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41. 发明授权

US08020745B2 Solder ball 有权
标题翻译：焊球
公开(公告)号：US08020745B2
公开(公告)日：2011-09-20
申请号：US12620781
申请日：2009-11-18
申请人： Ryo Ota , Takeyuki Itabashi
发明人： Ryo Ota , Takeyuki Itabashi
IPC分类号： B23K35/14 , B23K31/02
CPC分类号： B23K35/22 , B23K35/226 , B23K35/365 , H05K3/3478
摘要： An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.
摘要翻译：本发明的目的是通过防止焊球的微结合和颜色变化来提高球安装工艺中的电子器件的产量，并且通过减少氧化膜来提高焊球的接合可靠性焊球表面。焊球的表面涂布有含有环状结构和脂肪族烃基的有机化合物。

42. 发明申请

US20100171209A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100171209A1
公开(公告)日：2010-07-08
申请号：US12652245
申请日：2010-01-05
申请人： Hisashi Tanie , Takeyuki Itabashi , Nobuhiko Chiwata , Motoki Wakano
发明人： Hisashi Tanie , Takeyuki Itabashi , Nobuhiko Chiwata , Motoki Wakano
IPC分类号： H01L25/065 , H01L21/98 , H01L23/535
CPC分类号： H01L25/50 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/81 , H01L25/0657 , H01L2224/03828 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/0603 , H01L2224/11334 , H01L2224/11901 , H01L2224/13025 , H01L2224/13099 , H01L2224/131 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/81136 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2224/05552
摘要： A semiconductor device having stacked semiconductor chips is provided wherein alignment of even thin semiconductor chips of a large warpage is easy and thus high assembling accuracy and high reliability are ensured. Semiconductor chips having hollow through-silicon via electrodes each formed with a tapered portion are melt-joined using solder balls each having a core of a material higher in melting point than solder. When melt-joining the semiconductor chips, the temperature is raised while imparting an urging load to stacked semiconductor chips, thereby correcting warpage of the semiconductor chips. In each chip-to-chip connection thus formed, if the connection is to prevent the occurrence of stress around the electrode due to the urging load, a solder ball having a core of a smaller diameter than in the other connections is used in the connection.
摘要翻译：提供了具有堆叠半导体芯片的半导体器件，其中易弯曲的大的翘曲的均匀的薄的半导体芯片的对准，从而确保了高的组装精度和高的可靠性。具有各自形成有锥形部分的中空的硅通孔电极的半导体芯片使用具有比焊料熔点高的材料的芯的焊球进行熔融接合。当熔融接合半导体芯片时，温度升高同时对层叠的半导体芯片施加施力载荷，从而校正半导体芯片的翘曲。在如此形成的每个芯片到芯片连接中，如果连接是为了防止由于施加载荷而在电极周围产生应力，则在连接中使用具有直径小于其它连接的芯的焊球。

43. 发明申请

US20100127044A1 SOLDER BALL 有权
标题翻译：焊球
公开(公告)号：US20100127044A1
公开(公告)日：2010-05-27
申请号：US12620781
申请日：2009-11-18
申请人： Ryo Ota , Takeyuki Itabashi
发明人： Ryo Ota , Takeyuki Itabashi
IPC分类号： B23K35/14 , B23K35/22
CPC分类号： B23K35/22 , B23K35/226 , B23K35/365 , H05K3/3478
摘要： An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball.The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.
摘要翻译：本发明的目的是通过防止焊球的微结合和颜色变化来提高球安装工艺中的电子器件的产量，并且通过减少氧化膜来提高焊球的接合可靠性焊球表面。焊球的表面涂布有含有环状结构和脂肪族烃基的有机化合物。

44. 发明授权

US07667343B2 Hydrogen production system using wind turbine generator 失效
标题翻译：使用风力发电机的氢气生产系统
公开(公告)号：US07667343B2
公开(公告)日：2010-02-23
申请号：US11654684
申请日：2007-01-18
申请人： Shinya Oohara , Masaya Ichinose , Motoo Futami , Mitsugu Matsutake , Kazumi Fujii , Kazumasa Ide , Takeyuki Itabashi , Junji Tamura
发明人： Shinya Oohara , Masaya Ichinose , Motoo Futami , Mitsugu Matsutake , Kazumi Fujii , Kazumasa Ide , Takeyuki Itabashi , Junji Tamura
IPC分类号： F03D9/00 , H02P9/00
CPC分类号： H02P9/00 , C25B15/02 , F03D7/0224 , F03D7/0244 , F03D7/026 , F03D7/0272 , F03D7/0276 , F03D7/042 , F03D9/00 , F03D9/25 , F05B2220/61 , F05B2220/7068 , F05B2270/705 , H02P9/08 , H02P2101/15 , Y02E10/723 , Y02E10/725 , Y02E70/10 , Y02P20/133
摘要： A wind turbine-driven hydrogen production system controlling a power converter system such that the wind turbine stays in its operable range for a longer time and thus the hydrogen production system produces hydrogen for a longer time. The wind turbine-driven hydrogen production system varies an amount of electrical current supplied to an electrolytic hydrogen production system according to the rotational speed of the wind turbine to reduce variations in the rotational speed. Furthermore, the pitch angle of the wind turbine varies according to the speed. Thus, variations in the speed of the wind turbine can be reduced. A permanent-magnet generator is used as the electricity generator of the wind turbine to obtain a power supply at start-up. Alternatively, a power storage system used as assistive equipment at start-up is supplementarily added or only a power supply for the controllers is supplied from a system.
摘要翻译：风力涡轮机驱动的氢气生产系统控制功率转换器系统，使得风力涡轮机在较长时间内保持在其可操作范围内，因此氢气生产系统产生较长时间的氢气。风力涡轮机驱动的氢气生产系统根据风力涡轮机的转速改变提供给电解氢生产系统的电流量，以减小转速的变化。此外，风力涡轮机的俯仰角根据速度而变化。因此，可以降低风力涡轮机的速度的变化。永磁发电机用作风力发电机的发电机，以在启动时获得电源。或者，辅助地添加在启动时用作辅助设备的蓄电系统，或者仅从系统提供用于控制器的电源。

45. 发明申请

US20080171216A1 MRI Apparatus With High-Resistance Magnet 有权
标题翻译：具有高电阻磁铁的MRI装置
公开(公告)号：US20080171216A1
公开(公告)日：2008-07-17
申请号：US12050438
申请日：2008-03-18
申请人： Matahiro Komuro , Yuichi Satsu , Takao Imagawa , Katsumi Ishikawa , Takeyuki Itabashi
发明人： Matahiro Komuro , Yuichi Satsu , Takao Imagawa , Katsumi Ishikawa , Takeyuki Itabashi
IPC分类号： H01F1/00
CPC分类号： G01R33/383 , G01R33/3806 , G01R33/3873 , Y10T428/12014
摘要： A magnet which includes ferromagnetic powder to be mainly a mother phase containing iron or cobalt. The ferromagnetic powder is provided with a high-resistance layer which has a resistance higher than or equal to ten times as high as a resistance of the mother phase and a Vickers hardness lower than a Vickers hardness of the mother phase. The high-resistance layer is being formed partially or entirely on the surface of the ferromagnetic powder.
摘要翻译：一种磁铁，其包括主要是含有铁或钴的母相的铁磁性粉末。铁磁粉末设置有高电阻层，其电阻高于或等于母相电阻的十倍，维氏硬度低于母相维氏硬度。高电阻层部分地或完全地形成在铁磁性粉末的表面上。

46. 发明授权

US06989329B2 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections 失效
标题翻译：制造布线基板的方法和用于提供层间连接的化学镀铜溶液
公开(公告)号：US06989329B2
公开(公告)日：2006-01-24
申请号：US10959073
申请日：2004-10-07
申请人： Takeyuki Itabashi , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
发明人： Takeyuki Itabashi , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
IPC分类号： H01L21/44
CPC分类号： C23C18/40 , H05K3/421 , H05K3/422 , H05K3/426 , H05K3/429 , H05K2201/09518
摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline
摘要翻译：通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板层，从而形成布线层。使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

47. 发明申请

US20050079280A1 Electroless copper plating solution, electroless copper plating process and production process of circuit board 失效
标题翻译：化学镀铜液，化学镀铜工艺及电路板生产工艺
公开(公告)号：US20050079280A1
公开(公告)日：2005-04-14
申请号：US10898282
申请日：2004-07-26
申请人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
发明人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
IPC分类号： C23C18/40 , C23C28/02 , C25D7/00 , H05K3/18 , C23C16/00
CPC分类号： C23C18/1803 , C23C18/1653 , C23C18/40
摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.
摘要翻译：使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以长时间稳定使用。无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种，为0.0001mol / L以上。

48. 发明授权

US06805915B2 Electroless copper plating solution, electroless copper plating process and production process of circuit board 失效
标题翻译：化学镀铜液，化学镀铜工艺及电路板生产工艺
公开(公告)号：US06805915B2
公开(公告)日：2004-10-19
申请号：US10076536
申请日：2002-02-19
申请人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
发明人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
IPC分类号： B05D118
CPC分类号： C23C18/1803 , C23C18/1653 , C23C18/40
摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.
摘要翻译：使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以长时间稳定使用。无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种，为0.0001mol / L以上。

49. 发明授权

US06495769B1 Wiring board and production method thereof, and semiconductor apparatus 失效
标题翻译：接线板及其制造方法以及半导体装置
公开(公告)号：US06495769B1
公开(公告)日：2002-12-17
申请号：US09536645
申请日：2000-03-28
申请人： Toshiro Saito , Haruo Akahoshi , Takeyuki Itabashi
发明人： Toshiro Saito , Haruo Akahoshi , Takeyuki Itabashi
IPC分类号： H05K103
CPC分类号： H01L21/4846 , H01L2224/16225 , H01L2924/00014 , H05K3/381 , H05K3/389 , H05K3/4623 , H05K3/4661 , H05K2201/0344 , H05K2203/0315 , H05K2203/0793 , H05K2203/095 , Y10T29/49126 , H01L2224/0401
摘要： Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.
摘要翻译：本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比铜。退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。铜可以通过包括无电镀的工艺形成。绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

50. 发明授权

US5595943A Method for formation of conductor using electroless plating 失效
标题翻译：使用化学镀形成导体的方法
公开(公告)号：US5595943A
公开(公告)日：1997-01-21
申请号：US495021
申请日：1995-06-27
申请人： Takeyuki Itabashi , Haruo Akahoshi , Akio Takahashi
发明人： Takeyuki Itabashi , Haruo Akahoshi , Akio Takahashi
IPC分类号： C23C18/36 , C23C18/40 , H01L21/288 , H01L21/768 , H05K3/18 , H01L21/28
CPC分类号： C23C18/36 , C23C18/405 , H01L21/288 , H01L21/76877 , H05K3/184
摘要： A method for forming a conductor circuit is provided which comprises depositing and filling a conductor metal in recessions of insulator in the form of grooves or holes using an electroless plating solution, the conductor metal being deposited and filled in the recession to the same level as the surface of the insulator, wherein said electroless plating solution contains an inhibitor which inhibits the cathodic partial reaction which is a metal deposition reaction and the electroless plating is carried out with stirring the plating solution. Since the plating reaction automatically stops when the metal conductor 1 is formed up to the level of the surface of the insulator 2, a conductor circuit in which the surface of the metal conductor 1 and that of the insulator 2 are even and at the same level can be easily obtained. Furthermore, since the conductor circuits differing in thickness can be simultaneously formed on one substrate, the number of lamination in making multilayer circuit can be reduced and a multilayer circuit board of low electric resistance can be obtained.
摘要翻译：提供一种用于形成导体电路的方法，其包括使用化学镀溶液沉积并填充凹槽或孔形式的绝缘体凹陷中的导体金属，将导体金属沉积并填充在与经济衰退相同的水平上表面，其中所述化学镀溶液含有抑制作为金属沉积反应的阴极部分反应的抑制剂，并且通过搅拌电镀液进行化学镀。由于当金属导体1形成到绝缘体2的表面的高度时，电镀反应自动停止，其中金属导体1的表面和绝缘体2的表面均匀并处于相同水平的导体电路可以很容易地获得。此外，由于可以在一个基板上同时形成厚度不同的导体电路，因此可以减少制造多层电路中的层压次数，并且可以获得低电阻的多层电路板。

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