会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 43. 发明授权
    • Chip-antenna
    • 芯片天线
    • US6028568A
    • 2000-02-22
    • US208223
    • 1998-12-09
    • Kenji AsakuraToshifumi OidaHarufumi Mandai
    • Kenji AsakuraToshifumi OidaHarufumi Mandai
    • H01Q1/36H01Q1/38H01Q1/40H01Q7/00H01Q9/30H01Q9/36H01Q9/42H01Q1/24
    • H01Q1/38H01Q1/362
    • The invention provides a chip-antenna, comprising: a base member including a mounting surface and made of at least one of dielectric ceramic and magnetic ceramic; at least two conductors disposed within said base member or on a surface of said base member, at least a portion of said conductors being substantially perpendicular to the mounting surface of said base member; a feeding electrode for applying a voltage to said conductors and disposed on the surface of said base member; a ground electrode disposed at least one on the surface of and within said base member; one of said conductors being served as a first conductor, one end of which is connected to said feeding electrode; the rest of said conductor being served as a second conductor, one end of which are connected to said ground electrode; and the other end of said first conductor and the other end of said second conductor being connected.
    • 本发明提供了一种芯片天线,包括:基座构件,包括安装表面,由介电陶瓷和磁性陶瓷中的至少一种制成; 至少两个导体,其设置在所述基座构件内或所述基座构件的表面上,所述导体的至少一部分基本上垂直于所述基座构件的安装表面; 用于向所述导体施加电压并设置在所述基底构件的表面上的馈电电极; 接地电极,其设置在所述基底构件的表面上和内部的至少一个上; 所述导体中的一个被用作第一导体,其一端连接到所述馈电电极; 所述导体的其余部分被用作第二导体,其一端连接到所述接地电极; 并且所述第一导体的另一端和所述第二导体的另一端连接。
    • 44. 发明授权
    • Complex electronic component
    • 复杂的电子元件
    • US06252778B1
    • 2001-06-26
    • US09177026
    • 1998-10-22
    • Ken TonegawaHarufumi MandaiTomoya Bando
    • Ken TonegawaHarufumi MandaiTomoya Bando
    • H05K103
    • H03H9/1071H01L2224/48091H03H9/0552H03H9/0557H01L2924/00014
    • The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.
    • 本发明提供一种复杂的电子部件,包括: 通过层叠多个电介质层而形成的多层基板; 至少在所述多层基板的底面设置有第一凹部, 过滤器,包括设置在所述多层基板内的至少一个第一无源元件; 设置在所述底面的平坦部分和所述多层基板的侧面中的至少一个上的外部端子; 安装在所述多层基板的上表面上的有源元件或第二无源元件中的任一个,安装在所述多层基板的所述第一凹部内的表面声波元件; 以及设置在所述多层基板的所述第一凹部的开口处的盖,以便覆盖所述开口的所述第一凹部。上述复杂电子部件的尺寸是紧凑的。
    • 50. 发明授权
    • RC array
    • RC阵列
    • US5495387A
    • 1996-02-27
    • US271263
    • 1994-07-06
    • Harufumi MandaiYoshikazu ChigodoKazuhiro Iida
    • Harufumi MandaiYoshikazu ChigodoKazuhiro Iida
    • H01G4/38H03H1/02H01G2/20H01G4/228H03H7/00
    • H01G4/38H03H1/02H03H2001/0085
    • A plurality of capacitor elements defined by first and second capacitor electrodes are formed in the interior of a laminated ceramic block, while a plurality of first terminal electrodes to be electrically connected to the first capacitor electrodes and a ground terminal electrode to be connected to the second capacitor electrodes in common are formed on one side surface of the block. A plurality of resistor films are formed on a major surface of the block, to be connected to the first terminal electrodes. A plurality of second terminal electrodes are formed on another side surface of the block, to be electrically connected to the resistor films. Another ground terminal electrode is formed on this side surface, to be connected to the second capacitor electrodes in common. Thus, an RC array being applicable to a high frequency filter array is integrated and miniaturized to cope with high density packaging, as well as to enable surface mounting.
    • 在层叠陶瓷块的内部形成由第一和第二电容器电极限定的多个电容器元件,而与第一电容器电极电连接的多个第一端子电极和与第二电容器电极连接的接地端子电极 电容器电极共同形成在块的一个侧表面上。 在块的主表面上形成多个电阻膜,以连接到第一端子电极。 多个第二端子电极形成在块的另一个侧表面上,以电连接到电阻膜。 另一接地端子电极形成在该侧表面上,以共同连接到第二电容器电极。 因此,适用于高频滤波器阵列的RC阵列被集成并小型化以应对高密度封装以及实现表面安装。