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41. 发明专利

JP2004246615A Electronic equipment, its enclosure and electronic module for the same 审中-公开
公开(公告)号：JP2004246615A
公开(公告)日：2004-09-02
申请号：JP2003035502
申请日：2003-02-13
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OHASHI SHIGEO , SUZUKI ATSUSHI , KONDO YOSHIHIRO , MATSUSHITA SHINJI , YAMADA YASUNORI , MINAMITANI RINTARO , OSANAWA TAKASHI , NAKAGAWA TAKESHI
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide an electronic module of a liquid cooling type for enabling simple and safe attachment and detachment of a board at the time of extension and maintenance of the board in electronic equipment, the electronic equipment and its enclosure. SOLUTION: The electronic equipment stores a wiring board (an electronic module) 2 mounted with a CPU and the like 5 which is as a heating element, a liquid driving means 16 of refrigerant, a heat exchanger 15 for performing heat exchange with the refrigerant and a fan 18 and the like for blowing cooling air to the heat exchanger in the enclosure 100. In this electronic equipment, the wiring board (the electronic module) 2 is integrally provided with a cooling jacket 12 for forming a passage of the refrigerant inside and the electronic equipment 1 has a common wiring board 11 and a header 17 for loading the wiring board (the electronic module) 2 and the cooling jacket 12 which are integrally formed in a simultaneously attachable/detachable manner or is equipped with the cooling jacket beforehand, and in the case of loading the electronic module, the electronic module is integrally loaded with the cooling jacket. COPYRIGHT: (C)2004,JPO&NCIPI

42. 发明专利

JP2004169986A Cooling device 审中-公开
公开(公告)号：JP2004169986A
公开(公告)日：2004-06-17
申请号：JP2002335930
申请日：2002-11-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： NEHO YASUSHI , MINAMITANI RINTARO , NAGATA TATSUYA , OSANAWA TAKASHI , SUZUKI ATSUSHI , HOTTA DAICHI , SAKAYORI KAZUSHI
IPC分类号： F25D17/02
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for an electronic apparatus with a heating element to be cooled by circulating cooling medium liquid in a flow path, having improved reliability and reduced thickness without lowering its airtightness during reopening for the maintenance of a sealing member for the cooling medium liquid.
SOLUTION: The cooling device comprises the sealing member for sealing the cooling medium liquid. The sealing member consists of a first sealing member formed of a soft material to be inserted into a sealing hole for the cooling medium liquid and a second sealing member formed of a hard material to be inserted into the first sealing member.
COPYRIGHT: (C)2004,JPO

43. 发明专利

JP2004036471A Micropump and minimum liquid transfer method 审中-公开
公开(公告)号：JP2004036471A
公开(公告)日：2004-02-05
申请号：JP2002194139
申请日：2002-07-03
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SUZUKI ATSUSHI
IPC分类号： B81B1/00 , F04B9/00 , F04B43/12 , F04F1/04
摘要： PROBLEM TO BE SOLVED: To provide a liquid driving mechanism, namely, a micropump producing an increase in a driving flow rate and having improved energy converting efficiency.
SOLUTION: AC power is input to thermoelectric elements 10 for alternately repeating heat absorption from surroundings and heat release to the surroundings on heat transmission faces to cause periodic boiling/condensation of an operating liquid 21 in a channel 23 to drive the liquid with a volume change of the liquid as a driving source. The micropump uses heater means for heating the minimum liquid to be carried, the heater means consisting of the plurality of thermoelectric elements each having two heat transmission faces, a heat absorbing face and a heat releasing face, an AC power supply for charging phase-different AC power into the thermoelectric elements and electric insulating layers provided on the heat absorbing faces and the heat releasing faces. It comprises the channel thermally connected to the heat absorbing faces and the heat releasing faces for carrying the minimum liquid therethrough and a heat release means provided in the channel.
COPYRIGHT: (C)2004,JPO

44. 发明专利

JP2002095268A POWER CONVERTER DEVICE 失效
公开(公告)号：JP2002095268A
公开(公告)日：2002-03-29
申请号：JP2000283004
申请日：2000-09-19
申请人： HITACHI LTD
发明人： SUZUKI ATSUSHI , SHIRAKAWA SHINJI , MISHIMA AKIRA , INNAMI TOSHIYUKI , FUJINO SHINICHI , MORI HIDEAKI , TAKAHASHI KENJI , MASUNO KEIICHI , ANAMI HIROYASU
IPC分类号： H02M1/00 , H02M7/00 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To obtain high reliability and high efficiency of power conversion with good workability of installation, by reducing circuit inductance and wiring resistance with a totally compact unit, in a power converter device comprising an inverter or the like. SOLUTION: A semiconductor chip 1 is electrically and thermally connected so as to be interposed between parts crossing a plurality of input bus bars 14p, 14n with a plurality of output bus bars 18. The semiconductor chip 1 is connected in the same polarizing direction as the polarity to the positive pole input bus bar 14p, connected in the same polarizing direction as the polarity to the negative pole input bus bar 14n, and connected to the output bus bar 18 in common so as to be adjacent to each other by the polarity in a different direction.

45. 发明专利

JP2001308246A POWER CONVERTER 失效
公开(公告)号：JP2001308246A
公开(公告)日：2001-11-02
申请号：JP2001016495
申请日：2001-01-25
申请人： HITACHI LTD
发明人： SUZUKI ATSUSHI , KUWABARA HEIKICHI , YASUKAWA AKIO , MOTOBE MITSUSACHI , YAMAMURA HIROHISA , OBARA SANSHIRO , SASAKI KANAME
IPC分类号： H05K7/20 , H01L23/473 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a power converter making water pouring possibility to an electric part including a semiconductor module zero by improving cooling performance by directly bringing cooling liquid into contact with a semiconductor module board. SOLUTION: A heat sink 1 has a cooling flow passage 2 and an opening part 5 provided to face a part of the flow passage, a first seal 9 exists on the outside of the opening part, a groove 6 exists on the outside of the first seal, liquid escape holes 7 communicating from the groove to the outside of the heat sink are discretely provided, a second seal 10 is provided on the outside of the groove 6, the upper part of the second seal or the outside of the second seal is attached by a tightening means and the radiation plate 104 of a semiconductor module is attached to the opening part 5.

46. 发明专利

JP2001103721A AC GENERATOR FOR VEHICLE 失效
公开(公告)号：JP2001103721A
公开(公告)日：2001-04-13
申请号：JP27815699
申请日：1999-09-30
申请人： HITACHI LTD
发明人： KANAZAWA HIROYUKI , TAWARA KAZUO , HONDA YOSHIAKI , TAKANO MASAMI , SUZUKI ATSUSHI , MATSUBARA KENICHIRO
IPC分类号： H02K21/02 , H02K1/12 , H02K1/22 , H02K19/22 , H02K21/04
摘要： PROBLEM TO BE SOLVED: To improve efficiency by reducing the copper loss in the stator coil, which is the largest loss in an AC generator of a vehicle by optimizing the balance of the ratio of the outer diameter of a rotor and that of a stator. SOLUTION: In the AC generator of a vehicle, a permanent magnet is arranged between the nail shaped magnetic poles of the AC generator for a vehicle with nail shaped magnetic pole structure, the ratio of the outer diameter of a rotor and that of a stator is set to less than 0.73, and the copper loss is drastically reduced in the stator coil.

47. 发明专利

JPH11340393A POWER-CONVERTING DEVICE 失效
公开(公告)号：JPH11340393A
公开(公告)日：1999-12-10
申请号：JP14539398
申请日：1998-05-27
申请人： HITACHI LTD
发明人： SUZUKI ATSUSHI , SASAKI KANAME , KUWABARA HEIKICHI
IPC分类号： H01L23/473 , H02M7/04 , H02M7/12 , H02M7/42
摘要： PROBLEM TO BE SOLVED: To improve radiation performance to reduce the size, and to improve the reliability of a semiconductor mounting structure in a power-converting device. SOLUTION: In semiconductor module 101, a semiconductor switching element 1 and a diode 2 are soldered to a heat reception member 6 that is made of copper as a material with solder 4 and 5 through an insulating substrate 3. The heat reception member 6 is composed of a base thickness part and a fin 7, and nickel plating or tin plating is preferably performed at least at a side for mounting the element. On each of six insulating substrates 3, a main circuit part corresponding to the upper or lower arm of two phases out of three ones is mounted. In this embodiment, two semiconductor switching elements and two diodes are mounted onto one insulating substrate 3. Six insulating substrates with such a configuration are mounted to one heat reception member 6, and a three-phase inverter main circuit is constituted to reduce the size. On the lower surface of the heat reception member 6, the fin 7 is formed in a direction vertical to the element-mounting surface.

48. 发明专利

JPH11251499A POWER-CONVERSION DEVICE 失效
公开(公告)号：JPH11251499A
公开(公告)日：1999-09-17
申请号：JP5471498
申请日：1998-03-06
申请人： HITACHI LTD
发明人： SUZUKI ATSUSHI , KUWABARA HEIKICHI , MIZUGUCHI NOBUAKI , TAKASAKI TOSHIO , KONDO HISASHI , HARA YASUHIRO
IPC分类号： H01L23/427 , F28D15/02 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To improve cooling performance and hence miniaturize a power unit, facilitate the maintenance inspection operation of semiconductor elements, improve reliability, as well as miniaturize an overall device. SOLUTION: A plurality of semiconductor element 5, 6, and 7 are mounted to one side of a heat receiving member 3, a plurality of heat pipes 1 are mounted to the other side of the heat receiving member 3, the heat pipe 1 is provided with a heat receiving part 1a that is thermally connected to the heat reception member 3 and is extended and a cooling part 1b that is started from the heat reception part 1a. A cooling part 1b of the heat pipe 1 is arranged in a zigzag manner in a different direction and is provided at the inside of the end part of the heat receiving member 3, and a plurality of cooling fins 2 are mounted to the cooling part 1b of the heat pipe 1, thus constituting a power conversion device.

49. 发明专利

JPH08188064A VEHICULAR CONTROL DEVICE 失效
公开(公告)号：JPH08188064A
公开(公告)日：1996-07-23
申请号：JP103095
申请日：1995-01-09
申请人： HITACHI LTD
发明人： SUZUKI ATSUSHI , KUWABARA HEIKICHI , FUJIOKA KAZUMASA , KATO CHIYUKI , KONDO HISASHI , TANAKA TAKESHI
IPC分类号： B60K23/00
摘要： PURPOSE: To provide a vehicular control device which can be reduced in size and weight and efficiently cool electric and electronic components that should not be polluted, while keeping them sealed. CONSTITUTION: A gate drive 2 to be installed in clean air is enclosed in a closed chamber 1 beneath the floor of a vehicle body, and a refrigerator comprising an evaporator 4, a condenser 5, a compressor 6 and an expansion valve 7 is installed in order to cool the gate drive 2. The evaporator 4 is installed within the closed chamber 1, and the condenser 5 is installed within a draft chamber 9.

50. 发明专利

JPH0888490A COOLER FOR VEHICLE CONTROLLER 失效
公开(公告)号：JPH0888490A
公开(公告)日：1996-04-02
申请号：JP22465494
申请日：1994-09-20
申请人： HITACHI LTD
发明人： TANAKA TAKESHI , SUZUKI ATSUSHI , KATO CHIYUKI , FUJIOKA KAZUMASA , KUWABARA HEIKICHI , KONDO HISASHI
IPC分类号： F25D1/00 , F28D15/02 , H01L23/427 , H01L23/467 , H05K7/20
摘要： PURPOSE: To provide a small-sized, lightweight cooler for a vahicle controller, which can efficiently cool electric and electronic components in the sealed state so that it may not be eontaminated. CONSTITUTION: A gate driver 5 to be installed in clean air is contained in an enclosed chamber 23 under the floor of a vehicle body 1. A cooler for this vehicle controller comprises a blower 4 and a duct 6 for supplying the air in the chamber 23 to a side wall surface 3 exposed with the outdoor air, and flat plate fins 2 mounted at the surface 3. Thus, the power consumption of the cooler for the controller can be reduced.

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