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    • 48. 发明授权
    • Exhaust heat recovery apparatus
    • 废热回收装置
    • US08056616B2
    • 2011-11-15
    • US12069797
    • 2008-02-13
    • Masashi MiyagawaKimio Kohara
    • Masashi MiyagawaKimio Kohara
    • F28F3/06
    • F28D15/043F01N5/02F01N2240/22F28D15/0266F28D21/0003F28F1/126Y02T10/16
    • An exhaust heat recovery apparatus includes an evaporation unit and a condensation unit communicated with the evaporation unit such that an operation fluid circulates therein. The evaporation unit is disposed in a first fluid passage through which a first fluid flows, and performs heat exchange between the first fluid and the operation fluid, thereby evaporating the operation fluid. The condensation unit is disposed in a second fluid passage through which a second fluid flows, and performs heat exchange between the second fluid and the operation fluid. The exhaust heat recovery apparatus further includes a wet area increasing member in a tube of the evaporation unit for increasing a wet area of the operation fluid due to surface tension of the operation fluid. The wet area increasing member is disposed adjacent to an inner surface of the tube and has extension surfaces extending in directions intersecting with the inner surface.
    • 排气热回收装置包括蒸发单元和与蒸发单元连通的冷凝单元,使得操作流体在其中循环。 蒸发单元设置在第一流体通过的第一流体通道中,并且在第一流体和操作流体之间进行热交换,从而蒸发操作流体。 冷凝单元设置在第二流体通道中,第二流体通过第二流体流动,并且在第二流体和操作流体之间进行热交换。 排气热回收装置还包括在蒸发单元的管中的湿润区域增加构件,用于增加由于操作流体的表面张力引起的操作流体的湿润面积。 湿区域增加构件邻近管的内表面设置,并且具有沿与内表面相交的方向延伸的延伸表面。
    • 49. 发明授权
    • Method for manufacturing a microstructure
    • 微结构制造方法
    • US07526863B2
    • 2009-05-05
    • US11108700
    • 2005-04-19
    • Masashi MiyagawaMasahiko Kubota
    • Masashi MiyagawaMasahiko Kubota
    • B23P17/00B41J2/015G01D15/00
    • B41J2/1639B41J2/1603B41J2/1631Y10T29/49128Y10T29/4913Y10T29/49131Y10T29/49156Y10T29/49169Y10T29/49401
    • A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK) on the aforesaid positive type resist layer; exposing the positive type resist layer on the upper layer to ionizing radiation of the wavelength region that gives decomposition reaction to the positive type resist layer (PMIPK) for the formation of a designated pattern by development; exposing the positive type resist layer on the lower layer to ionizing radiation of the wavelength region that givens decomposition reaction to the positive type resist layer (PMMA) for the formation of a designated pattern by development; and coating photosensitive resin film having adhesive property on the resist pattern formed by the positive type resist layer (PMMA) and positive type resist layer (PMIPK); and then, dissolving the resist pattern to be removed after the resin film having adhesive property is hardened.
    • 微结构的制造方法包括在其上形成有加热器的基板上形成正型抗蚀剂层(PMMA)的步骤; 在上述正型抗蚀剂层上形成正型抗蚀剂层(PMIPK); 将上层的正型抗蚀剂层暴露于通过显影而形成指定图案的正型抗蚀剂层(PMIPK)的分解反应的波长区域的电离辐射; 使下层的正型抗蚀剂层暴露于通过显影而形成指定图案的正型抗蚀剂层(PMMA)的分解反应的波长区域的电离辐射; 在由正型抗蚀剂层(PMMA)和正型抗蚀剂层(PMIPK)形成的抗蚀剂图案上涂布具有粘合性的感光性树脂膜。 然后在具有粘合性的树脂膜硬化后溶解待除去的抗蚀剂图案。