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    • 45. 发明授权
    • Probe polishing method, program therefor, and probe apparatus
    • 探针抛光方法,程序和探针装置
    • US08195324B2
    • 2012-06-05
    • US12545184
    • 2009-08-21
    • Hideaki TanakaSatoshi Sano
    • Hideaki TanakaSatoshi Sano
    • B24B51/00G06F11/30G06F19/00
    • G01R3/00G01R1/07342
    • A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from a first receiving part. The probe polishing method includes transferring the polishing member from the first receiving part to the mounting table; detecting a presence of foreign materials on a top surface of the polishing member mounted on the mounting table; transferring the polishing member from the mounting table to a second receiving part when the foreign materials are detected on the top surface of the polishing member; removing the foreign materials from the polishing member in the second receiving part; and transferring the polishing member from which the foreign materials are removed from the second receiving part to the first receiving part.
    • 提供了一种用于抛光探针的探针抛光方法,所述探针抛光方法通过将抛光构件通过其上具有从第一接收部分转移的抛光构件的安装台与探针滑动接触而进行抛光。 探针研磨方法包括:将研磨部件从第一容纳部转移到安装台; 检测在安装在所述安装台上的所述抛光部件的上表面上存在异物; 当抛光部件的上表面上检测到异物时,将抛光部件从安装台传送到第二接收部件; 从第二接收部分中的抛光部件移除异物; 以及将从所述第二接收部分移除异物的抛光部件传送到所述第一接收部。