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    • 41. 发明授权
    • Pattern shrink methods
    • 图案收缩方法
    • US09448483B2
    • 2016-09-20
    • US14726238
    • 2015-05-29
    • Rohm and Haas Electronic Materials LLCDow Global Technologies LLC
    • Phillip D. HustadJong Keun ParkJin Wuk SungJames Heejun Park
    • H01L21/31G03F7/32G03F7/20G03F7/38G03F7/40H01L21/027
    • G03F7/325G03F7/0397G03F7/20G03F7/38G03F7/40G03F7/405H01L21/0273H01L21/0276
    • Pattern shrink methods comprise: (a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) providing a resist pattern over the one or more layers to be patterned; (c) coating a shrink composition over the pattern, wherein the shrink composition comprises a polymer and an organic solvent, wherein the polymer comprises a group containing a hydrogen acceptor effective to form a bond with an acid group and/or an alcohol group at a surface of the resist pattern, and wherein the composition is free of crosslinkers; and (d) rinsing residual shrink composition from the substrate, leaving a portion of the polymer bonded to the resist pattern. Also provided are pattern shrink compositions, and coated substrates and electronic devices formed by the methods. The invention find particular applicability in the manufacture of semiconductor devices for providing high resolution patterns.
    • 图案收缩方法包括:(a)提供包括一个或多个待图案化层的半导体衬底; (b)在待图案化的一层或多层上提供抗蚀剂图案; (c)在所述图案上涂覆收缩组合物,其中所述收缩组合物包含聚合物和有机溶剂,其中所述聚合物包含含有有效与酸基团和/或醇基键键合的氢受体的基团 抗蚀剂图案的表面,并且其中所述组合物不含交联剂; 和(d)从基材漂洗残余收缩组合物,使一部分聚合物结合到抗蚀剂图案上。 还提供了图案收缩组合物,以及通过该方法形成的涂覆的基材和电子装置。 本发明特别适用于制造用于提供高分辨率图案的半导体器件。