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    • 43. 发明专利
    • COMPOSITE SEMICONDUCTOR SUBSTRATE
    • JPH038315A
    • 1991-01-16
    • JP14226689
    • 1989-06-06
    • ASAHI GLASS CO LTD
    • ASARI GOROIRISAWA NAOSHINAKAHARA KATSUMASA
    • H01L21/02
    • PURPOSE:To obtain a substrate for electric power which is superior in thermal characteristics by control the thermal expansion coefficient of the substrate so that its coefficient is matched with that of an intended semiconductor. CONSTITUTION:Junction between two different substrates 4 and 6 of AlN and Si is performed through an intermediate layer 5. In such a case, the thermal expansion coefficient of the substrate 4 is regulated so that its coefficient becomes equal to that of the substrate 6. When the other GaAs layer is allowed to perform an epitaxial growth for LEDs, FETs and the like on a composite semiconductor substrate, the thermal expansion coefficient of the substrate 4 is equalized to that of GaAs and when a semiconductor element and the like are formed directly on the substrate 6, each thermal expansion coefficient is adjusted to that of Si. Further, the junction surface of the substrate 4, the thermal expansion coefficient of which is adjusted in advance to intended value, is ground to have an exceedingly flat surface and is finished to obtain a mirror surface. After depositing an SiO2 layer 5 on the above surface, the substrate 6 is put on top of the preceding surface by applying a pressure on the substrate 6 which is finished in the same manner and then, its substrate is treated with heat. The substrate 6 is thus bonded firmly onto the substrate 4.