烷化（加成反应）的性质的固化产物的异氰脲酸环的有机聚硅氧烷，并且适合用于光学半导体的封装材料。因此，本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式（1）表示的有机聚硅氧烷：其中，X彼此独立地为1价有机基，不具有不饱和键，R 1和R 2彼此独立地为甲基或苯基，P为1〜30的整数。

48. 发明授权

US07807736B2 Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device 有权
标题翻译：用硅树脂组合物封装的半导体器件，以及用于封装半导体器件的硅树脂片剂
公开(公告)号：US07807736B2
公开(公告)日：2010-10-05
申请号：US11778980
申请日：2007-07-17
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08K5/3477 , C08G77/00
CPC分类号： H01L31/0203 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/70 , C08L83/04 , H01L24/97 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/12043 , H01L2924/15787 , H01L2924/181 , C08L83/00 , H01L2924/00
摘要： A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.
摘要翻译：提供了不是发光半导体器件的半导体器件。该装置用室温下为固体且成型温度为液体的有机硅树脂组合物包封，并固化成具有根据JIS K 6253的D型硬度计测得的硬度至少为30的透明制品，并且其伸长率拉伸试验至少5％。

49. 发明申请

US20100197870A1 LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS 有权
标题翻译：透镜成型硅树脂组合物和硅胶透镜
公开(公告)号：US20100197870A1
公开(公告)日：2010-08-05
申请号：US12759293
申请日：2010-04-13
申请人： Tsutomu Kashiwagi , Toshio Shiobara , Katsuyuki Imazawa
发明人： Tsutomu Kashiwagi , Toshio Shiobara , Katsuyuki Imazawa
IPC分类号： C08G77/14
CPC分类号： G02B1/041 , C08G77/12 , C08G77/20 , C08L83/04 , C08L83/00
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要翻译：硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键并且在25℃下具有100-1,000,000mPa·s粘度的有机聚硅氧烷，（B）具有至少三个与硅键合的氢原子的有机氢聚硅氧烷（SiH基）），（C）铂族金属碱催化剂固化成无色透明部分，这是有用的透镜。

50. 发明申请

US20090121180A1 SILOXANE-GRAFTED SILICA, TRANSPARENT SILICONE COMPOSITION, AND OPTOELECTRONIC DEVICE ENCAPSULATED THEREWITH 有权
标题翻译：硅氧烷二氧化硅，透明硅酮组合物及其中的光电器件
公开(公告)号：US20090121180A1
公开(公告)日：2009-05-14
申请号：US12270720
申请日：2008-11-13
申请人： Norio TSUBOKAWA , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Norio TSUBOKAWA , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C09K11/02 , C07F7/18 , C08F4/26 , C08F230/08
CPC分类号： C09C1/3081 , B82Y30/00 , C01B33/149 , C01B33/18 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C01P2006/32 , C01P2006/60 , H01L23/295 , H01L23/296 , H01L2924/0002 , H01L2924/12044 , H05B33/04 , H01L2924/00
摘要： Silica particles having 4-30% of an organopolysiloxane grafted to surfaces thereof are provided. A silicone composition loaded with such silica particles has high transparency, minimized permeability to corrosive gases, and improved encapsulation ability.
摘要翻译：提供了具有4-30％接枝到其表面的有机聚硅氧烷的二氧化硅颗粒。装有这种二氧化硅颗粒的硅氧烷组合物具有高透明度，最小化对腐蚀性气体的渗透性和改进的包封能力。

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