会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 42. 发明申请
    • MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
    • 多层印刷线路板,具有填充的结构
    • US20100101852A1
    • 2010-04-29
    • US12646517
    • 2009-12-23
    • Seiji ShiraiKenichi ShimadaMotoo Asai
    • Seiji ShiraiKenichi ShimadaMotoo Asai
    • H05K1/11
    • H05K3/4661H05K3/108H05K3/381H05K3/382H05K3/421H05K3/423H05K2201/0129H05K2201/015H05K2201/0278H05K2201/09563H05K2201/096H05K2201/09745Y10T428/24273Y10T428/24322Y10T428/24917Y10T428/31681
    • The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
    • 本发明提供了一种多层印刷线路板,其具有有利地用于在其上形成精细电路图案的填充通孔结构,并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成,层间绝缘树脂层各自形成有各自填充有镀层的孔,以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦,并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半,小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙,并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂,氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。
    • 50. 发明授权
    • Charging device, image forming structure, and image forming apparatus
    • 充电装置,图像形成结构和图像形成装置
    • US08849150B2
    • 2014-09-30
    • US13546792
    • 2012-07-11
    • Mikio YamaguchiTakuji MatsumotoKenichi ShimadaYasuhiro Warita
    • Mikio YamaguchiTakuji MatsumotoKenichi ShimadaYasuhiro Warita
    • G03G15/02
    • G03G15/0225G03G2221/1693
    • A charging device includes a charging member that includes a rotating shaft and charges a surface of a charging object while rotating in contact with the charging object, a cleaning member that includes a rotating shaft and removes unwanted matter from a surface of the charging member while rotating in contact with the charging member, and a bearing member that includes first and second receiving portions each having an open part on one side thereof and a substantially concave-shaped bottom on another side thereof. The first and second receiving portions receive circumferences of the rotating shafts of the charging member and the cleaning member, respectively, at the bottoms thereof. The open parts of the first receiving portion and the second receiving portion face respectively different directions. A part of an inner surface of the second receiving portion forms a part of an outer surface of the first receiving portion.
    • 充电装置包括充电构件,该充电构件包括旋转轴并在与充电对象接触的同时旋转时对充电对象的表面充电;清洁构件,其包括旋转轴,并且在旋转的同时从充电构件的表面去除不需要的物质 与所述充电构件接触的轴承构件,以及包括第一和第二接收部的轴承构件,所述第一和第二接收部分在其一侧上具有开口部分和在其另一侧上具有基本上凹形的底部。 第一和第二接收部分分别在其底部接收充电部件和清洁部件的旋转轴的周边。 第一接收部分和第二接收部分的开放部分面向不同的方向。 第二接收部分的内表面的一部分形成第一接收部分的外表面的一部分。