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    • 41. 发明授权
    • Photographic elements containing composite reflective grains
    • 含有复合反射晶粒的摄影元件
    • US5998115A
    • 1999-12-07
    • US292500
    • 1999-04-15
    • Joseph F. BringleyJames A. FridayThomas B. Brust
    • Joseph F. BringleyJames A. FridayThomas B. Brust
    • G03C7/00G03C1/035G03C1/09G03C1/74G03C1/76G03C7/30G03C1/46
    • G03C7/3029G03C7/3022
    • A photographic element is disclosed that relies upon high bromide silver halide grains that are sulfur and/or gold sensitized for latent image formation. Coated to receive exposing radiation directly from a layer containing the latent image forming grains is a non-imaging layer containing (a) tabular silver halide grains (i) comprised of greater than 50 mole percent bromide, based on silver, (ii) having a thickness in the range of from 0.03 to 0.20 .mu.m, and (iii) having an average aspect ratio of greater than 20, and (b) silver halide epitaxy selectively positioned adjacent edges of said tabular grains in said non-imaging layer, said silver halide epitaxy (i) containing greater than 50 mole percent chloride, based on silver, and (ii) accounting for from 0.1 to 50 percent of the total silver in the composite grains.
    • 公开了一种照相材料,其依赖于用于潜像形成的硫和/或金敏化的高溴化银卤化物颗粒。 涂覆以从包含潜像形成颗粒的层直接接收曝光辐射是非成像层,其包含(a)由大于50摩尔百分比的溴化银(基于银)构成的片状卤化银颗粒(i),(ii)具有 厚度在0.03至0.20μm的范围内,和(iii)具有大于20的平均纵横比,以及(b)选择性地定位在所述非成像层中所述片状颗粒的边缘附近的卤化银外延,所述银 卤化物外延(i)含有大于50摩尔百分比的氯化物,以银为基准,和(ii)占复合颗粒中总银的0.1%至50%。
    • 44. 发明授权
    • Forming electrically-conductive patterns using crosslinkable reactive polymers
    • 使用可交联反应性聚合物形成导电图案
    • US09366965B2
    • 2016-06-14
    • US14457396
    • 2014-08-12
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • G03F7/20G03F7/16G03F7/038G03F7/004
    • G03F7/16G03F7/0045G03F7/0046G03F7/038G03F7/0382G03F7/0388G03F7/26
    • An electrically-conductive pattern is prepared using a reactive composition having: (1) a reactive polymer; (2) a compound that provides a cleaving acid upon exposure to radiation; and (3) a crosslinking agent that reacts in the presence of the cleaving acid, to provide crosslinking in the reactive polymer. A polymeric layer of the reactive composition is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising sulfonic acid or sulfonate groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, which pattern is reduced to provide a pattern of corresponding electroless seed metal particles. Electrolessly plating is then carried out in the exposed regions. The unique reactive comprises (a) recurring units represented Structure (A) as described in the disclosure, and can also include other recurring units that are crosslinkable or provide other properties.
    • 使用具有以下物质的反应性组合物制备导电图案:(1)反应性聚合物; (2)暴露于辐射时提供裂解酸的化合物; 和(3)在裂解酸存在下反应以在反应性聚合物中提供交联的交联剂。 将反应性组合物的聚合物层图案地暴露以提供包含非暴露区域的聚合物层和包含包含磺酸或磺酸盐基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电晶种金属离子的图案,该图案被还原以提供相应的无电子种子金属颗粒的图案。 然后在暴露的区域进行无电镀。 独特的反应性包括(a)如本公开所述的结构(A)所示的重复单元,并且还可以包括可交联或提供其它性质的其它重复单元。
    • 45. 发明申请
    • FORMING CONDUCTIVE METAL PATTERNS USING THIOSULFATE COPOLYMERS
    • 使用硫代脂肪族共聚物形成导电金属图案
    • US20160147148A1
    • 2016-05-26
    • US15012959
    • 2016-02-02
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • G03F7/038G03F7/11
    • G03F7/038G03F7/0384G03F7/11G03F7/16G03F7/2002G03F7/40G03F7/405
    • A precursor article has a substrate and a polymeric layer having a reactive composition that contains a non-crosslinked thiosulfate copolymer comprising: (a) recurring units comprising pendant thiosulfate groups, and (b) recurring units comprising pendant carboxy, carboxylate, phospho, phosphonate, phosphate, sulfo, sulfonate, or sulfite groups. The (a) recurring units are present in an amount of 1 to 30 mol %, and the (b) recurring units are present in an amount of 70 to 99 mol %. This precursor article can be used to provide a product article comprising a substrate in which the polymeric layer has both exposed regions and non-exposed regions. The exposed regions contain a pattern of electrolessly plated metal within or deposited on the surface of an at least partially crosslinked polymer that has been derived from the non-crosslinked thiosulfate copolymer. The non-exposed regions have none of the electrolessly plated metal or the non-crosslinked thiosulfate polymer.
    • 前体制品具有底物和具有反应性组合物的聚合物层,其含有非交联硫代硫酸盐共聚物,其包含:(a)包含硫代硫酸盐基团的重复单元,和(b)包含侧羧基,羧酸根,磷酸根,膦酸根, 磷酸盐,磺基,磺酸盐或亚硫酸盐基团。 (a)重复单元的存在量为1〜30摩尔%,(b)重复单元的存在量为70〜99摩尔%。 该前体制品可用于提供包含基材的产品制品,其中聚合物层具有两个暴露区域和非曝光区域。 曝光区域包含在非交联硫代硫酸盐共聚物衍生的至少部分交联的聚合物的表面内或沉积在其表面上的无电镀金属的图案。 未曝光区域不具有无电镀金属或非交联硫代硫酸盐聚合物。
    • 46. 发明授权
    • Forming conductive metal patterns using thiosulfate copolymers
    • 使用硫代硫酸盐共聚物形成导电金属图案
    • US09329482B2
    • 2016-05-03
    • US14249390
    • 2014-04-10
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • G03F7/004G03F7/16G03F7/20G03F7/038
    • G03F7/038G03F7/0384G03F7/11G03F7/16G03F7/2002G03F7/40G03F7/405
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant thiosulfate groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用包含反应性组合物的聚合物层形成导电图案,所述反应性组合物包含金属离子络合,水溶性和可交联的反应性聚合物。 该反应性聚合物包括硫代硫酸根基团以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除,但是聚合物层的暴露区域与无电晶种金属离子接触,然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。
    • 48. 发明申请
    • ELECTROLESS PLATING METHOD USING HALIDE
    • 使用半导体的电镀方法
    • US20150122777A1
    • 2015-05-07
    • US14071993
    • 2013-11-05
    • Mark Edward IrvingThomas B. Brust
    • Mark Edward IrvingThomas B. Brust
    • C23C18/20C23C18/16
    • C23C18/204C23C18/1608C23C18/1612C23C18/1641C23C18/208Y10T428/24802
    • A conductive pattern is formed using a reactive polymer comprising pendant tertiary alkyl ester groups, a compound that provides an acid upon exposure to radiation, and a crosslinking agent. A polymeric layer is patternwise exposed to form first exposed regions with a polymer comprising carboxylic acid groups that are contacted with electroless seed metal ions, and then contacted with a halide to form corresponding electroless seed metal halide. Another exposure converts electroless seed metal halide to electroless seed metal nuclei and forms second exposed regions. A reducing agent is used to develop the electroless seed metal nuclei in the second exposed regions, or to develop the electroless seed metal halide in the first exposed regions. Fixing is used to remove any remaining electroless seed metal halide. The electroless seed metal nuclei are then electrolessly plated in various exposed regions.
    • 导电图案使用包含叔烷基叔酯基团的反应性聚合物,暴露于辐射时提供酸的化合物和交联剂形成。 聚合物层被图案化地暴露以形成第一暴露区域,其中聚合物包含与无电子种子金属离子接触的羧酸基团,然后与卤化物接触以形成相应的无电子种子金属卤化物。 另一种曝光将无电子种子金属卤化物转化为无电子种子金属核并形成第二暴露区域。 还原剂用于在第二暴露区域中开发无电子种子金属核,或者在第一暴露区域中开发无电晶种金属卤化物。 固定用于除去剩余的无电子种子金属卤化物。 然后将无电子种子金属核无电镀在各种暴露区域中。
    • 50. 发明授权
    • Process of conducting epitaxial deposition as a continuation of emulsion
precipitation
    • 导电外延沉积的过程是乳液沉淀的延续
    • US6100019A
    • 2000-08-08
    • US292436
    • 1999-04-15
    • Thomas B. BrustPhilip J. DaleMark R. MisDonald L. Black
    • Thomas B. BrustPhilip J. DaleMark R. MisDonald L. Black
    • G03C1/015G03C1/005G03C1/035G03C1/047
    • G03C1/0051
    • A process is disclosed of conducting in a single reaction vessel selective site high chloride epitaxy deposition as a continuation of host high bromide {1111} tabular grain emulsion precipitation. A host tabular grain emulsion is precipitated accounting for 0.05 to 1.5 moles of silver per liter of dispersing medium. Any iodide at the major faces of the tabular grains is uniformly distributed and any iodide in a surface region of the grains amounts to less than 7 mole, based on silver in the surface region. Until epitaxy is formed, pH is held in the range of 3 to 8. Gelatino-peptizer in an amount of 1 to 40 grams per Ag mole is added to the emulsion. Chloride ion in a range of from 0.03 to 0.15 mole per liter is dispersed in the emulsion. pBr is held in the range of from 3.0 to 3.8 until epitaxy is formed. Iodide ion in a concentration of from 5.times.10.sup.-6 to 1.times.10.sup.-4 mole per square meter of grain surface area is uniformly adsorbed to the major surfaces of the tabular grains.
    • 公开了在单个反应容器选择性位置进行高氯化物外延沉积作为主体高溴酸盐(1111)片状颗粒乳液沉淀的延续的方法。 沉淀出主体片状颗粒乳剂,每升分散介质为0.05至1.5摩尔的银。 在片状颗粒的主面上的任何碘化物均匀分布,并且基于表面区域中的银,颗粒的表面区域中的任何碘化物均小于7摩尔。 直到形成外延,pH值保持在3至8的范围内。每摩尔Ag摩尔量为1至40克的明胶胶溶剂加到乳液中。 在0.03至0.15摩尔/升范围内的氯离子分散在乳液中。 pBr保持在3.0至3.8的范围内,直到形成外延。 浓度为5×10-6至1×10-4摩尔每平方米晶粒表面积的碘离子均匀地吸附到片状颗粒的主表面。