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41. 发明授权

US06818169B2 Molding device and molding method 失效
标题翻译：成型装置及成型方法
公开(公告)号：US06818169B2
公开(公告)日：2004-11-16
申请号：US10405875
申请日：2003-04-02
申请人： Kazuhiro Umemoto
发明人： Kazuhiro Umemoto
IPC分类号： B29C4514
CPC分类号： B29C45/14655 , B29C45/0046 , B29C45/2708 , B29C2045/2709 , H01L2224/48091 , H01L2924/00014
摘要： A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.
摘要翻译：一种模制装置和方法利用包括快速和第二部分的空腔来模制具有一个或多个凸起部分的制品和用于将模制树脂注入到模腔中的浇口。栅极又包括一个或多个用于将树脂注入到一个部分的凹部中的栅极侧和用于将树脂注入到其中没有凹部的部分中的第二部分的栅极基底，两个树脂注入同时发生并且基本上封装半导体元件以形成具有凸透镜的模制品。

42. 发明授权

US08590293B2 Exhaust emission purifier of internal combustion engine 有权
标题翻译：内燃机排气净化器
公开(公告)号：US08590293B2
公开(公告)日：2013-11-26
申请号：US13395316
申请日：2009-10-21
申请人： Hiromasa Nishioka , Yoshihisa Tsukamoto , Kazuhiro Umemoto , Junichi Matsuo
发明人： Hiromasa Nishioka , Yoshihisa Tsukamoto , Kazuhiro Umemoto , Junichi Matsuo
IPC分类号： F01N3/00 , F01N3/10
CPC分类号： F01N3/0821 , F01N3/0253 , F01N3/031 , F01N3/0842 , F01N3/0885 , F01N2900/1612 , F02D41/0275 , F02D41/028
摘要： The exhaust purification system of an internal combustion engine of the present invention is provided with an NOX storage reduction catalyst and a particulate filter which is arranged at the upstream side of the NOX storage reduction catalyst. When causing the NOX storage reduction catalyst to release the stored NOX, the particulate filter is raised to the temperature at which the particulate matter is oxidized, the flow rate of the exhaust gas which flows into the particulate filter is made to decrease, the air-fuel ratio of the exhaust gas which flows into the particulate filter is made rich, and the particulate matter which builds up on the particulate filter is made to oxidize to produce carbon monoxide.
摘要翻译：本发明的内燃机的排气净化系统设置有NO x储存还原催化剂和颗粒过滤器，其设置在NO x储存还原催化剂的上游侧。当使NO x储存还原催化剂释放储存的NO x时，颗粒过滤器升高到颗粒物质被氧化的温度，使流入微粒过滤器的废气的流量减小，流入颗粒过滤器的排气的燃料比变浓，并且使颗粒过滤器上积聚的颗粒物质氧化生成一氧化碳。

43. 发明申请

US20120198824A1 EXHAUST PURIFICATION SYSTEM OF INTERNAL COMBUSTION ENGINE 有权
标题翻译：内燃机排气净化系统
公开(公告)号：US20120198824A1
公开(公告)日：2012-08-09
申请号：US13395316
申请日：2009-10-21
申请人： Hiromasa Nishioka , Yoshihisa Tsukamoto , Kazuhiro Umemoto , Junichi Matsuo
发明人： Hiromasa Nishioka , Yoshihisa Tsukamoto , Kazuhiro Umemoto , Junichi Matsuo
IPC分类号： F01N3/035
CPC分类号： F01N3/0821 , F01N3/0253 , F01N3/031 , F01N3/0842 , F01N3/0885 , F01N2900/1612 , F02D41/0275 , F02D41/028
摘要： The exhaust purification system of an internal combustion engine of the present invention is provided with an NOX storage reduction catalyst and a particulate filter which is arranged at the upstream side of the NOX storage reduction catalyst. When causing the NOX storage reduction catalyst to release the stored NOX, the particulate filter is raised to the temperature at which the particulate matter is oxidized, the flow rate of the exhaust gas which flows into the particulate filter is made to decrease, the air-fuel ratio of the exhaust gas which flows into the particulate filter is made rich, and the particulate matter which builds up on the particulate filter is made to oxidize to produce carbon monoxide.
摘要翻译：本发明的内燃机的排气净化系统设置有NO x储存还原催化剂和颗粒过滤器，其设置在NO x储存还原催化剂的上游侧。当使NO x储存还原催化剂释放储存的NO x时，颗粒过滤器升高到颗粒物质被氧化的温度，使流入微粒过滤器的废气的流量减小，流入颗粒过滤器的排气的燃料比变浓，并且使颗粒过滤器上积聚的颗粒物质氧化生成一氧化碳。

44. 发明申请

US20100302183A1 SEMICONDUCTOR DEVICE FOR DETERMINING WHETHER TOUCH ELECTRODE IS TOUCHED BY HUMAN BODY, AND TOUCH SENSOR USING THE SEMICONDUCTOR DEVICE 有权
标题翻译：用于确定触摸电极由人体触摸的半导体器件和使用半导体器件的触摸传感器
公开(公告)号：US20100302183A1
公开(公告)日：2010-12-02
申请号：US12731853
申请日：2010-03-25
申请人： Teruyuki KOGO , Kazuhiro Umemoto
发明人： Teruyuki KOGO , Kazuhiro Umemoto
IPC分类号： G06F3/041
CPC分类号： H03K17/962 , H03K2217/960705 , H03K2217/960725
摘要： A touch sensor IC includes a switch for connecting, to an external terminal with its voltage to be sensed, a selected one of a plurality of external terminals to which a plurality of touch electrodes is connected. Only one set of two capacitors and a resistor element may therefore be provided for a plurality of touch electrodes. Thus, the number of required components is smaller as compared with a conventional sensor requiring two capacitors and a resistor element for each touch electrode.
摘要翻译：触摸传感器IC包括用于将与要感测的电压相连接的外部端子与多个触摸电极连接的多个外部端子中的选定的一个连接的开关。因此，可以为多个触摸电极提供一组两个电容器和电阻元件。因此，与需要两个电容器的传统传感器和每个触摸电极的电阻器元件相比，所需部件的数量更小。

45. 发明申请

US20050087364A1 MULTILAYER WIRING BOARD 失效
标题翻译：多层接线板
公开(公告)号：US20050087364A1
公开(公告)日：2005-04-28
申请号：US10711638
申请日：2004-09-29
申请人： Kazuhiro Umemoto
发明人： Kazuhiro Umemoto
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12 , H01L23/498 , H05K1/11 , H05K3/46 , H05K1/18 , H01L23/488
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H05K3/3436 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10674 , Y02P70/611
摘要： To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed. Consequently, the multilayer wiring board of the present invention can prevent occurrence of cracks in the board at portions adjacent to the electrode pads near the outer periphery of the semiconductor chip due to a difference in thermal expansion coefficient between the semiconductor chip and the board.
摘要翻译：为了防止由于半导体芯片与板之间的热膨胀系数的差异，在半导体芯片被倒装芯片接合的多层布线板中，与电极焊盘相邻的部分在板上产生裂纹。本发明的多层布线基板（20）的特征在于，与位于半导体芯片的外周（29）附近的半导体芯片（25）的电极对应的电极焊盘（22）具有长方形形状，开口（35 阻焊剂（23）的长度方向的距离小于长方形，开口的中心（B）位于从长方形的中心（A）偏离距离（L 4）的方向（30）朝向半导体芯片的中心。因此，在本发明的多层布线基板中，对半导体芯片的外周附近的电路板（22）的部分（L 3）施加的热应力被放宽。因此，本发明的多层布线基板由于半导体芯片和基板之间的热膨胀系数的差异，能够防止在半导体芯片的外周附近的与电极焊盘相邻的部分处发生裂纹。

46. 发明授权

US08443592B2 Exhaust purification system of internal combustion engine 有权
标题翻译：内燃机排气净化系统
公开(公告)号：US08443592B2
公开(公告)日：2013-05-21
申请号：US13265713
申请日：2009-05-18
申请人： Takamitsu Asanuma , Hiromasa Nishioka , Daichi Imai , Yuka Nakata , Kazuhiro Umemoto
发明人： Takamitsu Asanuma , Hiromasa Nishioka , Daichi Imai , Yuka Nakata , Kazuhiro Umemoto
IPC分类号： F01N3/10
CPC分类号： F01N3/0814 , F01M1/10 , F01M2001/1028 , F01N3/0842 , F01N3/085 , F01N3/0871 , F01N2900/1612 , F02M37/0047 , F16N2250/00
摘要： An exhaust purification system is provided with an NOx storage reduction catalyst arranged in an exhaust passage and an SOx trap material arranged upstream of the NOx storage reduction catalyst and removes SOx contained in exhaust gas. A main flow path has a secondary flow path connected to it. In the secondary flow path, a removal device is arranged for removing the sulfur constituent contained in fuel. The secondary flow path includes an opening and closing device. When the SOx removal rate of the SOx trap material becomes a predetermined removal rate judgment value or less or the concentration of the SOx which flows into the SOx trap material becomes a predetermined concentration judgment value or more, at least part of the fuel flowing through a main flow path is made to flow into the secondary flow path and run through the removal device.
摘要翻译：排气净化系统设置有布置在排气通道中的NOx储存还原催化剂和设置在NOx存储还原催化剂上游的SOx捕集材料，并且除去废气中所含的SO x。主流路连接有二次流路。在二次流路中，设置有去除装在燃料中的硫成分的去除装置。二次流路包括打开和关闭装置。当SOx捕集材料的SO x去除率变为预定的去除率判定值或更小或者流入SOx捕集材料的SO x的浓度变为预定浓度判定值或更高时，流经一氧化碳使主流路流入二次流路并穿过去除装置。

47. 发明申请

US20120073273A1 EXHAUST PURIFICATION SYSTEM OF INTERNAL COMBUSTION ENGINE 有权
标题翻译：内燃机排气净化系统
公开(公告)号：US20120073273A1
公开(公告)日：2012-03-29
申请号：US13318973
申请日：2009-06-16
申请人： Takamitsu Asanuma , Kazuhiro Umemoto
发明人： Takamitsu Asanuma , Kazuhiro Umemoto
IPC分类号： F01N3/10
CPC分类号： F01N3/2066 , F01N3/035 , F01N3/0814 , F01N3/0821 , F01N3/106 , F01N13/009 , F01N13/0097 , F01N2570/14 , F01N2570/145 , F01N2570/18 , F01N2610/02 , Y02C20/10 , Y02T10/24
摘要： An exhaust purification system of an internal combustion engine including an ammonia oxidation catalyst device and an ammonia holding device arranged immediately upstream of the ammonia oxidation catalyst device is provided. The ammonia holding device has a solid acid, holds ammonia to restrain the ammonia from flowing into the ammonia oxidation catalyst device when a temperature of the ammonia oxidation catalyst device is within a N2O producing temperature range, and releases the held ammonia to make the ammonia flow into the ammonia oxidation catalyst device when the temperature of the ammonia oxidation catalyst device is out of the N2O producing temperature range.
摘要翻译：提供了一种内燃机的排气净化系统，该排气净化系统包括氨氧化催化剂装置和布置在氨氧化催化装置的上游的氨保持装置。当氨氧化催化剂装置的温度在N 2 O生成温度范围内时，氨保持装置具有固体酸，保持氨以约束氨流入氨氧化催化剂装置，并释放保持的氨以使氨流动当氨氧化催化剂装置的温度超出N2O产生温度范围时，进入氨氧化催化装置。

48. 发明申请

US20120055143A1 EXHAUST PURIFICATION SYSTEM OF INTERNAL COMBUSTION ENGINE 有权
标题翻译：内燃机排气净化系统
公开(公告)号：US20120055143A1
公开(公告)日：2012-03-08
申请号：US13265713
申请日：2009-05-18
申请人： Takamitsu Asanuma , Hiromasa Nishioka , Daichi Imai , Yuka Nakata , Kazuhiro Umemoto
发明人： Takamitsu Asanuma , Hiromasa Nishioka , Daichi Imai , Yuka Nakata , Kazuhiro Umemoto
IPC分类号： F01N3/10
CPC分类号： F01N3/0814 , F01M1/10 , F01M2001/1028 , F01N3/0842 , F01N3/085 , F01N3/0871 , F01N2900/1612 , F02M37/0047 , F16N2250/00
摘要： An exhaust purification system is provided with an NOx storage reduction catalyst arranged in an exhaust passage and an SOx trap material arranged upstream of the NOx storage reduction catalyst and removes SOx contained in exhaust gas. A main flow path has a secondary flow path connected to it. In the secondary flow path, a removal device is arranged for removing the sulfur constituent contained in fuel. The secondary flow path includes an opening and closing device. When the SOx removal rate of the SOx trap material becomes a predetermined removal rate judgment value or less or the concentration of the SOx which flows into the SOx trap material becomes a predetermined concentration judgment value or more, at least part of the fuel flowing through a main flow path is made to flow into the secondary flow path and run through the removal device.
摘要翻译：排气净化系统设置有布置在排气通道中的NOx储存还原催化剂和设置在NOx存储还原催化剂上游的SOx捕集材料，并且除去废气中所含的SO x。主流路连接有二次流路。在二次流路中，设置有去除装在燃料中的硫成分的去除装置。二次流路包括打开和关闭装置。当SOx捕集材料的SO x去除率变为预定的去除率判定值或更小或者流入SOx捕集材料的SO x的浓度变为预定浓度判定值或更高时，流经一氧化碳使主流路流入二次流路并穿过去除装置。

49. 发明授权

US07078629B2 Multilayer wiring board 失效
标题翻译：多层接线板
公开(公告)号：US07078629B2
公开(公告)日：2006-07-18
申请号：US10711638
申请日：2004-09-29
申请人： Kazuhiro Umemoto
发明人： Kazuhiro Umemoto
IPC分类号： H05K1/16
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H05K3/3436 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10674 , Y02P70/611
摘要： To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed. Consequently, the multilayer wiring board of the present invention can prevent occurrence of cracks in the board at portions adjacent to the electrode pads near the outer periphery of the semiconductor chip due to a difference in thermal expansion coefficient between the semiconductor chip and the board.
摘要翻译：为了防止由于半导体芯片与板之间的热膨胀系数的差异，在半导体芯片被倒装芯片接合的多层布线板中，与电极焊盘相邻的部分在板上产生裂纹。本发明的多层布线基板（20）的特征在于，与位于半导体芯片的外周（29）附近的半导体芯片（25）的电极对应的电极焊盘（22）具有长方形形状，开口（35 阻焊剂（23）的长度方向的距离小于长方形，开口的中心（B）位于从长方形的中心（A）偏离距离（L 4）的方向（30）朝向半导体芯片的中心。因此，在本发明的多层布线基板中，对半导体芯片的外周附近的电路板（22）的部分（L 3）施加的热应力被放宽。因此，本发明的多层布线基板由于半导体芯片和基板之间的热膨胀系数的差异，能够防止在半导体芯片的外周附近的与电极焊盘相邻的部分处发生裂纹。

50. 发明授权

US06561782B1 Gate for molding device 失效
标题翻译：成型装置门
公开(公告)号：US06561782B1
公开(公告)日：2003-05-13
申请号：US09670647
申请日：2000-09-27
申请人： Kazuhiro Umemoto
发明人： Kazuhiro Umemoto
IPC分类号： B29C4518
CPC分类号： B29C45/14655 , B29C45/0046 , B29C45/2708 , B29C2045/2709 , H01L2224/48091 , H01L2924/00014
摘要： A molding device and method utilizes a cavity including first and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.
摘要翻译：成型装置和方法利用包括第一和第二部分的空腔来模制具有一个或多个凸起部分的制品和用于将模制树脂注入到该腔体中的浇口。栅极又包括一个或多个用于将树脂注入到一个部分的凹部中的栅极侧和用于将树脂注入到其中没有凹部的部分中的第二部分的栅极基底，两个树脂注入同时发生并且基本上封装半导体元件以形成具有凸透镜的模制品。

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