会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 41. 发明申请
    • SPUTTERING TARGET-BACKING PLATE ASSEMBLY
    • 喷射目标板组件
    • US20120318669A1
    • 2012-12-20
    • US13579606
    • 2011-02-16
    • Yuki IkedaYuichiro NakamuraAtsutoshi Arakawa
    • Yuki IkedaYuichiro NakamuraAtsutoshi Arakawa
    • C23C14/06B05D5/12B32B15/04C23C14/08
    • C04B35/645B22F3/14B22F7/08C04B37/026C04B2237/123C04B2237/126C04B2237/34C04B2237/405C22C1/0433C22C1/051C22C19/07C22C38/002C23C14/3414H01F41/183
    • Provided is a sputtering target-backing plate assembly where a raw material powder prepared so as to have the composition of a magnetic material sputtering target is filled in a die together with a backing plate and hot-pressed, thereby being bonded to the backing plate simultaneously with sintering of the magnetic material target powder.It is an object of the present invention to provide a sputtering target-backing plate assembly having a high average pass through flux and allowing more stable sputtering, by disposing the raw material powder for a target on the backing plate and sintering them.By simultaneously performing sintering and bonding, a sputtering target-backing plate assembly has a shorter manufacturing process, can shorten manufacturing period, and does not cause a problem of detachment due to an increase in temperature during sputtering. In addition, it is also an object of the present invention to provide a sputtering target-backing plate assembly at a reduced cost and with an improved average pass through flux (PTF).
    • 提供了一种溅射靶 - 背板组件,其中将具有磁性材料溅射靶的组成的原料粉末与背板一起填充在模具中并进行热压,从而同时粘合到背板上 通过烧结磁性材料目标粉末。 本发明的目的是提供一种具有高平均通过焊剂的溅射靶 - 背板组件,通过将用于靶材的原料粉末设置在背板上并进行烧结来提供更稳定的溅射。 通过同时进行烧结和接合,溅射靶 - 背板组件具有较短的制造工艺,可以缩短制造周期,并且不会由于溅射期间的温度升高而引起分离的问题。 此外,本发明的另一个目的是以降低的成本提供溅射靶 - 背板组件,并且具有改进的平均通过焊剂(PTF)。
    • 43. 发明授权
    • Fe—Pt-based ferromagnetic material sputtering target
    • Fe-Pt系铁磁材料溅射靶
    • US09328412B2
    • 2016-05-03
    • US13816043
    • 2011-08-05
    • Shin-ichi OginoYuichiro Nakamura
    • Shin-ichi OginoYuichiro Nakamura
    • C23C14/34G11B5/851H01F41/18H01J37/34H01F1/06C23C14/14
    • C23C14/3414C23C14/14G11B5/851H01F1/068H01F41/183H01J37/3405H01J37/3426H01J37/3429
    • An Fe—Pt-based ferromagnetic material sputtering target comprising a metal and a metal oxide, wherein the metal has a composition in which Pt is contained in an amount of 5 mol % or more and 60 mol % or less and the remainder is Fe. An object of the present invention is to provide a ferromagnetic material sputtering target, which enables to form a magnetic recording layer composed of a magnetic phase such as an Fe—Pt alloy, and a non-magnetic phase to isolate the magnetic phase, and in which a metal oxide is used as one of the materials for the non-magnetic phase. Provided is a ferromagnetic material sputtering target wherein an inadvertent release of the metal oxide during sputtering and particle generation due to abnormal electrical discharge starting at a void inherently included in the target are suppressed, the adherence between the metal oxide and the matrix alloy is enhanced, and its density is increased.
    • 包含金属和金属氧化物的Fe-Pt系铁磁材料溅射靶,其中,所述金属的含量为5摩尔%以上且60摩尔%以下且余量为Fe的组成。 本发明的目的是提供一种铁磁材料溅射靶,其能够形成由诸如Fe-Pt合金的磁相和非磁性相组成的磁记录层以隔离磁相,并且在 其中使用金属氧化物作为非磁性相的材料之一。 本发明提供一种强磁性材料溅射靶,其特征在于,抑制溅射时的金属氧化物的无意的释放以及由于靶内固有地形成的空穴而产生的异常放电而产生的粒子,从而提高了金属氧化物与基体合金之间的粘附性, 其密度增加。
    • 50. 发明申请
    • Inorganic-Particle-Dispersed Sputtering Target
    • 无机粒子分散溅射靶
    • US20110284373A1
    • 2011-11-24
    • US13147782
    • 2010-07-27
    • Atsushi SatoYuichiro Nakamura
    • Atsushi SatoYuichiro Nakamura
    • C23C14/35
    • G11B5/851C23C14/3414
    • Provided is an inorganic-particle-dispersed sputtering target in which inorganic particles are dispersed in a Co base material, wherein the inorganic particles have an electric resistivity of 1×101 Ω·m or less and the volume ratio of the inorganic particles in the target is 50% or less. The sputtering target thus adjusted is advantageous in that, when sputtering is performed using a magnetron sputtering device comprising a DC power source, the inorganic particles are less charged, and arcing occurs less frequently. Accordingly, by using the sputtering target of the present invention, the occurrence of particles attributable to the arcing reduces, and a significant effect of improving the yield in forming a thin film is obtained.
    • 本发明提供一种无机粒子分散溅射靶,其中无机颗粒分散在Co基材料中,其中无机颗粒的电阻率为1×10 11Ω·m·m·m以下,无机颗粒的体积比 目标是50%以下。 如此调整的溅射靶的优点在于,当使用包括直流电源的磁控管溅射装置进行溅射时,无机颗粒的带电少,并且电弧放电频率较低。 因此,通过使用本发明的溅射靶,可以减少由于电弧引起的粒子的发生,并且获得提高薄膜形成的显着效果。