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41. 发明专利

JP2003006604A Flexible ic module, production method therefor, information carrier using flexible ic module and production method therefor 有权
标题翻译：柔性IC模块，其生产方法，使用灵活IC模块的信息载体及其生产方法
公开(公告)号：JP2003006604A
公开(公告)日：2003-01-10
申请号：JP2001318142
申请日：2001-10-16
申请人： Hitachi Maxell Ltd , 日立マクセル株式会社
发明人： HINO YOSHIHARU , FUKUHARA MASAKI , OMICHI KAZUHIKO
IPC分类号： G06K19/077 , G06K19/07 , H01L25/00
CPC分类号： H01L2224/05554 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4813 , H01L2224/85801 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/20759 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/01033
摘要： PROBLEM TO BE SOLVED: To provide a configuration and a production method for a flexible IC module, with which an IC chip is hardly cracked or broken, and to provide a configuration and a production method for an information carrier utilizing the flexible IC module.
SOLUTION: A flexible IC module 1A is composed of an IC chip 1 in which a bump 1a is formed on an input/output terminal, a reinforcing plate 3 adhered on the rear side of the IC chip 1 through an adhesive layer 2, a winding wire coil 4 directly connected to the bump 1a and a flexible substrate 5 holding these respective members 1-4. In the production method therefor, the reinforcing plate 3 is stuck on the rear side of the IC chip 1 cut into each of pieces, both the terminal parts of the winding wire coil 4 are bonded to the bump 1a of the IC chip 1, and a connect thereof is held between first nonwoven fabric 5a and second nonwoven fabric 5b and bonded by thermocompression. In the information carrier and the production method therefor, cover sheets 12 are adhered on both the front and rear sides of the flexible IC module 1A through adhesive layers 11.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于IC芯片几乎不破裂或破裂的柔性IC模块的配置和制造方法，并提供利用该柔性IC模块的信息载体的构造和制造方法。解决方案：柔性IC模块1A由IC芯片1组成，其中凸起1a形成在输入/输出端子上，加强板3通过粘合层2粘附在IC芯片1的后侧，绕组直接连接到凸起1a的线圈4和容纳这些相应构件1-4的柔性基底5。在其制造方法中，将加强板3粘贴在切断成各片的IC芯片1的背面，绕组线圈4的两端部与IC芯片1的突起1a接合，其连接被保持在第一无纺布5a和第二无纺布5b之间，并通过热压粘合。在信息载体及其制造方法中，通过粘合剂层11将覆盖片12粘附在柔性IC模块1A的前后两侧。

42. 发明专利

JP2001126044A FLEXIBLE IC MODULE, ITS MANUFACTURING METHOD AND MANUFACTURING METHOD OF INFORMATION CARRIER USING FLEXIBLE IC MODULE 失效
公开(公告)号：JP2001126044A
公开(公告)日：2001-05-11
申请号：JP2000013273
申请日：2000-01-21
申请人： HITACHI MAXELL
发明人： NAKAGAWA KAZUNARI , SUEYOSHI TOSHINOBU , OMICHI KAZUHIKO , KOHAMA KYOICHI
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a flexible IC module which can be used for manufacturing a non-contact IC card, and to provide its manufacture method and also the manufacture method of an information carrier using the flexible IC module. SOLUTION: An IC chip 1 and a non-contact transmission coil 2 which is directly connected to the input/output terminal of the IC chip 1 are thermo- compression-bonded on a thermo-compression bonding synthetic resin sheet 3A. A hot pressing method or a roller pressing method can be applied as the manufacture method. In the manufacture of an information carrier, a cover sheet is thermo-compression-bonded on the surface/rear face of the flexible IC module. Non-woven fabric 3B formed of crystalline resin fiber including non-crystal copolymerized polyester can be used partially instead of the thermo- compression bonding synthetic resin sheet 3A.

43. 发明专利

JP2000011104A ELECTRONIC DATA PROCESSING ADAPTOR 失效
公开(公告)号：JP2000011104A
公开(公告)日：2000-01-14
申请号：JP35925898
申请日：1998-12-17
申请人： HITACHI MAXELL , UMC ELECTRONICS KK
发明人： KITSUTA KENICHI , TAKASUGI KAZUO , OMICHI KAZUHIKO , SAEGUSA HIROYUKI , SHINOSAWA YOSHIYUKI , SANO MASAKI
IPC分类号： G06K17/00 , G06F3/08
摘要： PROBLEM TO BE SOLVED: To shorten an access time, and to reduce power consumption at a disk drive device side without moving the magnetic head of a disk drive device at the time of transferring a signal through an adaptor between an electronic card and an electronic data processor. SOLUTION: This electronic data processing adaptor is provided with a head insertion port formed at the same position as a disk cartridge inside which a core 23 and a coil wound around the core 23 are provided, and a card housing part having a card interface for housing an electric card. The shape of this electronic data processing adaptor is almost the same as the disk cartridge. After housing the electronic card, this electronic data processing adaptor is mounted on the disk drive device of an electronic data processor so that a signal can be transferred between the electronic card and the electronic data processor. In this case, a gap part 22 of the core when this electronic data processing adaptor is mounted on the disk drive device is arranged at a position corresponding to a track 0 of a magnetic disk to be used after mounted on the disk drive device.

44. 发明专利

JPH11184982A ELECTRONIC DATA PROCESSING ADAPTER 失效
公开(公告)号：JPH11184982A
公开(公告)日：1999-07-09
申请号：JP35114397
申请日：1997-12-19
申请人： HITACHI MAXELL , UMC ELECTRONICS KK
发明人： KITSUTA KENICHI , TAKASUGI KAZUO , OMICHI KAZUHIKO , SAEGUSA HIROYUKI , SHINOSAWA YOSHIYUKI , SANO MASAKI
IPC分类号： G06K19/00 , G06K17/00
摘要： PROBLEM TO BE SOLVED: To obtain an adapter that has no crack damage even if an external force is applied, is strong in flexual rigidity, excellent in reliability and in production yielding. SOLUTION: This device is equipped with a first metallic plate 6 which has almost the same shape and area as a disk cartridge and integrally has a recessed part 10 for a driving shaft insertion in a central part, a frame 7 made of a synthetic resin integrally molded at least on the outer peripheral part of the first metallic plate 6 and a second metallic plate 8 which has almost the same shape and area as the disk cartridge and is integrally joined on the frame. A card storage part 33 that can store an electronic card 1 between the first metallic plate 6 and the second metallic plate 8 is formed by the frame 7, a card interface is provided so that it faces the card storage part 33, and a head insertion port is formed in the same position as the disk cartridge at least in either of the first metallic plate 6 or the second metallic plate 8.

45. 发明专利

JPH10287069A SEALING STRUCTURE AND METHOD FOR PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH10287069A
公开(公告)日：1998-10-27
申请号：JP9918797
申请日：1997-04-16
申请人： HITACHI MAXELL
发明人： NAKAGAWA KAZUNARI , AKATSUCHI OSAMU , OMICHI KAZUHIKO
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To securely seal a printed circuit board by providing a frame member used both to position and reinforce the board in a cavity in engagement with the board, and providing an outer cover for molding to cover a connector of the board to the member. SOLUTION: In the case of executing for a semiconductor memory card module, the module is obtained by mounting an IC package 2, electronic components 3 on an upper surface of a printed circuit board 1. Engaging holes 6 are formed at four corners and substantially a center of the board 1. A frame member 7 is superposed on the board 1, and a plurality of lower side protrusions 9c protruded down from a frame body 9 are inserted into the holes 6 to relatively position the board 1 to the member 7, and integrated to a connecting body. This engaging body is mounted in a mold, resin is poured in a cavity formed between the board 1 and an inner surface of the mold to mold an outer cover covering the board 1.

46. 发明专利

JPH10247232A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH10247232A
公开(公告)日：1998-09-14
申请号：JP4926197
申请日：1997-03-04
申请人： HITACHI MAXELL
发明人： NAKAGAWA KAZUNARI , OMICHI KAZUHIKO
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L21/56 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a small semiconductor device whose transmission efficiency of power and a signal is high and which is superior in reliability and to provide a method for easily manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with a circuit board 1, various loading parts 2, 3 4a-4e mounted on the circuit board, non-contact connectors 5 and 6 connected to the end side parts of the circuit board and a resin molding part 7 covering the periphery of the circuit board and the loading parts. The resin molding part 7 is formed so that space is not generated with the non-contact connectors 5 and 6 and thickness becomes almost equal to the heights of the non-contact connectors 5 and 6. The semiconductor device can be formed by molding resin in a die cavity in a state where the circuit board 1 in which the loading parts are mounted and the non-contact connectors are connected to the end side parts is stored in a die cavity and the outer peripheral faces of the non-contact connectors 5 and 6 are pressed by a die cavity face.

47. 发明专利

JPH10222619A ELECTROMAGNETIC CONNECTION-TYPE SEMI-CONDUCTOR CARD SYSTEM 失效
公开(公告)号：JPH10222619A
公开(公告)日：1998-08-21
申请号：JP2282397
申请日：1997-02-05
申请人： HITACHI MAXELL
发明人： NAKAGAWA KAZUNARI , AKATSUCHI OSAMU , NAKAMURA KOJIRO , HINO YOSHIHARU , OMICHI KAZUHIKO
IPC分类号： G06K19/07 , G06K17/00
摘要： PROBLEM TO BE SOLVED: To provide a semi-conductor card system by which a card mounting part is sealed with superior maintenance at a low cost. SOLUTION: A permanent magnet 4 is provided in the tip part of a memory card 1. In a meantime, a reed switch 10 is provided at a position opposed to the permanent magnet 4 in an adapter 5 where the memory card 1 is mounted. When the memory card 1 is inserted from the card inserting port 7 of the adapter 5, the reed switch 10 is turned on by the magnetic force of the permanent magnet 4 so as to detect the mounting of the memory card 1.

48. 发明专利

JPH10187898A IC CARD 失效
公开(公告)号：JPH10187898A
公开(公告)日：1998-07-21
申请号：JP25137097
申请日：1997-09-01
申请人： HITACHI MAXELL
发明人： SHINAGAWA TORU , OMICHI KAZUHIKO
IPC分类号： G06F13/10 , G06F3/08 , G06K17/00 , G06K19/07 , G11C5/00
摘要： PROBLEM TO BE SOLVED: To attain the transfer of data mainly on an IC card and also to add various processing functions to the card by sensing the state information to the opposite party of the transfer of data in addition to the transmitting information to set the opposite party at a master or a slave. SOLUTION: Each of a host computer 1 and an IC card 2 has a status (state) setting means 6 which decides the mode identification information from the transmitting data and sets its own operating state in an operation mode that is set by the opposite party and a mode information transmitting means 7 which selects the mode information out of a mode information table 5 and adds it to the transmitting data. Then the mode information added by the means 7 is transmitted as the mode identification information together with the transmitting data in a command column 3 or a response column 4 of a transmission mode when the master/slave relation is set or changed.

49. 发明专利

JPH10177627A ELECTRONIC DATA PROCESSING ADAPTER AND SYSTEM FOR USING THE SAME 失效
公开(公告)号：JPH10177627A
公开(公告)日：1998-06-30
申请号：JP27729997
申请日：1997-10-09
申请人： HITACHI MAXELL
发明人： KITSUTA KENICHI , TAKASUGI KAZUO , OMICHI KAZUHIKO
IPC分类号： G06K17/00 , G11B23/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic data processing adapter in which the convenience of a card-shaped outside storage device is improved. SOLUTION: This device is provided with a head insertion port 5 having a magnet interface 7 inside which is formed at the same position as a disk cartridge, a card mounting part having a card interface 14 for mounting an electronic card 1, a controlling part having a data storage part which card isprovided a connecting surcyut of the amnetic invertafe 7 and he carch interface 14 and a display part 8 connected with the controlling part. The external form of the device has almost the same shape as the disk cartridge and when the electronic card 1 is set to the card mounting part, at least one part of data stored in the electronic card 1 is displayed at the display part 8. The electronic card 1 is set to the card mounting part, is mounted at an electronic data processor and the magnetic head of the electronic data processor is brought into contact with the magnetic interface 7 so that the data can be received and transferred between the electronic card 1 and the electronic data processor.

50. 发明专利

JPH09275184A INFORMATION MEDIUM AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH09275184A
公开(公告)日：1997-10-21
申请号：JP14734596
申请日：1996-06-10
申请人： HITACHI MAXELL
发明人： KOHAMA KYOICHI , TAKASUGI KAZUO , OMICHI KAZUHIKO
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To provide an information medium which has a flat and beautiful surface and allows required print to be made after production thereof and method of manufacturing such thin information medium easily at high yield. SOLUTION: An information memory medium base 3 is composed of a sheet- like reinforced plate 7 deformable in the thickness direction and resin 8 impregnated in the plate 7. The plate is compressed in the thickness direction to form recesses, IC modules 1 and coils 2 are buried in the recesses, and front and back sides of the plate 7 are treated to be smooth. Cover sheets 4, 5 are adhered to both sides of the plate 3 through adhesive layers to form required information memory medium. The modules 1 and the coils 2 are mounted on the reinforced plate 7 impregnated with the resin and pressed until the surfaces of resin layers are flush with those of the modules and the coils, thus producing a base 3 having smooth front and back surfaces.

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