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    • 41. 发明申请
    • ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE
    • 阵列基板和制造阵列基板的方法
    • US20130015452A1
    • 2013-01-17
    • US13616150
    • 2012-09-14
    • Shin-Il CHOISang-Gab KIMYu-Gwang JEONGHong-Kee CHIN
    • Shin-Il CHOISang-Gab KIMYu-Gwang JEONGHong-Kee CHIN
    • H01L27/12
    • H01L27/124H01L27/1214H01L27/1288H01L29/42384H01L29/78696
    • An array substrate including: a gate electrode and a gate insulation layer disposed on a base substrate, the gate insulation layer having a first thickness in a first region and a second thickness in a second region, the first thickness being greater than the second thickness; a semiconductor pattern disposed on the gate insulation layer in the first region, an end portion of the semiconductor pattern having a stepped portion with respect to the gate insulation layer; an ohmic contact pattern disposed on the semiconductor pattern, an end portion of the ohmic contact pattern opposite to a channel portion being aligned with the end portion of the semiconductor pattern; and source and drain electrodes disposed on the ohmic contact pattern, the source and drain electrodes spaced apart from each other and including first and second thin-film transistor patterns.
    • 一种阵列基板,包括:栅极电极和栅极绝缘层,其设置在基底基板上,所述栅极绝缘层在第一区域具有第一厚度,在第二区域具有第二厚度,所述第一厚度大于所述第二厚度; 所述半导体图案设置在所述第一区域中的所述栅极绝缘层上,所述半导体图案的端部相对于所述栅极绝缘层具有阶梯部分; 设置在所述半导体图案上的欧姆接触图案,所述欧姆接触图案的与沟道部分相对的端部与所述半导体图案的端部对准; 以及设置在欧姆接触图案上的源极和漏极,源极和漏极彼此间隔开并且包括第一和第二薄膜晶体管图案。
    • 47. 发明申请
    • ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE
    • 阵列基板和制造阵列基板的方法
    • US20100308334A1
    • 2010-12-09
    • US12777347
    • 2010-05-11
    • Shin-Il CHOISang-Gab KIMYu-Gwang JEONGHong-Kee CHIN
    • Shin-Il CHOISang-Gab KIMYu-Gwang JEONGHong-Kee CHIN
    • H01L33/16H01L21/336
    • H01L27/124H01L27/1214H01L27/1288H01L29/42384H01L29/78696
    • An array substrate including: a gate electrode and a gate insulation layer disposed on a base substrate, the gate insulation layer having a first thickness in a first region and a second thickness in a second region, the first thickness being greater than the second thickness; a semiconductor pattern disposed on the gate insulation layer in the first region, an end portion of the semiconductor pattern having a stepped portion with respect to the gate insulation layer; an ohmic contact pattern disposed on the semiconductor pattern, an end portion of the ohmic contact pattern opposite to a channel portion being aligned with the end portion of the semiconductor pattern; and source and drain electrodes disposed on the ohmic contact pattern, the source and drain electrodes spaced apart from each other and including first and second thin-film transistor patterns.
    • 一种阵列基板,包括:栅极电极和栅极绝缘层,其设置在基底基板上,所述栅极绝缘层在第一区域具有第一厚度,在第二区域具有第二厚度,所述第一厚度大于所述第二厚度; 所述半导体图案设置在所述第一区域中的所述栅极绝缘层上,所述半导体图案的端部相对于所述栅极绝缘层具有阶梯部分; 设置在所述半导体图案上的欧姆接触图案,所述欧姆接触图案的与沟道部分相对的端部与所述半导体图案的端部对准; 以及设置在欧姆接触图案上的源极和漏极,源极和漏极彼此间隔开并且包括第一和第二薄膜晶体管图案。
    • 50. 发明申请
    • METHOD OF PRODUCING THIN FILM TRANSISTOR SUBSTRATE
    • 生产薄膜晶体管基板的方法
    • US20080093334A1
    • 2008-04-24
    • US11874098
    • 2007-10-17
    • Seung-ha ChoiSang-gab KimMin-seok OhShin-il ChoiDae-ok KimHong-kee ChinYoung-ho JeongYu-gwang Jeong
    • Seung-ha ChoiSang-gab KimMin-seok OhShin-il ChoiDae-ok KimHong-kee ChinYoung-ho JeongYu-gwang Jeong
    • H01B13/00
    • H01L27/1288H01L27/1214
    • A method of producing a thin film transistor substrate to prevent an interconnection from being corroded during a dry etching process includes sequentially forming on an insulating substrate a gate interconnection, a gate insulating layer, an active layer, a conductive layer for a data interconnection, and a photoresist pattern including a first region and a second region, etching the conductive layer for the data interconnection using the photoresist pattern as an etching mask to form a conductive layer pattern for source/drain electrodes, etching the active layer using the photoresist pattern as the etching mask to form an active layer pattern, removing the second region of the photoresist pattern, dry etching the conductive layer pattern for the source/drain electrodes under the second region using the photoresist pattern as the etching mask and etching gas, etching a portion of the active layer pattern using the photoresist pattern as the etching mask, and physically removing the reaction byproduct using a reaction byproduct removal agent so that external force is applied to the etching gas and the reaction byproduct of the conductive layer pattern for the source/drain electrodes.
    • 制造薄膜晶体管基板以防止在干法蚀刻工艺中被互连的腐蚀的方法包括:在绝缘基板上依次形成栅极互连,栅极绝缘层,有源层,用于数据互连的导电层,以及 包括第一区域和第二区域的光致抗蚀剂图案,使用光致抗蚀剂图案蚀刻用于数据互连的导电层作为蚀刻掩模,以形成用于源/漏电极的导电层图案,使用光致抗蚀剂图案蚀刻活性层作为 蚀刻掩模以形成有源层图案,去除光致抗蚀剂图案的第二区域,使用光致抗蚀剂图案作为蚀刻掩模和蚀刻气体,在第二区域下干蚀刻用于源/漏电极的导电层图案,蚀刻部分 使用光致抗蚀剂图案作为蚀刻掩模的有源层图案,并物理去除r 使用反应副产物除去剂的副产物使得外力施加到蚀刻气体和用于源/漏电极的导电层图案的反应副产物。