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    • 43. 发明申请
    • MASSAGE APPLIANCE FOR BODY MASSAGE
    • 按摩器具全身按摩
    • WO1997001999A1
    • 1997-01-23
    • PCT/DE1996001229
    • 1996-07-04
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.WÖLTJE, KaiVOLZ, Hansjörg
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    • A61H37/00
    • A61H37/00A61H7/004A61H15/0092A61H23/02A61H2201/0207
    • The invention concerns a massage appliance for massaging the body, e.g. the back and legs, on a treatment bed and comprises a drive arrangement for a massage device on which a movable and interchangeable massaging head is mounted. The massage appliance is equipped in each case with three shafts moving in the three spatial directions, these shafts being perpendicular to one another. One shaft carries a massage arm disposed perpendicular to the massaging site. The massage arm comprises a ball-and-socket joint for adaptation to rises and inclinations of the surface to be massaged, i.e. the skin. The massage appliance comprises a plurality of safety devices which inter alia prevent a set operating pressure at a predetermined breaking point from being exceeded and a set operating torque from being exceeded by means of a slip clutch on the massage arm. At the end of a massage, in normal operation and when the appliance malfunctions, the massage arm is automatically withdrawn from the massage site into a predetermined rest position. Furthermore, one of the three shafts, namely the shaft carrying the massage arm, can be folded into the plane formed by the other two shafts. In this way the massage appliance can be transported in a case-like housing and its volume considerably reduced. A control device is provided and monitors the settings of the massage areas and the triggering of safety commands to prevent injury and undesired massage movements during massage. The control device also enables the massage programmes and sequences to be established and selected and the massage tool to be controlled such that a constant pressure is set at the massage site, for example.
    • 本发明例如涉及一种按摩器按摩身体 背部和腿部上的治疗床用的驱动装置用于向其中可移动和可更换的按摩头附接一个按摩装置。 按摩器在三个空间方向上设置有三个轴,所述轴是相互垂直的。 的轴的轴承设置成垂直于Massageort按摩臂。 按摩手臂有一个球窝接头以适应山坡和按摩区的倾斜或进行按摩皮肤。 按摩器具有阻止,在众多的安全装置的其他超过在预定的断裂点,并通过在按摩滑动离合器的装置限定的工作扭矩指定运行压力; 在正常和故障情况下的按摩结束,从Massageort按摩手臂休息的指定位置取款是自动完成的。 此外,可以是三个空间轴中的一个,即一个与按摩臂,在由另外两个轴形成的褶皱。 以这种方式,有可能传输的按摩机在一个手提箱状的壳体或大大地减少其体积。 它是提供一种控制设备,其监视按摩项和监测在按摩期间的损伤和不想要的按摩动作安全指令触发的设置。 控制装置还使按摩程序和进程和按摩用具的控制的确定和选择,例如在Massageort恒定压力的控制。
    • 48. 发明申请
    • PROCESS AND DEVICE FOR THE WAVE OR VAPOUR-PHASE SOLDERING OF ELECTRONIC UNITS
    • METHOD AND APPARATUS FOR波和/或电子部件汽相焊接
    • WO1996037330A1
    • 1996-11-28
    • PCT/DE1996000968
    • 1996-05-24
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.SCHEEL, WolfgangRING, KarlHAFNER, WilliLEICHT, Helmut
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    • B23K01/015
    • B23K1/015B23K2101/40H05K3/3415H05K3/3468H05K3/3494H05K2203/088
    • The invention describes a process and a device for wave and/or reflow soldering in the form of vapour-phase soldering for electronic units. In prior art processes and devices, either wave soldering or vapour-phase soldering alone can be performed in a single chamber. For electronic units which contain both components which are to be wave soldered and those to be reflow soldered, at least two soldering devices and two process steps are necessary. There is the further drawback that temperature-sensitive components impose either a limitation on the soldering temperature and hence the solders which can be used or laborious post-fitting. The invention performs wave soldering and vapour-phase soldering as a form of reflow soldering in a single chamber, in which an electronic unit can be placed and/or the portion of the volume of the chamber filled with the saturated vapour of a primary fluid can be controlled in such a way that, at the worst, temperature-sensitive components of the unit lie only partly in the saturated vapour and the connections of the electronic components of the unit are in the saturated vapour during soldering. The invention permits the soldering of surface-fitted, penetrating and temperature-sensitive components, e.g. large electrolytic capacitors, in a single chamber and in a single process stage and is therefore eminently suitable for economical mass production with high soldering quality.
    • 本发明描述的方法和在用于电子组件汽相焊接的形式波和/或回流焊接的装置。 在在一个单一的室中仅波峰焊或仅气相焊接已知方法和装置或者是可行的。 对于包含于波峰焊和回流焊接两个部件的电子组件,从而至少两个焊接设备,因此需要两个工艺步骤。 还存在温度敏感设备或者需要在钎焊温度的限制,因此为所述可选择的焊接材料,或进行复杂的改造必要的缺点。 本发明实现了波峰焊和汽相焊接作为在单一腔室回流焊接的形式中,电子组件可被放置成和/或填充有所述室的主液体体积分数的饱和蒸汽被如此调节使得组件中的温度敏感元件至多部分地 位于饱和蒸汽,并且该连接被焊接模块的电子部件的软钎焊过程中位于饱和蒸汽。 本发明允许安装面的焊接,通过配合和温度敏感的组分,例如 大电解电容器,在一个单一的腔室,并在单一的工艺步骤,并且因此非常适合于廉价的大量生产具有非常好的焊接质量。