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    • 41. 发明授权
    • Gate protection device for MOS circuits
    • MOS电路的栅极保护装置
    • US4072976A
    • 1978-02-07
    • US754932
    • 1976-12-28
    • Eliyahou Harari
    • Eliyahou Harari
    • H01L27/02H01L29/423H01L29/78H01L29/94
    • H01L29/4232H01L27/0251H01L29/78H01L29/94Y10S148/055
    • The specification describes an integrated device for the input protection of MOS circuits. It consists of an MOS capacitor formed by the thinning of a section of the input gate dielectric, SiO.sub.2, and the thinning of an adjoining section of the gate metal, Al. An incoming pulse of static charge with high amplitude and short duration will break down the thinned dielectric of the capacitor before breaking down the relatively thick portion of the gate dielectric. Since the metal over the thin dielectric is also relatively thin, it evaporates from the vicinity of the fault by the generated Joule heat immediately following the breakdown. Thus, the breakdown is self healed and can be repeated many times without damaging the circuit.
    • 该规范描述了用于MOS电路的输入保护的集成器件。 它由通过输入栅极电介质的一部分薄化而形成的MOS电容器,以及栅极金属Al的邻接部分的薄化。 具有高幅度和短持续时间的静电荷的输入脉冲将在分解栅极电介质的较厚部分之前分解电容器的变薄的电介质。 由于薄电介质上的金属也相对较薄,所以在故障附近之后立即从故障附近由产生的焦耳热蒸发掉。 因此,故障是自我愈合的,并且可以重复多次而不损坏电路。
    • 42. 发明申请
    • NAND Flash Memory Controller Exporting a NAND Interface
    • NAND闪存控制器导出NAND接口
    • US20130111113A1
    • 2013-05-02
    • US13596926
    • 2012-08-28
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • G06F12/02
    • G06F12/0246G06F11/1068G06F11/1072G06F2212/7201G11C16/04G11C16/0483
    • A NAND controller for interfacing between a host device and a flash memory device (e.g., a NAND flash memory device) fabricated on a flash die is disclosed. In some embodiments, the presently disclosed NAND controller includes electronic circuitry fabricated on a controller die, the controller die being distinct from the flash die, a first interface (e.g. a host-type interface, for example, a NAND interface) for interfacing between the electronic circuitry and the flash memory device, and a second interface (e.g. a flash-type interface) for interfacing between the controller and the host device, wherein the second interface is a NAND interface. According to some embodiments, the first interface is an inter-die interface. According to some embodiments, the first interface is a NAND interface. Systems including the presently disclosed NAND controller are also disclosed. Methods for assembling the aforementioned systems, and for reading and writing data using NAND controllers are also disclosed.
    • 公开了一种用于在主机设备和在闪存芯片上制造的闪存设备(例如,NAND闪存设备)之间进行接口的NAND控制器。 在一些实施例中,本公开的NAND控制器包括制造在控制器管芯上的电子电路,控制器管芯与闪存管芯不同,第一接口(例如,主机型接口,例如,NAND接口),用于在 电子电路和闪存设备,以及用于在控制器和主机设备之间进行接口的第二接口(例如,闪存型接口),其中第二接口是NAND接口。 根据一些实施例,第一接口是管芯间接口。 根据一些实施例,第一接口是NAND接口。 还公开了包括当前公开的NAND控制器的系统。 还公开了用于组装上述系统以及用于使用NAND控制器读取和写入数据的方法。
    • 43. 发明授权
    • NAND flash memory controller exporting a NAND interface
    • NAND闪存控制器导出NAND接口
    • US08291295B2
    • 2012-10-16
    • US12539417
    • 2009-08-11
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • G11C29/00
    • G06F12/0246G06F11/1068G06F11/1072G06F2212/7201G11C16/04G11C16/0483
    • A NAND controller for interfacing between a host device and a flash memory device (e.g., a NAND flash memory device) fabricated on a flash die is disclosed. In some embodiments, the presently disclosed NAND controller includes electronic circuitry fabricated on a controller die, the controller die being distinct from the flash die, a first interface (e.g. a host-type interface, for example, a NAND interface) for interfacing between the electronic circuitry and the flash memory device, and a second interface (e.g. a flash-type interface) for interfacing between the controller and the host device, wherein the second interface is a NAND interface. According to some embodiments, the first interface is an inter-die interface. According to some embodiments, the first interface is a NAND interface. Systems including the presently disclosed NAND controller are also disclosed. Methods for assembling the aforementioned systems, and for reading and writing data using NAND controllers are also disclosed.
    • 公开了一种用于在主机设备和在闪存芯片上制造的闪存设备(例如,NAND闪存设备)之间进行接口的NAND控制器。 在一些实施例中,本公开的NAND控制器包括制造在控制器管芯上的电子电路,控制器管芯与闪存管芯不同,第一接口(例如,主机型接口,例如,NAND接口),用于在 电子电路和闪存设备,以及用于在控制器和主机设备之间进行接口的第二接口(例如,闪存型接口),其中第二接口是NAND接口。 根据一些实施例,第一接口是管芯间接口。 根据一些实施例,第一接口是NAND接口。 还公开了包括当前公开的NAND控制器的系统。 还公开了用于组装上述系统以及用于使用NAND控制器读取和写入数据的方法。
    • 45. 发明授权
    • Flash memory cell arrays having dual control gates per memory cell charge storage element
    • 具有每个存储单元电荷存储元件的双控制栅极的闪存单元阵列
    • US07994004B2
    • 2011-08-09
    • US12607444
    • 2009-10-28
    • Eliyahou Harari
    • Eliyahou Harari
    • H01L21/336
    • H01L27/11521G11C16/0483H01L21/28273H01L27/115H01L27/11524H01L29/42348H01L29/66825H01L29/7881
    • A flash NAND type EEPROM system with individual ones of an array of charge storage elements, such as floating gates, being capacitively coupled with at least two control gate lines. The control gate lines are preferably positioned between floating gates to be coupled with sidewalls of floating gates. The memory cell coupling ratio is desirably increased, as a result. Both control gate lines on opposite sides of a selected row of floating gates are usually raised to the same voltage while the second control gate lines coupled to unselected rows of floating gates immediately adjacent and on opposite sides of the selected row are kept low. The control gate lines can also be capacitively coupled with the substrate in order to selectively raise its voltage in the region of selected floating gates. The length of the floating gates and the thicknesses of the control gate lines can be made less than the minimum resolution element of the process by forming an etch mask of spacers.
    • 闪存NAND型EEPROM系统,其具有诸如浮置栅极的电荷存储元件阵列中的各个,与至少两个控制栅极线电容耦合。 控制栅极线优选地位于与浮动栅极的侧壁耦合的浮动栅极之间。 结果,期望地增加存储单元耦合比。 通常将所选行的浮置栅极的相对侧上的两个控制栅极线升高到相同的电压,而与所选行的紧邻和相对侧的未选择的浮动栅极行耦合的第二控制栅极线保持为低。 控制栅极线也可以与衬底电容耦合,以选择性地提高其在所选浮栅的区域中的电压。 通过形成间隔物的蚀刻掩模,可以使浮栅的长度和控制栅极线的厚度小于工艺的最小分辨率元件。
    • 46. 发明授权
    • Methods of making flash memory cell arrays having dual control gates per memory cell charge storage element
    • 制造具有每个存储单元电荷存储元件的双控制栅极的闪存单元阵列的方法
    • US07951669B2
    • 2011-05-31
    • US11279725
    • 2006-04-13
    • Eliyahou HarariGeorge Samachisa
    • Eliyahou HarariGeorge Samachisa
    • H01L21/336
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L29/42336
    • Methods of fabricating a dual control gate non-volatile memory array are described. Parallel strips of floating gate material are formed over the substrate in a first direction but separated from it by a tunnel dielectric. In the gaps between these strips control gate material is formed forming a second set of parallel strips but insulated from both the adjacent floating gate stripes and the substrate. Both sets of strips are isolated in a second direction perpendicular to the first direction forming an array of individual floating gates and control gates. The control gates formed from an individual control gate strip are then interconnected by a conductive wordline such the potential on individual floating gates are controlled by the voltages on two adjacent wordlines. In other variations either the floating gates or the control gates may be recessed into the original substrate.
    • 描述了制造双重控制门非易失性存储器阵列的方法。 平行的浮栅材料条在第一方向上形成在衬底上,但是由隧道电介质分离。 在这些带之间的间隙中,控制栅极材料形成形成第二组平行条带,但与相邻浮栅条和基板两者绝缘。 两组条带在垂直于第一方向的第二方向上被隔离,形成单独的浮动栅极和控制栅极的阵列。 然后,由单独的控制栅极条形成的控制栅极通过导电字线互连,使得各个浮动栅极上的电位由两个相邻字线上的电压控制。 在其他变型中,浮动栅极或控制栅极可以凹入原始衬底。
    • 47. 发明授权
    • Flash memory cell arrays having dual control gates per memory cell charge storage element
    • 具有每个存储单元电荷存储元件的双控制栅极的闪存单元阵列
    • US07638834B2
    • 2009-12-29
    • US11422016
    • 2006-06-02
    • Eliyahou Harari
    • Eliyahou Harari
    • H01L29/76
    • H01L27/11521G11C16/0483H01L21/28273H01L27/115H01L27/11524H01L29/42348H01L29/66825H01L29/7881
    • A flash NAND type EEPROM system with individual ones of an array of charge storage elements, such as floating gates, being capacitively coupled with at least two control gate lines. The control gate lines are preferably positioned between floating gates to be coupled with sidewalls of floating gates. The memory cell coupling ratio is desirably increased, as a result. Both control gate lines on opposite sides of a selected row of floating gates are usually raised to the same voltage while the second control gate lines coupled to unselected rows of floating gates immediately adjacent and on opposite sides of the selected row are kept low. The control gate lines can also be capacitively coupled with the substrate in order to selectively raise its voltage in the region of selected floating gates. The length of the floating gates and the thicknesses of the control gate lines can be made less than the minimum resolution element of the process by forming an etch mask of spacers.
    • 闪存NAND型EEPROM系统,其具有诸如浮置栅极的电荷存储元件阵列中的各个,与至少两个控制栅极线电容耦合。 控制栅极线优选地位于与浮动栅极的侧壁耦合的浮动栅极之间。 结果,期望地增加存储单元耦合比。 通常将所选行的浮置栅极的相对侧上的两个控制栅极线升高到相同的电压,而与所选行的紧邻和相对侧的未选择的浮动栅极行耦合的第二控制栅极线保持为低。 控制栅极线也可以与衬底电容耦合,以选择性地提高其在所选浮栅的区域中的电压。 通过形成间隔物的蚀刻掩模,可以使浮栅的长度和控制栅极线的厚度小于工艺的最小分辨率元件。