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41. 发明申请

WO1996037330A1 PROCESS AND DEVICE FOR THE WAVE OR VAPOUR-PHASE SOLDERING OF ELECTRONIC UNITS 审中-公开
标题翻译： METHOD AND APPARATUS FOR波和/或电子部件汽相焊接
公开(公告)号：WO1996037330A1
公开(公告)日：1996-11-28
申请号：PCT/DE1996000968
申请日：1996-05-24
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , SCHEEL, Wolfgang , RING, Karl , HAFNER, Willi , LEICHT, Helmut
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： B23K01/015
CPC分类号： B23K1/015 , B23K2101/40 , H05K3/3415 , H05K3/3468 , H05K3/3494 , H05K2203/088
摘要： The invention describes a process and a device for wave and/or reflow soldering in the form of vapour-phase soldering for electronic units. In prior art processes and devices, either wave soldering or vapour-phase soldering alone can be performed in a single chamber. For electronic units which contain both components which are to be wave soldered and those to be reflow soldered, at least two soldering devices and two process steps are necessary. There is the further drawback that temperature-sensitive components impose either a limitation on the soldering temperature and hence the solders which can be used or laborious post-fitting. The invention performs wave soldering and vapour-phase soldering as a form of reflow soldering in a single chamber, in which an electronic unit can be placed and/or the portion of the volume of the chamber filled with the saturated vapour of a primary fluid can be controlled in such a way that, at the worst, temperature-sensitive components of the unit lie only partly in the saturated vapour and the connections of the electronic components of the unit are in the saturated vapour during soldering. The invention permits the soldering of surface-fitted, penetrating and temperature-sensitive components, e.g. large electrolytic capacitors, in a single chamber and in a single process stage and is therefore eminently suitable for economical mass production with high soldering quality.
摘要翻译：本发明描述的方法和在用于电子组件汽相焊接的形式波和/或回流焊接的装置。在在一个单一的室中仅波峰焊或仅气相焊接已知方法和装置或者是可行的。对于包含于波峰焊和回流焊接两个部件的电子组件，从而至少两个焊接设备，因此需要两个工艺步骤。还存在温度敏感设备或者需要在钎焊温度的限制，因此为所述可选择的焊接材料，或进行复杂的改造必要的缺点。本发明实现了波峰焊和汽相焊接作为在单一腔室回流焊接的形式中，电子组件可被放置成和/或填充有所述室的主液体体积分数的饱和蒸汽被如此调节使得组件中的温度敏感元件至多部分地位于饱和蒸汽，并且该连接被焊接模块的电子部件的软钎焊过程中位于饱和蒸汽。本发明允许安装面的焊接，通过配合和温度敏感的组分，例如大电解电容器，在一个单一的腔室，并在单一的工艺步骤，并且因此非常适合于廉价的大量生产具有非常好的焊接质量。

42. 发明申请

WO1996030939A1 PROCESS FOR SURFACE CONTACTING ELECTRONIC COMPONENTS 审中-公开
标题翻译：法的电子器件的表面接触
公开(公告)号：WO1996030939A1
公开(公告)日：1996-10-03
申请号：PCT/DE1996000495
申请日：1996-03-22
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , WEISS, Stefan , ZAKEL, Elke
IPC分类号： H01L21/60
CPC分类号： B23K35/38 , B23K35/3612 , H01L24/81 , H01L24/83 , H01L2224/13111 , H01L2224/16 , H01L2224/27334 , H01L2224/81001 , H01L2224/81815 , H01L2224/83001 , H01L2224/83815 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/3025 , H05K3/3489
摘要： A process for connecting an electronic component (10) having contact surfaces (12) with a substrate (11) having a contact surfaces (14) via contact metallizations (16, 17) between the contact surfaces of connecting material (15) made by a soldering or welding process, in which the electronic component and the substrate are pressed together with the application of heat, whereby during the connecting process an application layer (18) of a medium (19) containing a polyalcohol is inserted at least between the contact surfaces (12) of the electronic component (10) or the substrate (11) and the connecting material (15).
摘要翻译：用于与接触表面连接设置有具有接触表面（14）具有接触表面形成接触金属化之间的衬底（11）（16，17）的电子部件（10）的方法（12）包括在一个钎焊或焊接过程接合材料可加工的（15 ），其中，所述电子部件和所述基板的温度暴露条件下彼此压靠，其中，至少（电子部件（10）或基片（11）和连接材料（15）的接触面12）之间，设有一个涂料层（进行连接操作18时）设置由含多元醇的培养基（19）。

43. 发明申请

WO1996025649A1 PROCESS AND DEVICE FOR DETERMINING THE TONALITY OF AN AUDIO SIGNAL 审中-公开
标题翻译：方法和设备，用来确定音频信号的功能
公开(公告)号：WO1996025649A1
公开(公告)日：1996-08-22
申请号：PCT/EP1996000550
申请日：1996-02-09
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , HERRE, Jürgen , EBERLEIN, Ernst , GRILL, Bernhard , BRANDENBURG, Karlheinz , GERHÄUSER, Heinz
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G01H03/08
CPC分类号： H03G5/005
摘要： The tonality of an audio signal is determined by a process with the following stages: the blockwise frequency transformation of a digital input signal x(n) to generate a real positive representation X(k) of the input signal, where k is the index of a frequency line, and determining the tonality T of the signal component at the frequency line k in accordance with equation T(k)=F1[X](k+d1)/F2[X](k+d2), where F1 is the filtering function of a first digital filter with a first differentiating characteristics, F2 is the filtering function of a second digital filter with a second, flat or integration characteristic or a less strongly differentiating characteristic than the first, and d1 and d2 are integer constants selected depending on the filtering parameters in such a way that the respective delays in the filters are compensated.
摘要翻译：的音频信号的音调是由包括以下步骤的方法来确定：将数字输入信号x（n）的嵌段频率变换以产生所述输入信号，其中k表示一个频率线的索引的一个实正值表示X（k）和确定所述信号分量的音调的T 在根据以下等式Frenquenzlinie K：T（K）= F1 [X]（K + D1）/ F2 [X]（K + D2），其中F1是第一数字滤波器的滤波器功能与第一，微分特性，其中F2 与第二第二数字滤波器的滤波器功能，扁平或积分或相对于所述第一特性较不强烈地区别特性，并且其中，d1和d2，其根据所述滤波器参数选择的整数常数，例如过滤器的各自的延迟，这进行补偿。

44. 发明申请

WO1996024162A1 CHIP HOUSING AND PROCESS FOR PRODUCING IT 审中-公开
标题翻译： CHIPGEHÄUSUNG及其制造方法芯片GEHÄUSUNG
公开(公告)号：WO1996024162A1
公开(公告)日：1996-08-08
申请号：PCT/DE1996000058
申请日：1996-01-12
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , AZDASHT, Ghassem , ZAKEL, Elke , REICHL, Herbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L23/057
CPC分类号： H01L23/057 , B23K26/009 , B23K26/18 , H01L25/105 , H01L2224/50 , H01L2225/1005 , H01L2225/1023 , H01L2225/1076 , H01L2924/01079
摘要： A housing to accept at least one electronic component, e.g. a chip (1) or the like, and a process for producing such a housing with a cover (12) and a counter-cover (13) accepting the electronic component between them, in which there are conductive tracks (15, 16 or 24, 25) on the inner surfaces of the cover (12) and the counter-cover (13) in such a way that the tracks (15, 16) on the cover (12) connect terminal areas (21, 22) of the component (11) to the tracks (24, 25) on the counter-cover (13) and the tracks (24, 25) on the counter-cover (13) open into external terminals (32, 33) of the housing (10). The cover (12) and/or the counter-cover (13) has/have a flexible substrate layer (14) and are interconnected in the cover connecting regions (73) which surrounds the component (11).
摘要翻译：用于接收至少一个电子元件，诸如芯片（11）或类似物，以及用于Hersteellung这样Gehäusung过程有衬垫（12）和一个反覆盖层（13），其接收所述电子部件之间，其中所述顶片Gehäusung（12 ）和对置的覆盖层（提供这样的具有条带导体（15，16和24，25）的内表面上13）的顶片（12）焊盘的导体轨（15，16）（21，（22）的装置11的）至Gehäusung的柜台顶部层（13）（在外部端子32，33）的计数器顶部层（13）连接的导体轨（24，25），和导体轨道（24，25）（10）打开，其中所述顶片（12）和/ 或计数器顶片（13）包括柔性背衬层（14）和具有与周围的连接部分（73）连接在一起，覆盖层的成分（11）。

45. 发明申请

WO1996023318A1 PLASMA REACTOR 审中-公开
标题翻译：等离子体反应器
公开(公告)号：WO1996023318A1
公开(公告)日：1996-08-01
申请号：PCT/DE1995001786
申请日：1995-12-08
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , WILD, Christof , FÜNER, Michael , KOIDL, Peter
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01J37/32
CPC分类号： H01J37/32229 , H01J37/32192 , H01J37/32247
摘要： The invention concerns a plasma reactor for generating and maintaining plasma. The plasma reactor comprises a resonant cavity (11) whose cross-section tapers in summit regions (13, 16) in which the wall (14) of the resonant cavity (11) is closed to such an extent that an excited field mode in the region of the cross-sectional tapered portions displays main peaks (15, 31) whose maximum field intensity is increased with respect to the field intensity of adjacent secondary peaks. A reaction unit (18) is provided in the region of a main peak (31) with a substrate (21) which is to be processed and which can be coated in the gas phase of the plasma (32). As a result of the field intensity distribution brought about by a resonant cavity (11) of the given shape, with main peaks (15, 31) which are greatly increased with respect to secondary peaks, process parameters such as gas pressure and coupled electromagnetic power can be selected very largely independently of one another when the plasma (32) is in a stable situation, without the plasma (32) igniting undesirably in the region of secondary peaks. Furthermore, the comparatively homogeneous field intensity distribution in the main peak (31) maintaining the plasma (32) causes the substrate (21) to be processed uniformly.
摘要翻译：在用于产生和维持等离子体的等离子体反应器中，谐振腔（11）设置，其横截面在顶点区域（13，16）是锥形的。在顶点区域（13，16）的空腔（11）的壁（14）关闭的程度，在横截面收缩的，其最大磁场强度相比相邻的次要最大值的场强是过度的区域主要最大值（15，31）的激发模式字段。在主最大（31）的区域中具有包括被处理基板（21）的反应单元（18）被提供，其是从等离子体（32）的气相涂覆的。通过处理特定形状产生的场强分布的谐振腔（11）相对于次级最大值过高主峰（15，31）是过程参数，例如气体压力和在等离子体（32）在很大程度上独立选择的稳定位置发射电磁功率，而不涉及到在二次最大值的区域中的等离子体（32）的不希望的点火。更设有由相对均匀的磁场强度分布实现，其中在等离子体（32）娱乐主最大（31）的基板（21）的均匀处理。

46. 发明申请

WO1996021748A1 PROCESS FOR PRODUCING WEAR-RESISTANT COLOURED COATINGS 审中-公开
标题翻译：用于生产耐磨着色层
公开(公告)号：WO1996021748A1
公开(公告)日：1996-07-18
申请号：PCT/DE1996000045
申请日：1996-01-09
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , JÄGER, Steffen , NEUMANN, Frank , KLAGES, Claus-Peter
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： C23C14/06
CPC分类号： C23C14/0015 , C23C14/10 , C23C14/12 , C23C14/22
摘要： The invention relates to a process for producing wear-resistant coloured composite coatings consisting of vaporisable and/or sublimatable organic colorants and transparent inorganic substances in vacuo, in which the coating(s) deposited on a substrate is/are simultaneously subjected to the effect of ions during the growth of the coating(s). This procedure still further improves the mechanical and optical properties of such coatings.
摘要翻译：本发明涉及一种用于生产耐磨的着色的，从蒸发的和/或可升华形成的有机染料并在真空中Compositschichten透明的无机材料，其中在膜生长的同时沉积在基板（一个或多个）层（一个或多个）上，离子的影响是/是至少暂时停止。用这种方法，这种层的机械和光学性能进一步提高。

47. 发明申请

WO1996020583A1 PROCESS FOR MANIPULATING MICROCOMPONENTS OR LIGHTWEIGHT COMPONENTS AND DEVICE TO CARRY OUT THE PROCESS 审中-公开
标题翻译：方法中微型用于实施过程中操纵或轻组分和设备
公开(公告)号：WO1996020583A1
公开(公告)日：1996-07-04
申请号：PCT/DE1995001865
申请日：1995-12-22
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , WEISENER, Thomas , VÖGELE, Gerald , BARK, Carlo
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H05K13/04
CPC分类号： H01L21/6715 , B25J7/00 , B25J15/00 , B81C99/002 , H01L21/67144 , H01L21/6838 , H01L24/75 , H05K13/0404 , H05K13/0469
摘要： Described is a process for manipulating microcomponents or other lightweight components wherein a gripper, using adhesives applied between gripper surface and component, removes the latter from a magazine or the like and deposits it at a point of destination. To do this the gripper is positioned horizontally over the component and an adhesive is applied to the gripper surface. Gripper and component are then brought together far enough that the area between them is completely wetted. The amount of liquid between gripper surface and component can then be reduced as needed until an optimal adhesive force has been attained. The gripper with component is then moved to an assembly station and the aligned component is released, optionally following appropriate fixation. At the end of the joining operation the gripper is then lifted off the component and returned to its starting position.
摘要翻译：我们将描述用于操纵微型元件或其它轻组分，其中夹持器使用所述钩表面和部件与手柄或类似的存储器之间的粘合剂的方法。提取并稳定在一个目的地。为了这个目的，对把手部件上方的夹持器被水平地定位并且被馈送到粘合剂的抓持表面。夹持器和组件随后到目前为止朝向彼此移动，直到液体完全润湿它们之间的表面。的钩表面与所述部件之间的液体的量可随后被降低，如果有必要，直至获得最佳的粘附性。随后，与所述部件的夹持器移动到装配站和所述对准元件，合适的固定解除后任选。接着该接合操作夹纱器从组件引发并返回到起始位置的完成。

48. 发明申请

WO1996012944A1 SOLID-STATE CHEMICAL SENSOR 审中-公开
标题翻译：化工固态传感器
公开(公告)号：WO1996012944A1
公开(公告)日：1996-05-02
申请号：PCT/EP1995004108
申请日：1995-10-19
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , MEYER, Jörg-Uwe , HAEUSLER, Andrea
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G01N27/12
CPC分类号： G01N33/004 , G01N27/12
摘要： The invention pertains to a solid-state chemical sensor with a substrate support, on the underside of which is mounted a heating element with branch circuit connections and on the top surface of which are arranged interdigital electrodes and thereon a carbon dioxide-sensitive material which consists essentially of CuO and TiO3, as well as additional metal oxides, in the form of a thick film of approximately 50-200 mu m.
摘要翻译：本发明涉及一种具有衬底支撑件上，其在底部具有加热元件被施加有线终端和被放置在叉指型电极的顶部上，然后在二氧化碳敏感材料的固态化学传感器，其中所述材料基本上由CuO和TiO 3和另外的金属氧化物的形成200微米 - 和如约50微米厚的膜。

49. 发明申请

WO1996011415A2 PLASTIC OPTICAL COMPONENTS 审中-公开
标题翻译：塑料光学元件
公开(公告)号：WO1996011415A2
公开(公告)日：1996-04-18
申请号：PCT/DE1995001353
申请日：1995-09-28
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , BAUER, Monika , KRÜGER, Harmut , BRÄUER, Andreas
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G02B01/04
CPC分类号： G02B1/04 , C07C261/02 , C08G73/0655 , Y10T428/31547 , C08L79/04 , C08L79/00
摘要： The invention relates to polycyanate resin optical components with a refractive index at 633 nm in the range from 1.45 to 1.70 and an optical attenuation at 1.3 or 1.55 mu m of 0.1 to 1.0 dB/cm.
摘要翻译：本发明涉及氰酸酯树脂，在1.45的范围内633nm的折射率1.70和1.3或1.55微米0.1-1.0分贝/厘米的光衰减的光学元件节目。

50. 发明申请

WO1996008749A2 METHOD OF PRODUCING A THREE-DIMENSIONAL COMPONENT OR GROUP OF COMPONENTS 审中-公开
标题翻译：一种用于生产三维部件或任何部件组
公开(公告)号：WO1996008749A2
公开(公告)日：1996-03-21
申请号：PCT/DE1995001151
申请日：1995-08-23
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , ROTHE, Martina , MACIOSSEK, Andreas , LÖCHEL, Bernd
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G03F07/00
CPC分类号： H01L28/10 , F15C5/00 , G03F7/00 , G03F7/0035 , H01F41/041 , H01F2017/0086
摘要： The invention concerns a method of producing a three-dimensional component or group of components, particularly on surfaces of already processed semiconductor chips . The production of three-dimensional features on chip surfaces is based on the stucturing of thick photosensitive resists and subsequent formation of the surface features by galvanic etching. Prior art methods merely use a thick photoresist and interposed galvanic starting layers to form three-dimensional features. The production of complex features is only possible with considerable difficulty owing to the low stability of the photoresist. The method proposed for the production of three-dimensional features uses, in addition to the galvanic etching of e.g. UV-structured photoresist layers with build-on metal films (16), etching using metal auxiliary films which are later removed again (sacrificial layers) (13). These metal auxiliary films lying in the resist layers are also used, in multi-layer features, as galvanic starting layers for additional build-on levels. The three-dimensional features which can be made by the method described enable, for example, e.g. coils and transformers to be manufactured, in a form in which they could not be manufactured previously, for integration on chip surfaces.
摘要翻译：本发明涉及一种方法，用于对已经处理过的的半导体芯片表面上产生的三个组分或组分的组，尤其如此。在芯片上表面上已知的三维结构的基础是厚光致抗蚀剂和随后的电镀形成该抗蚀剂结构的结构。公知的方法只使用厚光致抗蚀剂和中间晶种电极层为三维结构的形成。更复杂的结构的建设是只增加了费用可能的，因为光致抗蚀剂的稳定性低。根据本发明的方法使用三维结构除了的电复制，对于构成金属层（16）和与后要除去再次金属辅助层（牺牲层）（13）的印象的例子UV图案化光致抗蚀剂层。这种固有的在金属涂料层的辅助层，同时使用在多层结构作为种子电极层为更要建立的水平。这里描述的方法提供了三维结构，例如，线圈和变压器准备在切屑表面集成，这不能被以这种形式到目前为止实现。

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