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    • 41. 发明授权
    • Semiconductor integrated circuit having controllable internal supply voltage
    • 具有可控内部电源电压的半导体集成电路
    • US07071768B2
    • 2006-07-04
    • US10628580
    • 2003-07-29
    • Hiroyuki AbeYutaka TakasukaHisao IseHiroko TakanoSachie Takahashi
    • Hiroyuki AbeYutaka TakasukaHisao IseHiroko TakanoSachie Takahashi
    • G05F1/10G05F3/02
    • G11C5/147
    • In an integrated circuit having an internal supply voltage generation circuit which generates an internal supply voltage by descending an external supply voltage, there is provided an internal circuit which operates with a supplied internal supply voltage. The internal supply voltage generation circuit changes an internal supply voltage level to be generated in accordance with an operation speed of the internal circuit. Preferably the semiconductor integrated circuit includes a clock control circuit which generates an internal clock signal the frequency of which is controlled in accordance with the operation speed of the internal circuit. When the internal clock signal is controlled to have a higher frequency, the internal supply voltage is controlled to be higher. Also, when the internal clock signal is controlled to have a lower frequency, the internal supply voltage is controlled to be lower.
    • 在具有通过降低外部电源电压而产生内部电源电压的内部电源电压产生电路的集成电路中,提供了以所提供的内部电源电压工作的内部电路。 内部电源电压产生电路根据内部电路的运行速度改变要产生的内部电源电压。 优选地,半导体集成电路包括时钟控制电路,其生成内部时钟信号,其频率根据内部电路的操作速度被控制。 内部时钟信号被控制为具有较高的频率时,内部电源电压被控制得更高。 此外,当内部时钟信号被控制为具有较低的频率时,内部电源电压被控制为较低。
    • 42. 发明申请
    • Cooling structure and cooling method for electronic equipment
    • 电子设备冷却结构及冷却方式
    • US20050122680A1
    • 2005-06-09
    • US11034138
    • 2005-01-12
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • H05K5/00H05K7/20
    • H05K7/20581H05K7/207
    • A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the first electronic device or air inside of the second electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electric device is controlled.
    • 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第一电子设备的内部,或者第二电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 控制第一电气设备内的通风。
    • 49. 发明授权
    • Target follow-up device and camera comprising the same
    • 目标跟踪装置和包括其的相机
    • US5392088A
    • 1995-02-21
    • US114148
    • 1993-09-01
    • Hiroyuki AbeMasaru Muramatsu
    • Hiroyuki AbeMasaru Muramatsu
    • G01S3/786G02B7/28G03B13/36H04N5/225
    • G01S3/7864G02B7/28
    • The target follow-up device of the present invention is adapted quickly and reliably to follow up the position of a target which is moving at high speed. It incorporates an imaging sensor having a number of imaging elements, which performs photometry over the photographic field and which outputs input image data. Based upon this imaging sensor output, input image data for the target to be followed up are stored as reference image data by a memory device. Based upon minimum residue calculation between the input image data and the reference image data, the target follow-up device of the present invention determines the position of the target. In this determination operation, the target follow-up device selects at least one color from a plurality of colors contained in common by the input image data and the reference image data, and calculates the minimum residue for the selected color component.
    • 本发明的目标跟踪装置可快速可靠地适应跟踪高速移动的目标的位置。 它包括具有多个成像元件的成像传感器,其在照相场上执行测光并输出输入图像数据。 基于该成像传感器输出,将要跟踪的目标的输入图像数据作为参考图像数据由存储器件存储。 基于输入图像数据和参考图像数据之间的最小残差计算,本发明的目标跟踪装置确定目标的位置。 在该确定操作中,目标跟踪装置从由输入图像数据和参考图像数据共同包含的多种颜色中选择至少一种颜色,并且计算所选颜色分量的最小余数。
    • 50. 发明授权
    • Power semiconductor device with heat dissipating property
    • 功率半导体器件具有散热特性
    • US5229915A
    • 1993-07-20
    • US928665
    • 1992-08-17
    • Chihiro IshibashiHiroyuki AbeSusumu Matsuoka
    • Chihiro IshibashiHiroyuki AbeSusumu Matsuoka
    • H01L23/427
    • H01L23/427F28D15/0275H01L2924/0002
    • A power semiconductor device such as power thyristor including a semiconductor substrate which is clamped by first and second conductive members serving as the electrodes as well as heat sinks, and a plurality of heat pipes whose ends are inserted directly into the conductive members. A plurality of semiconductor substrates and temperature compensating plates are alternatively stacked on another and conductive members are provided on outermost temperature compensating plates to form an assembly. The assembly is hermetically sealed by an insulating package formed by an insulator having a corrugated outer surface such that outer surfaces of the conductive members are exposed out of the package. One or more heat pipes are inserted into the insulating package such that electrically insulating cooling medium filled in the heat pipes can be in direct contact with the semiconductor substrates. The heat pipes may be inserted into the conductive members or heat sinks provided in the assembly.
    • 功率半导体装置,例如功率晶闸管,其包括被用作电极的第一和第二导电构件以及散热器夹持的半导体衬底,以及多个热管,其端部直接插入到导电构件中。 多个半导体衬底和温度补偿板交替堆叠在另一个上,并且导电构件设置在最外面的温度补偿板上以形成组件。 组件通过由具有波纹状外表面的绝缘体形成的绝缘封装气密地密封,使得导电构件的外表面暴露于封装外。 一个或多个热管被插入到绝缘包装中,使得填充在热管中的电绝缘的冷却介质可以与半导体衬底直接接触。 热管可以插入设置在组件中的导电构件或散热器中。