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41. 发明授权

US09093757B2 Antenna 有权
标题翻译：天线
公开(公告)号：US09093757B2
公开(公告)日：2015-07-28
申请号：US13819711
申请日：2011-08-30
申请人： Yutaka Aoki , Akira Saitou , Kazuhiko Honjo
发明人： Yutaka Aoki , Akira Saitou , Kazuhiko Honjo
IPC分类号： H01Q21/26 , H01Q21/06 , H01Q21/24 , H01Q9/28 , H01Q21/00 , H01Q5/321
CPC分类号： H01Q21/06 , H01Q5/321 , H01Q9/285 , H01Q21/0006 , H01Q21/24 , H01Q21/26
摘要： A multi-frequency circularly polarized antenna (100) comprises a substrate and multi-frequency antennas (900, 901). The multi-frequency antennas (900, 901) comprise antenna elements (120, 220, 30, 420), shunt-inductor conductors (170, 270, 370, 470), series-capacitor conductors (160a, 160b, 260a, 260b, 360a, 360b, 460a, 460b), series-inductor capacitors (140, 240, 340, 440), a center point (199) and input/output terminals (1q0, 210, 310, 410). The multi-frequency circularly polarized antenna (100) is constructed by connecting the shunt-inductor conductors (170, 270, 370, 470) of the multi-frequency antennas (900, 901) at the center point (199) in a substantially perpendicular manner.
摘要翻译：多频圆极化天线（100）包括衬底和多频天线（900,901）。多频天线（900,901）包括天线元件（120,220,30,420），分流电感器导体（170,270,370,470），串联电容器导体（160a，160b，260a，260b， 360a，360b，460a，460b），串联电感器电容器（140,240,340,440），中心点（199）和输入/输出端子（1q0,210,310,410）。多频圆极化天线（100）通过将中心点（199）处的多频天线（900,901）的分流电感器导体（170,270,370,470）以基本垂直的方式连接方式。

42. 发明授权

US08148456B2 Conductive resin composition and conductive sheets comprising the same 有权
标题翻译：导电树脂组合物和包含该导电树脂组合物的导电片
公开(公告)号：US08148456B2
公开(公告)日：2012-04-03
申请号：US12304785
申请日：2007-08-10
申请人： Yutaka Aoki , Takeshi Miyakawa
发明人： Yutaka Aoki , Takeshi Miyakawa
IPC分类号： C08K3/04
CPC分类号： B32B27/08 , B32B27/18 , B32B27/20 , B32B27/302 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/365 , B32B2264/108 , B32B2270/00 , B32B2307/202 , B32B2307/50 , B32B2307/54 , B32B2307/554 , B32B2307/5825 , B32B2307/734 , B32B2439/00 , B32B2553/00 , C08K3/04 , C08L23/02 , C08L25/04 , C08L55/02 , C08L67/02 , C08L69/00 , H01B1/24 , Y10T428/1334 , Y10T428/1352 , Y10T428/24612 , Y10T428/31507 , C08L2666/02 , C08L2666/06 , C08L2666/24
摘要： To provide an electrically conductive resin composition with which contamination of an electronic component resulting from abrasion of an electrically conductive sheet by friction with the electronic component is small, and which is excellent in sealing properties with a cover tape.An electrically conductive resin composition comprising 100 parts by mass of a thermoplastic resin containing from 60 to 97 mass % of a polycarbonate resin and from 3 to 40 mass % of at least one hydrocarbon copolymer selected from the group consisting of an olefin copolymer and a styrene copolymer, and from 5 to 50 parts by mass of carbon black, and an electrically conductive sheet comprising the electrically conductive resin composition. Further, an electrically conductive sheet, comprising a substrate layer containing at least one thermoplastic resin selected from the group consisting of an acrylonitrile/butadiene/styrene copolymer (ABS) resin, a polycarbonate resin and a polyalkylene terephthalate resin, and a layer of the above electrically conductive resin composition formed on one side or both sides of the substrate layer.
摘要翻译：为了提供导电性树脂组合物，通过与电子部件的摩擦而导致的导电性片材的磨损而导致的电子部件的污染小，并且与盖带的密封性优异。一种导电性树脂组合物，其包含100质量份含有60〜97质量％的聚碳酸酯树脂的热塑性树脂和3〜40质量％的选自烯烃共聚物和苯乙烯的至少一种烃共聚物共聚物和5〜50质量份炭黑，以及包含该导电性树脂组合物的导电片。此外，导电片包括含有选自丙烯腈/丁二烯/苯乙烯共聚物（ABS）树脂，聚碳酸酯树脂和聚对苯二甲酸亚烷基二醇酯树脂中的至少一种热塑性树脂的基材层和上述层导电树脂组合物形成在基底层的一侧或两侧。

43. 发明授权

US08110882B2 Semiconductor device with magnetic powder mixed therein and manufacturing method thereof 有权
标题翻译：混有磁粉的半导体装置及其制造方法
公开(公告)号：US08110882B2
公开(公告)日：2012-02-07
申请号：US12069689
申请日：2008-02-12
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01L29/82
CPC分类号： H01L23/645 , H01L23/3114 , H01L23/5227 , H01L23/525 , H01L23/552 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/94 , H01L2224/0401 , H01L2224/16 , H01L2224/94 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01046 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/14 , H01L2924/19015 , H01L2224/03
摘要： A semiconductor device includes a semiconductor substrate on one side of which an integrated circuit and a plurality of connection pads connected to the integrated circuit are provided. An insulating film is provided on the plurality of connection pads except for parts of the connection pads and on the one side of the semiconductor substrate. A plurality of wiring lines are provided to be electrically connected to the integrated circuit via the connection pads, each of the wiring lines having a connection pad portion. A plurality of columnar electrodes are respectively provided on one side of the connection pad portions of the wiring lines. A sealing film is provide on the peripheries of the columnar electrodes to cover the integrated circuit and which is provided. At least one of the insulating film and the sealing film is formed of a resin in which magnetic powder is mixed.
摘要翻译：半导体器件包括半导体衬底，其一侧上设有集成电路和连接到集成电路的多个连接焊盘。绝缘膜设置在多个连接焊盘上，除了部分连接焊盘和半导体衬底的一侧。多条布线被设置成经由连接焊盘与集成电路电连接，每条布线具有连接焊盘部分。多个柱状电极分别设置在布线的连接焊盘部分的一侧上。在柱状电极的周边上提供密封膜以覆盖集成电路并提供。绝缘膜和密封膜中的至少一个由混合磁性粉末的树脂形成。

44. 发明授权

US07449772B2 Chip-type electronic component including thin-film circuit elements 有权
标题翻译：片式电子元件包括薄膜电路元件
公开(公告)号：US07449772B2
公开(公告)日：2008-11-11
申请号：US11804160
申请日：2007-05-17
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01L23/52 , H01L23/48 , H01L23/04 , H01L23/053
CPC分类号： H01L27/016 , H01L23/3114 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A chip-type electronic component includes a substrate, a common potential layer formed on an upper side of the substrate, an insulating film formed on the common potential layer, and provided to expose at least part of the common potential layer. At least one common potential electrode is provided on the exposed part of the common potential layer, and a plurality of conductors provided on the insulating film, each of the conductors forming a part of a thin-film circuit element. At least one columnar electrode is electrically connected to at least one of the conductors, and a sealing film is formed around the columnar electrode.
摘要翻译：芯片型电子部件包括基板，形成在基板的上侧的公共电位层，形成在公共电位层上的绝缘膜，用于露出共同电位层的至少一部分。在公共电位层的暴露部分上设置至少一个公共电位电极，以及设置在绝缘膜上的多个导体，每个导体形成薄膜电路元件的一部分。至少一个柱状电极与至少一个导体电连接，并且在柱状电极周围形成密封膜。

45. 发明授权

US07003301B2 Communication system, communication method and mobile terminal 有权
公开(公告)号：US07003301B2
公开(公告)日：2006-02-21
申请号：US09953429
申请日：2001-09-17
申请人： Manabu Sawada , Masahiro Kuwabara , Yutaka Aoki , Minoru Okada , Hiroshi Harada , Masayuki Fujise
发明人： Manabu Sawada , Masahiro Kuwabara , Yutaka Aoki , Minoru Okada , Hiroshi Harada , Masayuki Fujise
IPC分类号： H04Q7/20 , H04B7/26
CPC分类号： H04W16/32
摘要： A Micro-cell is formed to include a plurality of spot-cells. Communication is executed between a micro-cell base station and a mobile terminal in the micro-cell, and between a spot-cell base station and the mobile terminal in the spot cell. The micro-cell base station and spot-cell base stations are connected to an integrated base station. A signal transmitted to the micro-cell base station from the mobile terminal is transferred to the integrated base station and information transmitted to the mobile terminal is transferred to the micro-cell base station and/or spot-cell base station from the integrated base station. The respective integrated base stations are connected to a server via a dedicated backbone to enable a large-capacity transmission.

46. 发明授权

US06996411B2 Wireless communication terminal 失效
公开(公告)号：US06996411B2
公开(公告)日：2006-02-07
申请号：US10280984
申请日：2002-10-25
申请人： Syoichi Urata , Yutaka Aoki , Hiroyuki Kadosono , Shinji Kuriyama , Toshitsugu Kobayashi , Kouji Sakata , Hidefumi Takaoka , Ryoko Tamura , Tadashi Nakano , Masaki Bansho
发明人： Syoichi Urata , Yutaka Aoki , Hiroyuki Kadosono , Shinji Kuriyama , Toshitsugu Kobayashi , Kouji Sakata , Hidefumi Takaoka , Ryoko Tamura , Tadashi Nakano , Masaki Bansho
IPC分类号： H04B7/00 , H04Q7/20
CPC分类号： H04M3/568 , H04M1/72513 , H04M3/56 , H04M2203/5018 , H04W88/02
摘要： A wireless communication terminal including a wireless communication unit for receiving and transmitting voice signals between terminals connected through a voice channel and a data channel, a signal input/output unit for inputting and outputting voice signals for voice communication and a mixing unit, interposed between the wireless communication unit and signal input/output unit, for performing mixing operations to create a first mixed signal to be output to said signal input/output unit and second mixed signals each to be transmitted to the corresponding terminal. The wireless communication terminal is preferably used for wireless voice communication performed by three or more terminals without being interposed by a center apparatus (such as a server) or a repeater. Further, signal-receiving/transmitting is set for each wireless communication terminal whereupon convenience can be improved.

47. 发明授权

US06690376B1 Storage medium for storing animation data, image processing method using same, and storage medium storing image processing programs 失效
标题翻译：用于存储动画数据的存储介质，使用其的图像处理方法以及存储图像处理程序的存储介质
公开(公告)号：US06690376B1
公开(公告)日：2004-02-10
申请号：US09661033
申请日：2000-09-13
申请人： Tomoaki Saito , Kazuyoshi Hara , Hideki Kudo , Yutaka Aoki , Takashi Ando , Atsushi Seimiya , Kenei Unoki
发明人： Tomoaki Saito , Kazuyoshi Hara , Hideki Kudo , Yutaka Aoki , Takashi Ando , Atsushi Seimiya , Kenei Unoki
IPC分类号： G06T1700
CPC分类号： A63F13/52 , A63F13/10 , A63F2300/66 , G06T13/80
摘要： A storage medium for a game relating to the present invention contains: (1) a game program for calling up drawing functions for prescribed scenes in accordance with the progress of the game; (2) animation data including sprite data forming two-dimensional still images, and motion data capable of generating animations by causing the sprites to change with each frame; and (3) a drawing program for generating rendering data (drawing commands) positions, colours, texture co-ordinates, and the like, for each sprite in a frame (display screen), according to the animation data specified by the drawing function. In general terms, animation data is data capable of generating moving images (animations) of characters as intended by a designer, and this animation data can be developed separately from the game program. Moreover, a drawing program is a generic drawing library capable of interpreting the animation data and generating rendering data, including position data for each sprite in a frame, for each respective frame. A game program simply calls up a drawing function (library function) which specifies animation data so as to be capable of causing the drawing library to interpret the specified animation data and generate rendering data accordingly.
摘要翻译：本发明的游戏用存储媒体包含：（1）游戏程序，用于根据游戏的进度调出规定场景的绘图功能; （2）包括形成二维静止图像的子画面数据的动画数据以及能够通过使每个画面改变精灵而产生动画的运动数据; 以及（3）根据由绘图功能指定的动画数据，针对帧（显示画面）中的每个子画面生成绘制数据（绘制命令）位置，颜色，纹理坐标等的绘图程序。一般来说，动画数据是能够根据设计者的意图生成字符的运动图像（动画）的数据，并且该动画数据可以与游戏程序分开开发。此外，绘图程序是能够解释动画数据并生成渲染数据的通用绘图库，包括针对每个相应帧的帧中的每个子画面的位置数据。一个游戏程序只需调用一个绘制函数（库函数），该函数指定动画数据，以便能够使绘图库解释指定的动画数据并相应地生成渲染数据。

48. 发明授权

US06639299B2 Semiconductor device having a chip size package including a passive element 有权
标题翻译：具有包括无源元件的芯片尺寸封装的半导体器件
公开(公告)号：US06639299B2
公开(公告)日：2003-10-28
申请号：US10118403
申请日：2002-04-08
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01L2900
CPC分类号： H01L24/17 , H01L21/56 , H01L23/3114 , H01L23/5222 , H01L23/5227 , H01L24/14 , H01L2223/6677 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05571 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1423 , H01L2924/30107 , Y10S438/957 , H01L2224/05647 , H01L2924/00014 , H01L2224/05666 , H01L2224/05124
摘要： A semiconductor device includes a semiconductor substrate on which a circuit element forming region and a plurality of connection pads are formed, a first columnar electrode which is formed on a first connection pad so as to be electrically connected to the first connection pad, a first conductive layer which is formed on a second connection pad so as to be electrically connected to the second connection pad, an encapsulating film which is formed at least around the first columnar electrode, on the semiconductor substrate and on the first conductive layer, and a second conductive layer which is formed on the encapsulating film so as to face the first conductive layer. A passive element is formed from the first and second conductive layers.
摘要翻译：一种半导体器件包括其上形成有电路元件形成区域和多个连接焊盘的半导体衬底，形成在第一连接焊盘上以与第一连接焊盘电连接的第一柱状电极，第一导电层，其形成在第二连接焊盘上，以便电连接到第二连接焊盘，形成在至少围绕第一柱状电极的半导体衬底上和第一导电层上的封装膜，以及第二导电层层，其形成在封装膜上以面对第一导电层。无源元件由第一和第二导电层形成。

49. 发明授权

US06501169B1 Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise 有权
标题翻译：半导体装置，其防止在电路元件形成区域中产生的噪声的泄漏并且防止外部电磁噪声
公开(公告)号：US06501169B1
公开(公告)日：2002-12-31
申请号：US09708379
申请日：2000-11-08
申请人： Yutaka Aoki , Hiroshi Takenaka , Ichiro Mihara
发明人： Yutaka Aoki , Hiroshi Takenaka , Ichiro Mihara
IPC分类号： H01L2312
CPC分类号： H01L21/76885 , H01L23/5225 , H01L23/552 , H01L23/585 , H01L23/66 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05569 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2924/013
摘要： A semiconductor device of a CSP structure is obtained by forming projection electrodes on a plurality of circuit element forming areas of a semiconductor wafer substrate, and then dividing the wafer into chips. Wiring patterns connected to connection pads for signal transmission are provided on the upper surface of an insulating film formed on the circuit element forming areas, and a conductive layer connected to a connection pad connected to a ground potential is provided on the resultant structure except for on the wiring patterns and on areas near the wiring patterns. Further, a thin film circuit element may be provided at the same layer as the conductive layer or below the conductive layer.
摘要翻译：通过在半导体晶片基板的多个电路元件形成区域上形成投影电极，然后将晶片分割成芯片来获得CSP结构的半导体器件。在形成在电路元件形成区域上的绝缘膜的上表面上设置有连接到信号传输用连接焊盘的布线图案，并且，在除了在布线图案和布线图案附近的区域。此外，薄膜电路元件可以设置在与导电层相同的层或者在导电层的下方。

50. 发明授权

US06153921A Diode device 有权
标题翻译：二极管器件
公开(公告)号：US06153921A
公开(公告)日：2000-11-28
申请号：US434283
申请日：1999-11-05
申请人： Yutaka Aoki , Takashi Ishikawa , Haruhiko Taguchi , Takeshi Kasahara
发明人： Yutaka Aoki , Takashi Ishikawa , Haruhiko Taguchi , Takeshi Kasahara
IPC分类号： H01L21/60 , H01L29/861 , H01L29/93 , H01L31/02 , H01L31/0224 , H01L31/105 , H01L31/075
CPC分类号： H01L31/02005 , H01L24/05 , H01L24/06 , H01L31/022408 , H01L31/105 , H01L2224/04042 , H01L2224/05 , H01L2224/0603 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12034 , H01L2924/12036 , H01L2924/12042 , H01L2924/14
摘要： Disclosed is a diode device in which two electrodes of regions forming both terminals are provided on the same face, thereby enabling the device to be connected to a circuit substrate by face-down bonding. Since a region is located within the semiconductor base, an electrode cannot be connected at the top face thereof; to overcome this, a groove is provided extending in a perpendicular direction from the top face of the semiconductor base to the region, and an electrode is provided in the groove. Then, the electrode in the groove is exposed at the top face, enabling the electrodes of both regions to be connected at the top face.
摘要翻译：公开了一种二极管器件，其中形成两个端子的区域的两个电极设置在同一个面上，从而使得器件能够通过面朝下的接合连接到电路衬底。由于区域位于半导体基底内，电极不能在其顶面连接; 为了克服这一点，提供了从半导体基底的顶面到该区域在垂直方向上延伸的凹槽，并且在凹槽中设置电极。然后，凹槽中的电极在顶面露出，使得两个区域的电极能够在顶面连接。

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