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41. 发明申请

WO2002096992A2 SILICONE RUBBER COMPOSITION 审中-公开
标题翻译：硅橡胶组合物
公开(公告)号：WO2002096992A2
公开(公告)日：2002-12-05
申请号：PCT/JP2002/005244
申请日：2002-05-29
申请人： DOW CORNING TORAY SILICONE CO.,LTD. , OTA, Kenji , HONMA, Hiroshi
发明人： OTA, Kenji , HONMA, Hiroshi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , B60S2001/3829 , B60S2001/3898 , C08G77/12 , C08G77/70 , C08L83/00
摘要： To provide a silicone rubber composition for wiper blades, which, due excellent moldability and ability to closely repeat the shape of the die during extrusion, is suitable for forming wiper blades of complicated shapes; to provide a method of manufacturing the aforementioned composition. A silicone rubber composition for a wiper blade comprising (A), a polydiorganosiloxane, (B) a finely divided, reinforcing silica filler, (C) orthoboric acid or metaboric acid, (D) a powdered calcium carbonate, (E) an organic peroxide curing agent, and an additive for improving water-repellent properties of a wiper blade made from said composition, comprising one or both of (F) a polyorganosiloxane having a viscosity of 1 to 10000 mPa*s and containing in one molecule at least two silicon-bonded hydrogen atoms and (G) a polydiorganosiloxane having a viscosity of 1 to 10000 mPa*s; a method of manufacturing the aforementioned composition.
摘要翻译：为了提供一种用于刮水片的硅橡胶组合物，其适合于形成复杂形状的刮水片，由此具有优异的成型性和在挤出过程中密切重复模具形状的能力，以提供制造上述组合物的方法。一种刮水片用硅橡胶组合物，其包含（A），聚二有机硅氧烷，（B）细碎的增强二氧化硅填料，（C）原硼酸或偏硼酸，（D）粉末碳酸钙，（E）有机过氧化物固化剂和用于改善由所述组合物制成的刮水片的防水性的添加剂，其包含（F）粘度为1〜10000mPa·s的聚有机硅氧烷中的一种或两种，并且在一分子中含有至少两个硅键合的氢原子和（G）粘度为1〜10000mPa·s的聚二有机硅氧烷; 制造上述组合物的方法。

42. 发明申请

WO2002088253A1 POLYORGANOSILOXANE EMULSION COMPOSITION AND A COSMETIC MATERIAL MADE THEREFROM 审中-公开
标题翻译：聚硅氧烷乳液组合物及其制备的化妆品
公开(公告)号：WO2002088253A1
公开(公告)日：2002-11-07
申请号：PCT/JP2002/004182
申请日：2002-04-25
申请人： DOW CORNING TORAY SILICONE CO., LTD. , HAMACHI, Tadashi , OZAKI, Masaru , TANAKA, Hidefumi
发明人： HAMACHI, Tadashi , OZAKI, Masaru , TANAKA, Hidefumi
IPC分类号： C08L83/04
CPC分类号： A61K8/466 , A61K8/06 , A61K8/891 , A61Q5/00 , A61Q5/006 , A61Q5/02 , A61Q5/06 , A61Q5/10 , A61Q5/12 , A61Q7/00 , A61Q19/00 , C08G77/06 , C08J3/03 , C08J2383/04 , C08L83/06 , C08L83/00
摘要： A polyorganosiloxane emulsion composition characterized by comprising (A) a polyorganosiloxane, (B) an N-acylalkyl taurine and/or a salt thereof, and (C) water, the content of cyclic organosiloxane oligomers in said component (A) being within 3.5 wt.%, and a cosmetic raw material characterized by consisting of said polyorganosiloxane emulsion composition. The emulsion composition is characterized by superior cosmetic functionality in terms of moisture and smoothness.
摘要翻译：一种聚有机硅氧烷乳液组合物，其特征在于包含（A）聚有机硅氧烷，（B）N-酰基烷基牛磺酸和/或其盐和（C）水，所述组分（A）中的环状有机硅氧烷低聚物的含量为3.5重量％％，以及由所述聚有机硅氧烷乳液组合物组成的化妆品原料。乳液组合物的特征在于在水分和光滑度方面具有优异的美容功能。

43. 发明申请

WO1984002036A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：WO1984002036A1
公开(公告)日：1984-05-24
申请号：PCT/JP1983000405
申请日：1983-11-10
申请人： TORAY SILICONE CO., LTD. , MINE, Katsutoshi , MORITA, Yoshitsugu , MIYAMAE, Satoshi
发明人： TORAY SILICONE CO., LTD.
IPC分类号： H01L23/30
CPC分类号： H01L23/057 , H01L23/3135 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01092 , H01L2924/014 , H01L2924/12036 , H01L2924/1301 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device (1) in which a heat-bondable cured silicone (7) is applied and heat-bonded to the surface of only a predetermined principal portion of the semiconductor device so as not to contact bonding wires (3), flip chip solder portions (8) or beam leads, in order to protect the surface of the principal portion, and a seal layer (6) or (10) is provided after the heat bonding of the cured silicone. The cured silicone (7) is preferably in the form of a film, and a heat-resistant base material (12) may be laminated to one side of the cured silicone. Breaking of bonding wires (3), cracking of solder portions (8) and separation of beam leads do not occur because only the portion to be protected can be protected by coating with the cured silicone (7) and the portion not to be protected is not so coated. Moreover, sisnce there is no contamination caused by a silicone exhalation, the occurrence of a defective bonding and the separation of a sealing resin can be prevented. The seal layers (6 ) and (10) are each constituted by a hermetic seal or a resin seal.
摘要翻译：一种半导体器件（1），其中加热粘合的固化的硅氧烷（7）被热粘合到仅半导体器件的预定主要部分的表面，以便不接触接合线（3），倒装焊料为了保护主要部分的表面，在固化的硅氧烷的热粘结之后提供了部分（8）或光束引线，以及密封层（6）或（10）。固化的硅氧烷（7）优选为膜的形式，并且耐热基材（12）可以层压在固化的硅酮的一面上。不会发生接合线（3）的断裂，焊料部分（8）的破裂和引线的分离，因为只有被固化的硅氧烷（7）涂覆才能保护被保护的部分，而不受保护的部分是没有涂层此外，由于没有由有机硅呼气引起的污染，可以防止发生不良接合和密封树脂的分离。密封层（6）和（10）各自由气密密封或树脂密封构成。

44. 发明申请

WO1980002078A1 COATING MATERIAL FOR OPTICAL COMMUNICATION GLASS FIBER 审中-公开
标题翻译：光通信玻璃纤维涂料
公开(公告)号：WO1980002078A1
公开(公告)日：1980-10-02
申请号：PCT/JP1980000050
申请日：1980-03-28
申请人： TORAY SILICONE CO LTD , SUZUKI T
发明人： TORAY SILICONE CO LTD
IPC分类号： C08L83/04
CPC分类号： C03C25/106 , B29D11/00875
摘要： A coating material for optical communication glass fiber prepared by adding methylhydrogen polysiloxane or methylphenylhydrogen polysiloxane and a platinum catalyst to methylphenyl polysiloxane having both terminal groups vinyl-blocked. This coating material is excellent in applicability to glass fiber for optical communication, shows a rapid hardening rate, and can provide high grade glass fiber for optical communication having a hardened coating excellent in intimately adhering properties, flexibility, and uniformity.

45. 发明申请

WO2005062368A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：WO2005062368A1
公开(公告)日：2005-07-07
申请号：PCT/JP2004/018548
申请日：2004-12-07
申请人： DOW CORNING TORAY SILICONE CO., LTD. , MORITA, Yoshitsugu , MINE, Katsutoshi , NAKANISHI, Junji , ENAMI, Hiroji
发明人： MORITA, Yoshitsugu , MINE, Katsutoshi , NAKANISHI, Junji , ENAMI, Hiroji
IPC分类号： H01L21/56
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L21/566 , H01L23/3128 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , C08L83/00 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/85
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.
摘要翻译：一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压缩成型而密封在固化的硅氧烷体中，其中所述可固化的有机硅组合物包含以下组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。

46. 发明申请

WO2005010122A1 STABILIZING AGENT FOR HYDROALKOXYSILANE, STABILIZATION METHOD, AND STABILIZED HYDROALKOXYSILANE 审中-公开
标题翻译：稳定化剂用于水解硅氧烷，稳定化方法和稳定的水解氧化硅
公开(公告)号：WO2005010122A1
公开(公告)日：2005-02-03
申请号：PCT/JP2004/011322
申请日：2004-07-30
申请人： DOW CORNING TORAY SILICONE CO., LTD. , DOW CORNING CORPORATION , IWAI, Makoto , FERGUSON, Stephen, P.
发明人： IWAI, Makoto , FERGUSON, Stephen, P.
IPC分类号： C09K15/04
CPC分类号： C07F7/025 , C07F7/20
摘要： A stabilizing agent for a hydroalkoxysilane such as triethoxysilane and trimethoxysilane characterized by comprising a carboxylate such as an alkali metal salt or an alkali earth metal salt of a carboxylic acid having 1 to 18 carbon atoms; a method for stabilizing a hydroalkoxysilane by combining it with a carboxylate; and a hydroalkoxysilane stabilized with a carboxylate.
摘要翻译：其特征在于包含羧酸盐如具有1至18个碳原子的羧酸的碱金属盐或碱土金属盐的氢化烷氧基硅烷如三乙氧基硅烷和三甲氧基硅烷的稳定剂; 通过将其与羧酸酯组合来稳定氢烷氧基硅烷的方法; 和用羧酸酯稳定的氢烷氧基硅烷。

47. 发明申请

WO2004007628A1 SILICONE-BASED ADHESIVE SHEET, METHOD OF BONDING A SEMICONDUCTOR CHIP TO A CHIP ATTACHMENT COMPONENT, AND A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：基于硅胶的粘合片，将半导体芯片连接到芯片连接部件的方法和半导体器件
公开(公告)号：WO2004007628A1
公开(公告)日：2004-01-22
申请号：PCT/JP2003/008936
申请日：2003-07-14
申请人： DOW CORNING TORAY SILICONE CO., LTD. , SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
发明人： SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
IPC分类号： C09J7/02
CPC分类号： H01L21/6836 , C08L83/00 , C09J5/06 , C09J7/35 , C09J183/04 , C09J2201/128 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/85207 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01043 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding a semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.
摘要翻译：硅酮类粘合片在一侧具有一层粘土状可固化硅酮组合物，另一侧具有比另一侧的第一组合物层更慢的固化粘土状可固化硅氧烷组合物层，或者一侧的固化的硅氧烷层和另一侧的粘土状可固化硅氧烷组合物层。硅酮类粘合片可以用于将半导体芯片和芯片安装部件接合的方法。可以通过该方法制备半导体器件。

48. 发明申请

WO2004003058A2 METHOD FOR MANUFACTURING ORGANOPOLYSILOXANE RESIN 审中-公开
标题翻译：制备有机硅氧烷树脂的方法
公开(公告)号：WO2004003058A2
公开(公告)日：2004-01-08
申请号：PCT/JP2003/008251
申请日：2003-06-27
申请人： DOW CORNING TORAY SILICONE CO.,LTD. , MANZOUJI, Ryuko , YOSHITAKE, Makoto
发明人： MANZOUJI, Ryuko , YOSHITAKE, Makoto
IPC分类号： C08G77/04
CPC分类号： C08G77/08
摘要： The present invention relates to a method for manufacturing an organopolysiloxane resin, and more particularly relates to a method for manufacturing an organopolysiloxane resin having extremely little precipitate, which allows unreacted raw material and by-products to be reused, and which affords excellent productivity.
摘要翻译：本发明涉及有机聚硅氧烷树脂的制造方法，更具体地说涉及一种极少量沉淀物的有机聚硅氧烷树脂的制造方法，其能够使未反应的原料和副产物再次使用，能够提供优异的生产率。

49. 发明申请

WO2003101862A1 CARTRIDGE FOR MOISTURE-CURABLE SEALANT 审中-公开
标题翻译：水性可固化密封胶盒
公开(公告)号：WO2003101862A1
公开(公告)日：2003-12-11
申请号：PCT/JP2003/006799
申请日：2003-05-29
申请人： DOW CORNING TORAY SILICONE CO.,LTD. , MORIMOTO, Hirotoki , YASUHARA, Katsuyoshi , HORITA, Eiji , TESHIMA, Atsushi
发明人： MORIMOTO, Hirotoki , YASUHARA, Katsuyoshi , HORITA, Eiji , TESHIMA, Atsushi
IPC分类号： B65D83/00
CPC分类号： C08J7/047 , B65D83/0005 , C08G59/18 , C08J2323/02 , C08J2463/00
摘要： A moisture-curable sealant cartridge (1) comprising a cylindrical polyolefin cartridge body (1a) having at one end thereof a polyolefin end member (1b) with an exit port and at the other end an opening sized to receive a slidably engageable extrusion plunger (2), characterized in that an electromagnetic radiation-curable epoxy compound-based composition (6) is coated and cured onto at least that portion of the cartridge body, which in use will encompass moisture-curable sealant held in the cartridge. The cartridge in accordance with the invention provides a moisture-curable sealant cartridge that exhibits an excellent moisture barrier performance and thereby enables the long-term storage of moisture-curable sealant filled therein.
摘要翻译：一种可湿气固化的密封胶盒（1），包括一个圆柱形聚烯烃筒体（1a），其一端具有一个具有出口的聚烯烃端部件（1b），另一端具有一个开口，该开口的尺寸适合于容纳可滑动接合的挤压柱塞其特征在于，电磁辐射固化型环氧化合物类组合物（6）被涂覆并固化在至少该盒体的该部分上，该盒体在使用中将包含保持在该盒中的可湿气固化的密封剂。根据本发明的墨盒提供了具有优异的防潮性能的湿气固化密封剂药筒，从而能够长期储存湿气固化的密封胶。

50. 发明申请

WO2003097745A1 FLAME RETARDANT COMPOSITIONS 审中-公开
标题翻译：阻燃剂组合物
公开(公告)号：WO2003097745A1
公开(公告)日：2003-11-27
申请号：PCT/US2003/015331
申请日：2003-05-15
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY SILICONE CO., LTD. , ROMENESKO, David , SCHMIDT, Randall , TOGASHI, Atsushi , WIEBER, Gary
发明人： ROMENESKO, David , SCHMIDT, Randall , TOGASHI, Atsushi , WIEBER, Gary
IPC分类号： C08L83/04
CPC分类号： C08L101/00 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/44 , C08G77/70 , C08L83/04 , C08L2666/14 , C08L2666/02
摘要： This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300 and having the average molecular formula: (R 3 SiO 1/2 ) a (R 2 SiO 2/2 ) b (RSiO 3/2 ) c (SiO 4 / 2 ) d (RO 1/2 ) e (OH 1/2 ) f wherein each R is hydrogen, an alkyl group, an alkenyl group, or an aryl group having from 6 to 12 carbon atoms, a and b are zero or positive numbers and the value of a+b is greater than zero, c is a positive number, d, e and f are zero or positive numbers with the provisos that the copolymer comprises at least 40 mole percent of RsiO 3/2 units, the copolymer comprises less than 10 mole percent SiO 4/2 units, greater than 30 mole percent of the silicon-bonded R groups are silicon-bonded aryl groups, greater than 0.5 mole percent of the silicon-bonded R groups are silicon-bonded hydrogen atoms, the content of silicon-bonded hydroxyl groups is equal to or less than 2 weight percent, and the content of silicon-bonded alkoxy groups where the alkoxy group is methoxy or ethoxy is equal to or less than 5 weight percent.
摘要翻译：本发明涉及一种阻燃剂组合物，其包含：（a）81至99.99重量％的热塑性树脂，热固性树脂，热塑性树脂共混物或热固树脂共混物，其在燃烧时形成炭，（b）0.01-19重量％具有平均分子式为（R3SiO1 / 2）a（R2SiO2 / 2）b（RSiO3 / 2）c（SiO4 / 2）d（RO1 / 2）e的重均分子量大于300的倍半硅氧烷树脂（OH1 / 2）f，其中每个R是氢，烷基，烯基或具有6至12个碳原子的芳基，a和b是零或正数，a + b的值大于零，c是正数，d，e和f为零或正数，条件是共聚物包含至少40摩尔％的RsiO3 / 2单元，共聚物包含小于10摩尔％的SiO 4/2单元，更大超过30摩尔％的与硅键合的R基团是硅键合的芳基，大于0.5摩尔％的硅键硅键合氢原子的硅键合羟基的含量等于或小于2重量％，烷氧基为甲氧基或乙氧基的硅键合烷氧基的含量等于或等于超过5重量％。

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