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41. 发明申请

US20100034989A1 ALIGNMENT SUBSTRATE, METHOD OF MANUFACTURING THE ALIGNMENT SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE ALIGNMENT SUBSTRATE 审中-公开
标题翻译：对准基板，制造对准基板的方法和具有对准基板的液晶显示装置
公开(公告)号：US20100034989A1
公开(公告)日：2010-02-11
申请号：US12535794
申请日：2009-08-05
申请人： Nak-Cho CHOI , Hyun-Ku AHN , Bong-Sung SEO , Young-Gu KIM , Min-Sik JUNG , Tae-Sung JUNG , Byoung-Hun SUNG , Sung-Yi KIM
发明人： Nak-Cho CHOI , Hyun-Ku AHN , Bong-Sung SEO , Young-Gu KIM , Min-Sik JUNG , Tae-Sung JUNG , Byoung-Hun SUNG , Sung-Yi KIM
IPC分类号： C09K19/00 , B05D3/06
CPC分类号： G02F1/133788 , G02F1/133711 , G02F1/133753 , G02F2001/133757 , Y10T428/1023
摘要： An alignment substrate includes a substrate and an alignment layer. The substrate includes a plurality of unit pixel areas. Each of the unit pixel areas includes a plurality of sub-pixel areas arranged in a matrix configuration. The alignment layer is on the substrate and has polymer chains protruding from a surface of the alignment layer. The alignment layer has a plurality of alignment vectors in which the polymer chains are pretilted according to the sub-pixel areas. The alignment vectors corresponding to adjacent sub-pixel areas point in different directions from each other.
摘要翻译：对准基板包括基板和取向层。基板包括多个单位像素区域。每个单位像素区域包括以矩阵配置排列的多个子像素区域。取向层位于基板上并且具有从取向层的表面突出的聚合物链。取向层具有多个对准载体，其中根据亚像素区域预聚合聚合物链。对应于相邻子像素区域的对齐矢量彼此指向不同的方向。

42. 发明申请

US20100032706A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
标题翻译：用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20100032706A1
公开(公告)日：2010-02-11
申请号：US12346329
申请日：2008-12-30
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/38 , H01L33/44 , H01L33/508 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2924/00014
摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

43. 发明申请

US20090305105A1 Fuel cell and method for manufacturing the same 审中-公开
标题翻译：燃料电池及其制造方法
公开(公告)号：US20090305105A1
公开(公告)日：2009-12-10
申请号：US12453313
申请日：2009-05-06
申请人： Won-Kyu Jeung , Sung Yi , Jae-Hyuk Jang , Jae-Hyoung Gil
发明人： Won-Kyu Jeung , Sung Yi , Jae-Hyuk Jang , Jae-Hyoung Gil
IPC分类号： H01M8/10 , H01M4/04
CPC分类号： H01M8/1097 , H01M8/0228 , H01M8/028 , Y02P70/56 , Y10T29/49108
摘要： Disclosed are a fuel cell and a method for manufacturing the fuel cell. The fuel cell can include forming a channel on one surface of a first wafer and one surface of a second wafer, respectively; stacking a membrane electrode assembly on one surface of the first wafer; and coupling the second wafer to the first wafer to allow one surface of the second wafer to cover the membrane electrode assembly, to thereby manufacture the fuel cell in a small size at low cost, precisely form the membrane electrode assembly, and prevent a damage of the membrane electrode assembly.
摘要翻译：公开了燃料电池和制造燃料电池的方法。燃料电池可以包括分别在第一晶片的一个表面和第二晶片的一个表面上形成通道; 在第一晶片的一个表面上堆叠膜电极组件; 以及将所述第二晶片与所述第一晶片连接以允许所述第二晶片的一个表面覆盖所述膜电极组件，由此以低成本制造小尺寸的燃料电池，精确地形成所述膜电极组件，并且防止膜电极组件。

44. 发明申请

US20090178840A1 PCB AND MANUFACTURING METHOD THEREOF 有权
标题翻译： PCB及其制造方法
公开(公告)号：US20090178840A1
公开(公告)日：2009-07-16
申请号：US12351333
申请日：2009-01-09
申请人： Woon-Chun Kim , Sung Yi
发明人： Woon-Chun Kim , Sung Yi
IPC分类号： H05K1/11 , H05K3/02 , H05K3/06
CPC分类号： H05K3/387 , H05K3/0055 , H05K3/108 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0358 , H05K2203/1152 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.
摘要翻译：公开了印刷电路板及其制造方法。根据本发明的实施例的方法包括：提供其上依次层叠有第一绝缘层，第一电路图案，第二绝缘层和树脂层的基板; 镗孔穿透基底的通孔; 通过去污工艺在树脂层上形成粗糙度; 形成通过所述通孔在层之间形成电连接的通孔; 并在其上形成粗糙度的树脂层上形成第二电路图案。

45. 发明申请

US20090124075A1 Method of manufacturing a wafer level package 失效
标题翻译：晶圆级封装的制造方法
公开(公告)号：US20090124075A1
公开(公告)日：2009-05-14
申请号：US12149014
申请日：2008-04-24
申请人： Joon-Seok Kang , Sung Yi , Jong-Hwan Baek , Young-Do Kweon
发明人： Joon-Seok Kang , Sung Yi , Jong-Hwan Baek , Young-Do Kweon
IPC分类号： H01L21/768
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05611 , H01L2224/11334 , H01L2224/1147 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A method of manufacturing a wafer level package is disclosed, which may include: coating an insulation layer over one side of a semiconductor chip, on one side of which an electrode pad is formed, such that the electrode pad is open; forming a seed layer by depositing a conductive metal onto one side of the semiconductor chip; forming a rewiring pattern that is electrically connected with the electrode pad, by selective electroplating with the seed layer as an electrode; forming a conductive pillar that is electrically connected with the rewiring pattern, by selective electroplating with the seed layer as an electrode; and removing portions of the seed layer open to the exterior. By forming the rewiring pattern and the metal pillar using one seed layer, the manufacturing process can be simplified, whereby defects during the manufacturing process can be reduced and the reliability of the products can be improved.
摘要翻译：公开了一种制造晶片级封装的方法，其可以包括：在半导体芯片的一侧上涂覆绝缘层，其一面形成电极焊盘，使得电极焊盘打开; 通过在所述半导体芯片的一侧上沉积导电金属形成晶种层; 形成与电极焊盘电连接的重新布线图案，通过选择性地电镀种子层作为电极; 形成与所述重新布线图案电连接的导电柱，通过所述种子层作为电极的选择性电镀; 并将种子层的部分去除到外部。通过使用一个种子层形成再布线图案和金属柱，可以简化制造工艺，从而可以减少制造过程中的缺陷，并且可以提高产品的可靠性。

46. 发明申请

US20090004995A1 CASE SUBSTRATE 审中-公开
标题翻译：案例基础
公开(公告)号：US20090004995A1
公开(公告)日：2009-01-01
申请号：US11856763
申请日：2007-09-18
申请人： Hun-Jen CHEN , Sung-Yi HO , Yi-Ru LIU
发明人： Hun-Jen CHEN , Sung-Yi HO , Yi-Ru LIU
IPC分类号： H04B1/08
CPC分类号： G08C23/04
摘要： A case substrate including a base material and a coating layer coated on the base material. The coating layer has a hollow-out opening corresponding to the position of an infrared receiver, such that infrared rays can pass through the base material from the hollow-out opening and thus being received by the receiver.
摘要翻译：一种壳体基板，包括基材和涂覆在基材上的涂层。涂层具有对应于红外线接收器的位置的中空开口，使得红外线可以从中空开口穿过基底材料，并且由接收器接收。

47. 发明申请

US20070251548A1 Conveyor type wet-processing apparatus and treatment of substrate 审中-公开
标题翻译：输送式湿式处理装置及基板处理
公开(公告)号：US20070251548A1
公开(公告)日：2007-11-01
申请号：US11402587
申请日：2006-04-11
申请人： Tehsin Lee , Chia-Wei Lin , De-Bao Chan , Sung-Yi Chou , Benny Yang
发明人： Tehsin Lee , Chia-Wei Lin , De-Bao Chan , Sung-Yi Chou , Benny Yang
IPC分类号： B08B3/00 , B08B1/02 , B08B7/00
CPC分类号： B08B7/04 , H01L21/67028 , H01L21/67207 , H01L21/67236
摘要： A wet-processing apparatus for processing substrates is provided. The wet-processing apparatus for processing substrates includes a conveyor type cleaning system and a spinner type wet-processing unit connected to the conveyor type cleaning system. In an embodiment of the present invention, the wet-processing apparatus further includes a cassette station for storing the substrates and a robot installed in the cassette station, wherein the substrate is delivered from the cassette station to the conveyor type cleaning system by the robot. The wet-processing apparatus mentioned above has excellent process uniformity, low consumption of the chemical, good cleaning ability, and low substrate broken frequency.
摘要翻译：提供了一种用于处理衬底的湿法处理设备。用于处理基板的湿式处理装置包括连接到输送机型清洁系统的输送机型清洁系统和旋转式湿式处理单元。在本发明的一个实施例中，湿式处理设备还包括一个用于存储基板的盒式磁带站和安装在盒式磁带站中的机器人，其中基板由机器人从盒式磁带站传送到传送式清洁系统。上述湿式处理装置具有优异的加工均匀性，化学品消耗低，清洗能力好，基体破碎频率低。

48. 外观设计

USD542752S1 Media player 有权
公开(公告)号：USD542752S1
公开(公告)日：2007-05-15
申请号：US29243462
申请日：2005-11-23
申请人： Li-Ni Liang , He-Li Wang , Sung-Yi Kao
设计人： Li-Ni Liang , He-Li Wang , Sung-Yi Kao

49. 发明申请

US20050266662A1 Method of growing semiconductor nanowires with uniform cross-sectional area using chemical vapor deposition 失效
标题翻译：使用化学气相沉积生长具有均匀横截面积的半导体纳米线的方法
公开(公告)号：US20050266662A1
公开(公告)日：2005-12-01
申请号：US10857191
申请日：2004-05-28
申请人： Sung Yi
发明人： Sung Yi
IPC分类号： C30B11/12 , C30B29/06 , C30B29/42 , C30B29/60 , H01L21/20 , H01L21/205 , H01L21/36
CPC分类号： B82Y30/00 , B82Y10/00 , C30B11/12 , C30B29/06 , C30B29/42 , C30B29/605 , H01L21/0237 , H01L21/02488 , H01L21/02543 , H01L21/02546 , H01L21/02603 , H01L21/0262 , H01L21/02645 , H01L21/02653 , Y10S977/762 , Y10S977/818
摘要： A nanowire of a semiconductor material and having a uniform cross-sectional area along its length is grown using a chemical vapor deposition process. In the method, a substrate is provided, a catalyst nanoparticle is deposited on the substrate, a gaseous precursor mixture comprising a constituent element of the semiconductor material is passed over the substrate, and adatoms of the constituent element are removed from a lateral surface of the nanowire during the passing of the precursor mixture. Removing the adatoms of the constituent element before such adatoms are incorporated into the nanowire prevents such adatoms from accumulating on the lateral surface of the nanowire and allows the nanowire to grow with a uniform cross-sectional area along its length.
摘要翻译：使用化学气相沉积工艺生长半导体材料的纳米线并沿其长度具有均匀的横截面积。在该方法中，提供衬底，催化剂纳米颗粒沉积在衬底上，包含半导体材料的构成元素的气态前体混合物通过衬底，并且构成元素的原子从侧面纳米线在前体混合物通过期间。在将这些吸附原子并入纳米线之前去除构成元素的吸附原子可以防止这种吸附原子积聚在纳米线的侧表面上，并允许纳米线沿着其长度以均匀的横截面积生长。

50. 发明申请

US20050157465A1 Method for manufacturing organic light-emitting panel 审中-公开
标题翻译：制造有机发光面板的方法
公开(公告)号：US20050157465A1
公开(公告)日：2005-07-21
申请号：US11069873
申请日：2005-03-02
申请人： Chin-long Wu , Sung-Yi Pai , Tien-wang Huang
发明人： Chin-long Wu , Sung-Yi Pai , Tien-wang Huang
IPC分类号： H01L51/52 , H05B33/22 , G06F1/20 , H05K5/00 , H05K7/20
CPC分类号： H01L51/529 , H05B33/22
摘要： An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.
摘要翻译：有机发光面板包括后板，散热器和前板。在这种情况下，后板具有与第一表面相对的第一表面和第二表面。散热器覆盖第一表面并延伸到第二表面。覆盖在后板的第一表面上的散热器形成有多个孔。前板设置在第一个表面和散热器上。本发明还公开了一种面板的制造方法。该方法包括以下步骤：将后板安装到散热器中，使得散热器覆盖在后板的第一表面上并延伸到与后板的第一表面相对的第二表面; 并将前板粘贴到后板的第一表面和散热器上。

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