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    • 41. 发明申请
    • MODULAR IMPLANTABLE MEDICAL DEVICE
    • 模块化植入式医疗设备
    • WO2004052456B1
    • 2004-08-26
    • PCT/US0338939
    • 2003-12-09
    • MEDTRONIC INC
    • WAHLSTRAND CARL DSINGHAL RUCHIKASKIME ROBERT M
    • A61N1/36A61N1/375
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • An implantable medical device (10, 80, 90, 120, 130, 140, 150, 170, 180) includes a plurality of separately housed and flexibly interconnected modules (30, 32, 34, 172, 182). A first module (30) includes a control electronics within a first housing (36), and may be coupled to a second module (32) that includes a second housing (38) by a flexible interconnect member (44, 46, 174, 184). In some embodiments, an overmold (48, 82, 92, 122, 132, 176, 186), which may be flexible, at least partially encapsulates the first and second housings. The second module may be a power source module that includes a power source, such as a rechargeable battery, within the second housing. The implantable medical device may also include a third module, such as a recharge module that includes a coil within a third housing. The overmold may at lest partially encapsulate the third housing, or the third module may be tethered to the overmold by a flexible tether member (124). A flexible interconnect member and/or flexible overmold may allow multiples degrees of freedom of movement between modules of an implantable medical device.
    • 可植入医疗装置(10,80,90,120,130,140,​​150,170,180)包括多个单独容纳且柔性互连的模块(30,32,34,172,182)。 第一模块(30)包括位于第一壳体(36)内的控制电子器件,并且可以通过柔性互连构件(44,46,174,184)耦合到包括第二壳体(38)的第二模块(32) )。 在一些实施例中,可以是柔性的包覆模制件(48,82,92,122,132,176,186)至少部分地包封第一壳体和第二壳体。 第二模块可以是在第二壳体内包括诸如可再充电电池的电源的电源模块。 可植入医疗装置还可以包括第三模块,例如包括第三外壳内的线圈的再充电模块。 包胶模可以部分地包封第三壳体,或者第三模块可以通过柔性系绳构件(124)系连到包覆模制件。 柔性互连件和/或柔性包覆模制件可允许可植入医疗设备的模块之间的多个运动自由度。
    • 42. 发明申请
    • IMPLANTABLE MEDICAL DEVICE WITH A NONHERMETIC BATTERY
    • 具有非手术电池的可植入医疗装置
    • WO2004103463B1
    • 2005-04-07
    • PCT/US2004014804
    • 2004-05-12
    • MEDTRONIC INC
    • SCOTT ERIK RWAHLSTRAND CARL DSKIME ROBERT MSCHMIDT CRAIG L
    • A61N1/05A61N1/34A61N1/36A61N1/372A61N1/375
    • A61N1/375A61N1/378
    • An implantable medical device (IMD) including a nonhermetic battery is described. The IMD includes components and a power source module that includes the nonhermetic battery. The IMD also includes a barrier to substantially impede movement of substances from the nonhermetic battery to the components. The barrier may include a hermetic feedthrough, a gel, a polymer, or a solid electrolyte within the nonhermetic battery, and a seal member. The barrier may also be a material that encapsulates the nonhermetic battery and a getter within the IMD. In some embodiments, the IMD comprises a modular IMD including an interconnect member. In that case, the barrier may include a material that fills at least a portion of a void defined by the interconnect member. A length and a cross-sectional area of the interconnect member may also act as a barrier.
    • 描述了包括非密封电池的可植入医疗装置(IMD)。 IMD包括组件和包含非密封电池的电源模块。 IMD还包括阻止物质从非密封电池移动到部件的屏障。 阻挡层可以包括非密封电池内的密封馈通,凝胶,聚合物或固体电解质,以及密封构件。 屏障还可以是在IMD内封装非密封电池和吸气剂的材料。 在一些实施例中,IMD包括包括互连构件的模块化IMD。 在这种情况下,阻挡层可以包括填充由互连构件限定的空隙的至少一部分的材料。 互连构件的长度和横截面积也可以用作屏障。
    • 44. 发明申请
    • LOW-PROFILE IMPLANTABLE MEDICAL DEVICE
    • 低剖面植入式医疗器械
    • WO2004052453B1
    • 2004-09-02
    • PCT/US0338927
    • 2003-12-09
    • MEDTRONIC INC
    • JANZIG DARREN AWAHLSTRAND CARL DOLSON PAULETTE CSKIME ROBERT M
    • A61N1/36A61N1/375
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • Components (114, 116) of an implantable medical device (10) are arranged to facilitate a low-profile housing (36). A circuit board (80) within the housing carries integrated circuits (114) and discrete components (116). The integrated circuits and discrete components are located on first and second opposing surfaces (110, 112) of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil (82) that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board. The housing may comprise a feed through oriented at an angle relative to a major surface of the housing.
    • 植入式医疗装置(10)的部件(114,116)被布置成便于小型外壳(36)。 壳体内的电路板(80)承载集成电路(114)和离散部件(116)。 集成电路和分立组件分别位于电路板的第一和第二相对表面(110,112)上。 在一些实施例中,将可植入医疗装置植入患者的颅骨上,并且所述外壳是凹形的,使得其基本上符合颅骨。 在这样的实施例中,集成电路和/或分立组件可以根据高度布置在电路板上,以更好地符合壳体的凹面。 在一些实施例中,可植入医疗装置包括位于壳体内的遥测线圈(82),使其占据不能被电路板实际占据的空间。 壳体可以包括相对于壳体的主表面以一定角度取向的进料。
    • 45. 发明申请
    • CONCAVITY OF AN IMPLANTABLE MEDICAL DEVICE
    • 可植入医疗设备的可携带性
    • WO2004052459B1
    • 2004-08-19
    • PCT/US0338982
    • 2003-12-09
    • MEDTRONIC INC
    • WAHLSTRAND CARL DJANZIG DARREN ASINGHAL RUCHIKASKIME ROBERT MSCOTT ERIK RRANDALL JAMES E
    • A61N1/36A61N1/375
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • At least one surface (120,126) of an implantable medical device (10,90,100) is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. The implantable medical device comprises a plurality of interconnected modules (30,32,34), and an overmold (48,92,102) that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing (36,38,40), and at least one surface of at least one of the housings may be concave along at least one axis.
    • 植入式医疗装置(10,90,100)的至少一个表面(120,126)沿着至少一个轴线是凹入的,使得当植入该表面上时,它基本上符合患者体内的表面,例如颅骨。 在一些实施例中,可植入医疗装置的表面基本上符合具有在4.5和9.5厘米之间的半径的弧,并且优选地近似等于7厘米。 可植入医疗装置包括多个互连模块(30,32,34)以及至少部分地封装每个模块的包覆模制件(48,92,102)。 在这样的实施例中,包覆模的至少一个表面沿着至少一个轴线凹入。 此外,这样的可植入医疗装置的每个模块可以包括壳体(36,38,40),并且至少一个壳体的至少一个表面可以沿着至少一个轴线凹入。