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    • 46. 发明申请
    • Dynamic cross fading method and apparatus
    • 动态交叉衰落方法和装置
    • US20050219418A1
    • 2005-10-06
    • US10818408
    • 2004-04-05
    • Victor ChanRaymond Chow
    • Victor ChanRaymond Chow
    • G06T3/00G09G5/00G09G5/36G09G5/39H04N5/262H04N5/265H04N9/74
    • H04N9/74H04N5/265
    • Provided is a method and apparatus for dynamic cross fading. Specifically, an embedded system can display an image produced from a blend of other images. Initially, a first image and a second image are stored in a buffer in a display controller. Then, the display controller extracts pixels from corresponding locations in the first image and the second image. The pixels are combined with weights associated with each image to perform the cross fade calculation. Consequently, the result from the cross fade calculation is transmitted to a display unit connected to the display controller for viewing. The result can also be fetched during a refresh of a panel in the display unit. In either case, the result is transmitted to a display pipe during dynamic cross fading. Thus, any images stored in the buffer remain unchanged.
    • 提供了一种用于动态交叉衰落的方法和装置。 具体来说,嵌入式系统可以显示从其他图像的混合产生的图像。 最初,将第一图像和第二图像存储在显示控制器中的缓冲器中。 然后,显示控制器从第一图像和第二图像中的相应位置提取像素。 将像素与与每个图像相关联的权重组合以执行交叉淡入淡出计算。 因此,交叉淡入淡出计算的结果被发送到与显示控制器连接的显示单元进行观看。 结果还可以在刷新显示单元中的面板时获取。 在任一情况下,在动态交叉衰落期间将结果传输到显示管道。 因此,存储在缓冲器中的任何图像保持不变。
    • 49. 发明申请
    • SUBSTRATE ENGINEERING FOR OPTIMUM CMOS DEVICE PERFORMANCE
    • 用于最佳CMOS器件性能的基板工程
    • US20050001290A1
    • 2005-01-06
    • US10604003
    • 2003-06-20
    • Victor ChanMeikei LeongMin Yang
    • Victor ChanMeikei LeongMin Yang
    • H01L21/8238H01L29/76
    • H01L21/823807
    • An integrated semiconductor structure having different types of complementary metal oxide semiconductor devices (CMOS), i.e., PFETs and NFETs, located atop a semiconductor substrate, wherein each CMOS device is fabricated such that the current flow for each device is optimal is provided. Specifically, the structure includes a semiconductor substrate that has a (110) surface orientation and a notch pointing in a direction of current flow; and at least one PFET and at least one NFET located on the semiconductor substrate. The at least one PFET has a current flow in a direction and the at least one NFET has a current flow in a direction. The direction is perpendicular to the direction. A method of fabricating such as integrated semiconductor structure is also provided.
    • 提供了位于半导体衬底顶部的具有不同类型的互补金属氧化物半导体器件(CMOS)即PFET和NFET的集成半导体结构,其中每个CMOS器件被制造成使得每个器件的电流是最佳的。 具体地,该结构包括具有(110)表面取向的半导体衬底和指向电流<001>方向的凹口; 以及位于半导体衬底上的至少一个PFET和至少一个NFET。 所述至少一个PFET具有沿<110>方向的电流,并且所述至少一个NFET具有沿<100>方向的电流。 <110>方向垂直于<100>方向。 还提供了诸如集成半导体结构的制造方法。