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41. 发明申请

US20110305875A1 ELECTRONIC DEVICE ASSEMBLY 审中-公开
标题翻译：电子装置总成
公开(公告)号：US20110305875A1
公开(公告)日：2011-12-15
申请号：US13216357
申请日：2011-08-24
申请人： Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
发明人： Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
IPC分类号： B32B1/00 , B24B1/00
CPC分类号： H05K5/0013 , Y10T29/49826 , Y10T428/24628
摘要： Apparatus and methods for assembling an electronic device and components thereof are provided. The electronic device may include a housing and a cover inserted into an opening in the housing. The electronic device may also include a first assembly that may be inserted into the housing through a first end, and a second assembly that may be inserted into the housing through a second end. The electronic device may also include end cap assemblies. In some embodiments, the electronic device may include an input mechanism coupled to the housing and a plate coupled to the housing. In some embodiments, a connector of the electronic device may be mounted on a circuit board by inserting a fixture into the connector, mounting the connector to a portion of the circuit board, removing the fixture from the connector, and separating the portion of the circuit board from another portion of the circuit board.
摘要翻译：提供了用于组装电子设备及其组件的装置和方法。电子设备可以包括壳体和插入壳体中的开口中的盖子。电子设备还可以包括可以通过第一端插入壳体的第一组件和可以经由第二端插入壳体中的第二组件。电子设备还可以包括端盖组件。在一些实施例中，电子设备可以包括联接到壳体的输入机构和联接到壳体的板。在一些实施例中，电子设备的连接器可以通过将固定装置插入到连接器中来安装在电路板上，将连接器安装到电路板的一部分上，从连接器移除固定装置，并将电路的一部分板从电路板的另一部分。

42. 发明申请

US20110076989A1 MISSED COMMUNICATION HANDLING 有权
标题翻译： MISSED通信处理
公开(公告)号：US20110076989A1
公开(公告)日：2011-03-31
申请号：US12571034
申请日：2009-09-30
申请人： Stephen Brian Lynch
发明人： Stephen Brian Lynch
IPC分类号： H04L12/58
CPC分类号： H04M1/72547 , H04M1/72566
摘要： Systems, methods and devices for missed call handling are provided. In particular there is provided a method for providing missed communication reminders. The method includes receiving an electronic communication and determining, by an electronic device, that the electronic communication was not acknowledged. In response to determining that the electronic communication was not acknowledged, a missed communication reminder is created and scheduled to be actuated automatically at a certain time. The missed communication reminder is stored in an electronic storage medium associated with the electronic device. Upon reaching the certain time, the missed communication reminder is actuated through an output apparatus in communication with the electronic device.
摘要翻译：提供了错过呼叫处理的系统，方法和设备。特别地，提供了一种用于提供错过的通信提醒的方法。该方法包括接收电子通信并由电子设备确定电子通信未被确认。响应于确定电子通信未被确认，创建错过的通信提醒并将其安排为在一定时间自动启动。错过的通信提醒被存储在与电子设备相关联的电子存储介质中。在达到一定时间后，通过与电子设备通信的输出设备致动错过的通信提醒。

43. 发明申请

US20100077607A1 Assembly Techniques for Electronic Devices Having Compact Housing 有权
标题翻译：具有紧凑外壳的电子设备的装配技术
公开(公告)号：US20100077607A1
公开(公告)日：2010-04-01
申请号：US12240494
申请日：2008-09-29
申请人： Stephen Brian Lynch
发明人： Stephen Brian Lynch
IPC分类号： H05K3/34 , H01L23/48 , B23P19/00
CPC分类号： H05K3/3405 , B23K1/0016 , B23K1/002 , B23K3/047 , B23K2101/38 , H05K1/182 , H05K3/3494 , H05K2201/10189 , H05K2203/0195 , Y10T29/49128 , Y10T29/4913 , Y10T29/49142 , Y10T29/49144 , Y10T29/534
摘要： Improve techniques for assembling electronic devices within housings are disclosed. The improved techniques enable distinct electrical components of an assembly to be separately inserted into a tightly constrained enclosure. After the separate electrical components have been inserted into the housing, the separate electrical components can be electrically connected. Advantageously, the improved techniques enable electrical components of an assembly to be separately inserted into a tightly constrained enclosure when a sub-assembly of such products prior to insertion is not practicable or feasible.
摘要翻译：公开了用于组装外壳内的电子设备的技术。改进的技术使得组件的不同电气部件能够单独地插入紧密约束的外壳中。在单独的电气部件已经插入外壳之后，分开的电气部件可以电连接。有利地，当在插入之前这种产品的子组件不可行或可行时，改进的技术使得组件的电气部件能够单独地插入紧密约束的外壳中。

44. 发明申请

US20100062656A1 Low Profile Plug Receptacle 有权
标题翻译：薄型插头插座
公开(公告)号：US20100062656A1
公开(公告)日：2010-03-11
申请号：US12205333
申请日：2008-09-05
申请人： Stephen Brian Lynch , Anthony Sagala Montevirgen
发明人： Stephen Brian Lynch , Anthony Sagala Montevirgen
IPC分类号： H01R24/04
CPC分类号： H01R24/58 , H01R2105/00 , H01R2107/00
摘要： A low profile receptacle plug receptacle is disclosed. The low profile plug receptacle which may have a housing with a partially circular opening that is configured in one embodiment to receive a cylindrical plug. The low profile receptacle plug receptacle may have a second opening which has a width smaller than the diameter of the cylindrical plug. A portion of the cylindrical plug may extend past the second opening when inserted into the housing. The low profile receptacle plug receptacle may part of an electronic device.
摘要翻译：公开了一种低调的插座插座。小型插头插座可以具有在一个实施例中被配置为容纳圆柱塞的部分圆形开口的壳体。小型插座插座可具有第二开口，该第二开口的宽度小于圆柱塞的直径。当插入壳体中时，圆柱形塞子的一部分可延伸穿过第二开口。薄型插座插座可以是电子设备的一部分。

45. 发明申请

US20100061039A1 ELECTRONIC DEVICE ASSEMBLY 有权
标题翻译：电子装置总成
公开(公告)号：US20100061039A1
公开(公告)日：2010-03-11
申请号：US12205551
申请日：2008-09-05
申请人： Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
发明人： Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
IPC分类号： H05K7/00 , B23P11/00
CPC分类号： H05K5/0013 , Y10T29/49826 , Y10T428/24628
摘要： Apparatus and methods for assembling an electronic device and components thereof are provided. The electronic device may include a housing and a cover inserted into an opening in the housing. The electronic device may also include a first assembly that may be inserted into the housing through a first end, and a second assembly that may be inserted into the housing through a second end. The electronic device may also include end cap assemblies. In some embodiments, the electronic device may include an input mechanism coupled to the housing and a plate coupled to the housing. In some embodiments, a connector of the electronic device may be mounted on a circuit board by inserting a fixture into the connector, mounting the connector to a portion of the circuit board, removing the fixture from the connector, and separating the portion of the circuit board from another portion of the circuit board.
摘要翻译：提供了用于组装电子设备及其组件的装置和方法。电子设备可以包括壳体和插入壳体中的开口中的盖子。电子设备还可以包括可以通过第一端插入壳体的第一组件和可以经由第二端插入壳体中的第二组件。电子设备还可以包括端盖组件。在一些实施例中，电子设备可以包括联接到壳体的输入机构和联接到壳体的板。在一些实施例中，电子设备的连接器可以通过将固定装置插入到连接器中来安装在电路板上，将连接器安装到电路板的一部分上，从连接器移除固定装置，并将电路的一部分板从电路板的另一部分。

46. 发明授权

US07660127B2 Electrical components coupled to circuit boards 有权
标题翻译：电气元件耦合到电路板
公开(公告)号：US07660127B2
公开(公告)日：2010-02-09
申请号：US11519388
申请日：2006-09-11
申请人： Douglas Joseph Weber , Pinida Jan Moolsintong , Robert Sean Murphy , Stephen Brian Lynch
发明人： Douglas Joseph Weber , Pinida Jan Moolsintong , Robert Sean Murphy , Stephen Brian Lynch
IPC分类号： H05K5/00
CPC分类号： H05K1/147 , G06F1/186 , H05K1/189 , H05K2201/10189
摘要： The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical component can be integrated with a flexible circuit of another electrical component. The flexible circuit can be electrically and mechanically coupled to the circuit board after the circuit board is inserted into the housing. Alternatively, electrical contacts can be disposed on a body of the electrical component and a complementary set of electrical contacts can be disposed on the circuit board. When the circuit board is disposed within a receptacle of the electrical component, the electrical contacts on the electrical component are coupled directly to the electrical contacts on the circuit board.
摘要翻译：在将电路板插入电子设备的壳体之后，本发明可以促进电气部件与电路板之间的耦合。电气部件可以与另一个电气部件的柔性电路集成。在将电路板插入壳体之后，柔性电路可电连接和机械耦合到电路板。或者，可以将电触头设置在电气部件的主体上，并且可以在电路板上设置互补的一组电触点。当电路板设置在电气部件的插座中时，电气部件上的电接触件直接连接到电路板上的电触头。

47. 发明申请

US20100001978A1 AMBIENT LIGHT INTERFERENCE REDUCTION FOR OPTICAL INPUT DEVICES 审中-公开
标题翻译：用于光输入设备的环境光干扰减少
公开(公告)号：US20100001978A1
公开(公告)日：2010-01-07
申请号：US12167237
申请日：2008-07-02
申请人： Stephen Brian Lynch , Steve porter Hotelling
发明人： Stephen Brian Lynch , Steve porter Hotelling
IPC分类号： G06F3/042
CPC分类号： G06F3/042 , G06F3/0418
摘要： Methods and apparatus for preventing fluctuations in ambient light from affecting the optical input mechanism of a liquid crystal display device. In one embodiment, an independent light source is adapted to generate electromagnetic signals through the cover glass of the display device. When the user's finger is proximate to a certain region of the touch panel, the electromagnetic signals reflect off of the user's finger and back through the cover glass. One or more photosensors monitoring the presence of these reflected signals service the various regions on the touch panel where input may be detected. Thus, when the reflected signals are detected at a certain region, the user's finger may be assumed to be present.
摘要翻译：防止环境光波动影响液晶显示装置的光输入机构的方法和装置。在一个实施例中，独立光源适于通过显示装置的盖玻璃产生电磁信号。当用户的手指靠近触摸面板的特定区域时，电磁信号反射离开用户的手指并且穿过盖玻片。监测这些反射信号的存在的一个或多个光电传感器服务于可以检测输入的触摸面板上的各个区域。因此，当在特定区域检测到反射信号时，可以假设用户的手指存在。

48. 发明申请

US20090017242A1 Methods and systems for forming a dual layer housing 有权
标题翻译：用于形成双层外壳的方法和系统
公开(公告)号：US20090017242A1
公开(公告)日：2009-01-15
申请号：US11964652
申请日：2007-12-26
申请人： Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
发明人： Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
IPC分类号： B32B1/08 , B32B37/00 , B32B3/00
CPC分类号： B29C45/1657 , B23K26/382 , B29C37/0082 , B29C45/14311 , B29C45/14344 , B29C45/1671 , B29C2045/14327 , B29K2055/02 , B29K2069/00 , B29K2705/00 , B29L2031/3481 , B32B2355/02 , B32B2369/00 , B32B2457/00 , C23F1/00 , C23F1/16 , Y10T428/13 , Y10T428/1352 , Y10T428/1355 , Y10T428/24008 , Y10T428/24273 , Y10T428/24521 , Y10T428/31678
摘要： Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
摘要翻译：公开了将内部特征或复杂的机械结构应用于金属部件的表面的方法和装置。根据本发明的一个方面，一种用于产生包括基底和模制件的组件的方法包括获得基底，并在基底的表面上形成至少一个结合特征。该方法还包括在结合特征的表面和基底的表面上模制。在粘合特征表面和基材表面上的模塑将模制件机械地结合到基底上。

49. 发明申请

US20080065246A1 HIGHLY PORTABLE MEDIA DEVICES 有权
标题翻译：高性价比的媒体设备
公开(公告)号：US20080065246A1
公开(公告)日：2008-03-13
申请号：US11739489
申请日：2007-04-24
申请人： Rico Zorkendorfer , Stephen Brian Lynch , Dinesh Mathew , Jonathan P. Ive , Stephen Paul Zadesky , Evans Hankey , Christopher David Prest
发明人： Rico Zorkendorfer , Stephen Brian Lynch , Dinesh Mathew , Jonathan P. Ive , Stephen Paul Zadesky , Evans Hankey , Christopher David Prest
IPC分类号： G06F17/00
CPC分类号： G06F1/163 , G06F1/1632 , G06F1/1643 , G06F1/1698 , H01R24/58 , H04R2420/09 , Y10T24/1391
摘要： An improved portable media device and methods for operating a media device are disclosed.
摘要翻译：公开了改进的便携式媒体设备和用于操作媒体设备的方法。

50. 发明授权

US09756733B2 Display and multi-layer printed circuit board with shared flexible substrate 有权
公开(公告)号：US09756733B2
公开(公告)日：2017-09-05
申请号：US13252971
申请日：2011-10-04
申请人： Paul S. Drzaic , Jeremy C. Franklin , Stephen Brian Lynch , Scott A. Myers , Benjamin M. Rappoport , Fletcher R. Rothkopf , John P. Ternus
发明人： Paul S. Drzaic , Jeremy C. Franklin , Stephen Brian Lynch , Scott A. Myers , Benjamin M. Rappoport , Fletcher R. Rothkopf , John P. Ternus
IPC分类号： G09G5/00 , G09G3/30 , H05K1/18 , G09G3/20 , G02F1/1345
CPC分类号： H05K1/189 , G02F1/13452 , G09G3/20 , G09G2300/0408 , G09G2300/0426 , H05K2201/10128
摘要： An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes.

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