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    • 49. 发明授权
    • Chip type thin film capacitor, and manufacturing method therefor
    • 片式薄膜电容器及其制造方法
    • US06236102B1
    • 2001-05-22
    • US09207182
    • 1998-12-08
    • Young Min KimBang Won Oh
    • Young Min KimBang Won Oh
    • H01L2972
    • H01G4/232H01G4/06
    • A chip type thin film capacitor is disclosed. The contact faces between inner electrodes and outer electrodes are expanded. That is, one end portion of each of first and second electrodes 220 and 240 are exposed to the outside, and the upper faces of the first and second electrodes 220 and 240 are etched so that the upper faces would be exposed to the outside. Thus first and second outer electrode connection portions 260 and 270 are formed, and terminal electrodes 280 are formed thereon. Then first and second outer electrodes 290 and 300 are formed thereupon, and a protecting layer 310 is formed by using polyimide upon a second dielectric layer 250.
    • 公开了一种片式薄膜电容器。 内电极和外电极之间的接触面扩大。 也就是说,第一和第二电极220和240中的每一个的一个端部暴露于外部,并且蚀刻第一和第二电极220和240的上表面,使得上表面暴露于外部。 因此,形成第一和第二外部电极连接部260和270,并且在其上形成端子电极280。 然后在其上形成第一外电极290和第二外电极300,并且在第二电介质层250上使用聚酰亚胺形成保护层310。