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    • 44. 发明授权
    • Flash memory array having well contact structures
    • 具有良好接触结构的闪存阵列
    • US5973374A
    • 1999-10-26
    • US938420
    • 1997-09-25
    • Steven W. Longcor
    • Steven W. Longcor
    • H01L21/8247H01L27/115H01L29/76H01L29/94H01L31/062H01L31/113
    • H01L27/115H01L27/11521
    • A common source flash memory array providing multiple well contact structures distributed within the array without the need for separate well tap regions connected to dedicated channel lines. The contact locations between Vss metal common source lines and source bus regions are used to provide additional contacts between Vss metal lines and p+ well taps, all of the source bus regions and the p+ well tap regions being encompassed within a double-well configuration. Depending on the specific embodiment of the present invention, the n+ diffused source bus regions and the nearby p+ well tap may: (a) be separately tied to the Vss metal common source line through separate contact metals (e.g., tungsten plugs); (b) be butted against each other and tied to a common Vss metal source line through separate contact metals; (c) be butted against each other and tied to a common Vss metal source line through a common contact metal (e.g., an enlarged plug) overlapping both the n+ diffused source bus regions and the p+ well tap; or (d) be tied to a common Vss metal source line through a common contact metal and a metal silicide layer.
    • 提供分布在阵列内的多个阱接触结构的公共源闪存阵列,而不需要连接到专用信道线的单独的阱抽头区域。 Vss金属公共源极线和源极总线区之间的接触位置用于在Vss金属线和p +阱分接头之间提供附加接触,所有源极总线区域和p +阱分接区域都包含在双阱配置中。 根据本发明的具体实施例,n +扩散源极总线区域和附近的p +阱分接头可以:(a)通过单独的接触金属(例如钨插塞)分开地连接到Vss金属公共源极线; (b)通过单独的接触金属对接并与普通Vss金属源线连接; (c)通过与n +扩散的源极总线区域和p +阱分接头重叠的公共接触金属(例如,扩大的插塞)彼此对接并连接到公共的Vss金属源极线; 或(d)通过公共接触金属和金属硅化物层与公共Vss金属源极线连接。