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    • 46. 发明专利
    • FR2086509A1
    • 1971-12-31
    • FR7115565
    • 1971-04-30
    • QUANTRONIX CORP
    • B23K26/08B23K26/14B23K26/16B23K26/18H01S3/00H01L7/00
    • 1305527 Scribing by laser beams QUANTRONIX CORP 19 April 1971 [30 April 1970] 10008/71 Heading B5E [Also in Divisions B3 and H1] Apparatus for scribing an object, such as a semi-conductor wafer 6, comprises means 7 for holding the object, a device 3 for producing a Q-switched pulsed laser beam 4 of sufficient energy to vaporize a portion of the object, means 5 for focusing the laser beam, drive means for effecting relative movement between the holding means and the focusing means to cause the laser beam to make a series of overlapping holes and thereby inscribe a continuous line on the surface of the object, and means for preventing globules of material ejected from the object by the laser beam from falling back upon the surface of the object or depositing on the focusing means. The object 6 may be a wafer on which are a plurality of semi-conductor devices arranged in a grid pattern and which are to be separated into individual dies. The wafer is mounted on a vacuum chuck 7 which can be rotated by a knob 8 to align the dies with the laser beam and can be moved by X and Y motors relative to the beam to effect the scribing between the dies. The beam 4 is reflected by prisms (62, 64, Fig. 3, not shown) from the laser device, which may be Neodymium doped Yttrium-Aluminium-Gamet solid state laser, through a focusing device 5 on to the wafer, the focusing device being part of a binocular microscope 2. The means for preventing molten globules of the material of the wafer falling back on the wafer and also from depositing on the surface of the focusing device 5 consists of a first shroud 71, Fig. 4, which surrounds the device 5 and tapers at its lower end to an aperture 72 through which the laser beam passes, the interior of the shroud being connected by inlets 73 to atmosphere. A second shroud 75 surrounds the first and has a larger aperture 76 than that of the first and is connected by conduits 77 to a vacuum source so that globules produced by the laser beam are entrained in the flow of air from shroud 71 and carried through annular passage 78 between the shrouds and through the conduits 77. In another embodiment, the globules are blown by a jet from a nozzle towards a pipe connected to a vacuum source. In a further embodiment, a plastic film 91, Fig. 6, which is transparent to the laser beam 4, is fed by rollers 92, 93, 94 over the surface of the wafer, the globules adhering to the film. The laser is operative in pulses so that the scribed line consists of a number of overlapping holes and the beam may be elongated in the direction of the line. The wavelength of the Nd:YAG laser is 1À06 microns and produces a focused spot of 1 mil. The laser is controlled by a Q-switch to produce pulses at a frequency of 2-5 KHZ.